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http://dx.doi.org/10.6117/kmeps.2019.26.4.163

Effect of Sn Decorated MWCNT Particle on Microstructures and Bonding Strengths of the OSP Surface Finished FR-4 Components Assembled with Sn58%Bi Composite Solder Joints  

Park, Hyun-Joon (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
Lee, Choong-Jae (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
Min, Kyung Deuk (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
Jung, Seung-Boo (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.26, no.4, 2019 , pp. 163-169 More about this Journal
Abstract
Sn-Pb solder alloys in electronics rapidly has been replaced to Pb free solder alloys because of various environmental regulations such as restriction of hazardous substances directive (RoHS), European Union waste electrical, waste electrical and electronic equipment (WEEE), registration evaluation authorization and of chemicals (REACH) etc. Because Sn58%Bi (in wt.%) solder alloy has low melting point and higher mechanical properties than that of Sn-Pb solder, it has been studied to manufacture electronic components. However, the reliability of Sn58%Bi solder could be lowered because of the brittleness of Bi element included in the solder alloy. Therefore, we observed the microstructures of Sn58%Bi composite solders with various contents of Sn-decorated multiwalled carbon nanotube (Sn-MWCNT) particles and evaluated bonding strength of the FR-4 components assembled with Sn58%Bi composite solder. Also, microstructures and bonding strengths of the Sn58%Bi composite solder joints were evaluated with the number of reflows from 1 to 7 times, respectively. Bonding strengths and fracture energies of the Sn58%Bi composite solder joints were measured by die shear test. Microstructures and fracture modes were observed with scanning electron microscope (SEM). Microstructures in the Sn58%Bi composite solder joints were finer than that of only Sn58%Bi solder joint. Bonding strength and fracture energy of Sn58%Bi composite solder including 0.1 wt.% of Sn-decorated MWCNT particles increased up to 20.4% and 15.4% at 5 times in reflow, respectively.
Keywords
Sn58%Bi composite solder; multiwalled carbon nanotube (MWCNT); Microstructure; Intermetallic compound (IMC); bonding strength; fracture energy;
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Times Cited By KSCI : 2  (Citation Analysis)
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