Journal of Welding and Joining

  • 제26권3호
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  • Pages.30-36
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  • 2008
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  • 2466-2232(pISSN)
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  • 2466-2100(eISSN)
대한용접접합학회 (The Korean Welding and Joining Society)
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다구찌법을 이용한 IR 레이저 Flip-chip 접합공정 최적화 연구

A Study on the Optimization of IR Laser Flip-chip Bonding Process Using Taguchi Methods

  • 송춘삼 (서울테크노파크) ;
  • 지현식 (서울산업대학교 NID융합기술대학원) ;
  • 김주한 (서울산업대학교 기계공학과) ;
  • 김종형 (서울산업대학교 기계설계자동화공학부) ;
  • 안효석 (서울산업대학교 NID융합기술대학원)
  • Song, Chun-Sam (Seoul Technopark) ;
  • Ji, Hyun-Sik (Graduate School of NID Fusion Technology, Seoul National University of Technology) ;
  • Kim, Joo-Han (Department of Mechanical Engineering, Seoul National University of Technology) ;
  • Kim, Jong-Hyeong (Department of Mechanical Design and Automation Engineering, Seoul National University of Technology) ;
  • Ahn, Hyo-Sok (Graduate School of NID Fusion Technology, Seoul National University of Technology)
  • 발행 : 2008.06.30
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초록

A flip-chip bonding system using IR laser with a wavelength of 1064 nm was developed and associated process parameters were analyzed using Taguchi methods. An infrared laser beam is designed to transmit through a silicon chip and used for transferring laser energy directly to micro-bumps. This process has several advantages: minimized heat affect zone, fast bonding and good reliability in the microchip bonding interface. Approximately 50 % of the irradiated energy can be directly used for bonding the solder bumps with a few seconds of bonding time. A flip-chip with 120 solder bumps was used for this experiment and the composition of the solder bump was Sn3.0Ag0.5Cu. The main processing parameters for IR laser flip-chip bonding were laser power, scanning speed, a spot size and UBM thickness. Taguchi methods were applied for optimizing these four main processing parameters. The optimized bump shape and its shear force were modeled and the experimental results were compared with them. The analysis results indicate that the bump shape and its shear force are dominantly influenced by laser power and scanning speed over a laser spot size. In addition, various effects of processing parameters for IR laser flip-chip bonding are presented and discussed.

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참고문헌

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