• Journal of Welding and Joining
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• v.26 no.3
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• pp.30-36
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• 2008

A flip-chip bonding system using IR laser with a wavelength of 1064 nm was developed and associated process parameters were analyzed using Taguchi methods. An infrared laser beam is designed to transmit through a silicon chip and used for transferring laser energy directly to micro-bumps. This process has several advantages: minimized heat affect zone, fast bonding and good reliability in the microchip bonding interface. Approximately 50 % of the irradiated energy can be directly used for bonding the solder bumps with a few seconds of bonding time. A flip-chip with 120 solder bumps was used for this experiment and the composition of the solder bump was Sn3.0Ag0.5Cu. The main processing parameters for IR laser flip-chip bonding were laser power, scanning speed, a spot size and UBM thickness. Taguchi methods were applied for optimizing these four main processing parameters. The optimized bump shape and its shear force were modeled and the experimental results were compared with them. The analysis results indicate that the bump shape and its shear force are dominantly influenced by laser power and scanning speed over a laser spot size. In addition, various effects of processing parameters for IR laser flip-chip bonding are presented and discussed.

• Transactions of Materials Processing
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• v.22 no.8
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• pp.463-469
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• 2013

In the previous work, a new forging process design, which included incremental upsetting, diffusion bonding and cogging, was suggested as a method to manufacture 1.9wt%C ultrahigh carbon workrolls. The previous study showed that incremental upsetting and diffusion bonding are effective in closing voids and healing of the closed void. In addition, compression tests of the 1.9wt%C ultrahigh carbon steel revealed that new microvoids form within the blocky cementite at temperatures of less than $900^{\circ}C$ and that local melting can occur at temperatures over $1120^{\circ}C$. Thus, the forging temperature should be controlled between 900 and $1120^{\circ}C$. Based on these results, incremental upsetting and diffusion bonding were used to check whether they are effective in closing and healing voids in a 1.9wt%C ultrahigh carbon steel. The incremental upsetting and diffusion bonding were performed using sub-sized specimens of 1.9wt%C ultrahigh carbon steel. The specimen was deformed only in the radial direction during the incremental upsetting until the reduction ratio reached about 45~50%. After deformation the specimens were kept at $1100^{\circ}C$ for the 1 hour in order to obtain a high bonding strength for the closed void. Finally, microstructural observations and tensile tests were conducted to investigate void closure behavior and bonding strength.

• Journal of the Korea Concrete Institute
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• v.13 no.3
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• pp.221-227
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• 2001

Both strength and stiffness of RC structures strengthened by a steel plate greatly increase and however, their ductility might not be sufficient because premature failures usually occur at the adhesive-concrete interface. In this study, Mohr-Coulomb criterion was adopted to examine the bonding failure mechanism, and the diagonal shear bonding test, the direct shear bonding test, and the flexural test on RC beams strengthened by a steel plate were carried out to measure the bonding properties. It is found from the experimental and numerical results that the cohesive strengths of epoxy-concrete interfaces are ranging from 50 kgf/㎠ to 70 kgf/㎠ when the friction angle is 45°. Bonding failure loads can be predicted by applying the bonding properties to the structural analysis of RC beams strengthened by steel plate. By considering them in the design of strengthened beams, the premature failure would be effectively prevented.

• Journal of Welding and Joining
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• v.27 no.5
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• pp.68-73
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• 2009

The bar horn is designed to increase uniformity of the displacement on the output face through simulation and experiments. Three-dimensional modal analysis is conducted using the finite element method to calculate the vibration mode and displacement on the output face, and the design of experiment (DOE) technique is employed to determine the optimum dimensions of the groove and slot so that the high amplitude uniformity of the bar horn is produced. Displacement of the bar horn was measured using the Laser Doppler Vibrometer (LDV), and the experimental results show good agreements with the predicted results. High uniformity of the bar horn is achieved with the dimensions of the groove and slot determined using the design equations.

