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http://dx.doi.org/10.5762/KAIS.2013.14.3.991

The optimization of processing condition of dissimilar material bonding using the 60 kHz ultrasonic transducer  

Lee, DongWook (Division of Mechanical Engineering, Kongju National University)
Jeon, EuySick (Department of Mechanical & Automotive Engineering, Kongju National University)
Publication Information
Journal of the Korea Academia-Industrial cooperation Society / v.14, no.3, 2013 , pp. 991-996 More about this Journal
Abstract
In this paper, the ultrasonic horn having the natural frequency with 60 [kHz] for the dissimilar material bonding of the glass and solder tried to be designed. The ultrasonic horn was designed through the relational formula including the aspect ratio of the input terminal and output terminal, length of the ultrasonic horn. The modal analysis was performed for the propriety analysis of the designed horn. The parameters and response was set through the basic experiment. The dissimilar material bonding strength analysis using the ultrasonic transducer was done. The optimal process parameters having maximum bonding strength was derived.
Keywords
Horn design; Modal analysis; Ultrasonic bonding; DOE;
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Times Cited By KSCI : 2  (Citation Analysis)
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