• Journal of the Korea Concrete Institute
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• v.11 no.3
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• pp.13-21
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• 1999

Recently, many strengthening methods are developed to repair damaged structures, especially, steel plate or carbon fiber sheet bonding methods are widely used. For the bonding methods, the strengthening materials are bonded when the original structure is under loading, with causes the difference of initial stresses between original member and bonded material. However, current design method or theory, which mostly depends on ultimately strength design, cannot account the difference of initial stresses between members, and it disregards the reduction of nominal strength. In this study, a new strengthening design theory and program which can account the difference of initial stresses are developed, and applied to the case when a structure in service is repaired. In order to verify the validity of the theory and the program, a test result is referred and compare with the results and it is showed that the calculated values are almost same as the referred data and finally proved that the program is reliable. The results showed that the amount of strengthening material depends on the status of damages of structure, and the nominal strength is reduced depending on the degree of damages.

• Journal of the Korea Concrete Institute
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• v.11 no.3
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• pp.35-45
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• 1999

Recently, many strengthening methods are developed to repair damaged structures, especially, steel plate or carbon fiber sheet bonding methods are widely used. For the bonding methods, the strengthening materials are bonded when the original structure is under loading, which causes difference of initial stresses between original member and bonded material. However, current design method or theory, which mostly depends on ultimately strength design, cannot account the difference of initial stresses between members, and it disregards the reduction of nominal strength. In this study, a new strengthening design theory and program which can account the difference of initial stresses are developed, and applied to the case when a structure in service is repaired. In order to verify the validity of the theory and the program, a test result is referred and compared with the results and it is showed that the calculated values are almost same as the referred data and finally proved that the program is reliable. The results showed that the amount of strengthening material depends on the status of damages of structure, and the nominal strength is reduced depending on the degree of damages.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.30 no.5
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• pp.208-213
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• 2020

In this research, design optimization was investigated using the finite element analysis and the optimal design technique based on the PQRSM algorithm to minimize the thermal deformation of IGZO oxide in a target module in which IGZO oxide and a copper backplate are bonded to each other. In order to apply the optimal design technique in conjunction with finite element analysis, the x-coordinate of lower supports and upper fixed boards used as design valuables, and the optimal design was performed to minimize the thermal displacement of IGZO materials as the objective function. After the optimization process, the thermal displacement within IGZO oxide could be reduced to 42 % comparing with the initial model. The result is thought to be useful in the industry as it can reduce the thermal deformation of target oxides materials only by changing the position of the subsidiary materials during the bonding process.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.10
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• pp.865-871
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• 2014

Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a $50{\mu}m$ of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.3
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• pp.991-996
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• 2013

In this paper, the ultrasonic horn having the natural frequency with 60 [kHz] for the dissimilar material bonding of the glass and solder tried to be designed. The ultrasonic horn was designed through the relational formula including the aspect ratio of the input terminal and output terminal, length of the ultrasonic horn. The modal analysis was performed for the propriety analysis of the designed horn. The parameters and response was set through the basic experiment. The dissimilar material bonding strength analysis using the ultrasonic transducer was done. The optimal process parameters having maximum bonding strength was derived.

• ETRI Journal
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• v.41 no.3
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• pp.396-407
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• 2019

Laser-assisted bonding (LAB) is an advanced technology in which a homogenized laser beam is selectively applied to a chip. Previous researches have demonstrated the feasibility of using a single-tier LAB process for 3D through-silicon via (TSV) integration with nonconductive paste (NCP), where each TSV die is bonded one at a time. A collective LAB process, where several TSV dies can be stacked simultaneously, is developed to improve the productivity while maintaining the reliability of the solder joints. A single-tier LAB process for 3D TSV integration with NCP is introduced for two different values of laser power, namely 100 W and 150 W. For the 100 W case, a maximum of three dies can be collectively stacked, whereas for the 150 W case, a total of six tiers can be simultaneously bonded. For the 100 W case, the intermetallic compound microstructure is a typical Cu-Sn phase system, whereas for the 150 W case, it is asymmetrical owing to a thermogradient across the solder joint. The collective LAB process can be realized through proper design of the bonding parameters such as laser power, time, and number of stacked dies.