• 제목/요약/키워드: anti-bonding

검색결과 52건 처리시간 0.032초

Bonding And Anti-bonding Nature of Magnetic Semiconductor Thin Film of Fe(TCNQ:tetracyanoquinodimethane)

  • Jo, Junhyeon;Jin, Mi-jin;Park, Jungmin;Modepalli, Vijayakumar;Yoo, Jung-Woo
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.294-294
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    • 2014
  • Developing magnetic thin films with desirable physical properties is a key step to promote research in spintronics. Organic-based magnetic material is a relatively new kind of materials which has magnetic properties in a molecular and microscopic level. These materials have been constructed by the coordination between 3d transition metal and organic materials producing long-range magnetic orders with a relatively high transition temperature. However, these materials were mostly synthesized as a form of powder, which is difficult to study for their physical properties as well as apply for electronic/spintronic devices. In this study, we have employed physical vapor deposition (PVD) to develop a new organic-based hybrid magnetic film that is achieved by the coordination of Fe and tetracyanoquinodimethane (TCNQ). The IR spectra of the grown film show modified CN vibration modes in TCNQ, which suggest a strong bonding between Fe and TCNQ. The thin film has both ferromagnetic and semiconducting behaviors, which is suitable for molecular spintronic applications. The high resolution photoemission (HRPES) spectra also show shift of 1s peak point of nitrogen and the carbon 1s peaks display traces of charge transfer from Fe to TCNQ as well as shake-up features, which suggest strong bonding and anti-bonding nature of coordination between Fe and TCNQ.

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AlGaAs합금의 Al 도핑농도에 대한 효과 (Effect on Al Concentration of AlGaAs Ternary Alloy)

  • 강병섭
    • 반도체디스플레이기술학회지
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    • 제20권4호
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    • pp.125-129
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    • 2021
  • We investigated the electronic property and atomic structure for chalcopyrite (CH) AlxGa1-xAs semiconductor by using first-principles FPLMTO method. The CH-AlxGa1-xAs exhibits a p-type semiconductor with a direct band-gap. For low Al concentration unoccupied hole-carriers are induced, but for high Al concentration it is formed a localized bonding or anti-bonding state below Fermi level. The hybridization of Al(3s)-Ga(4s, or 4p) is larger than that of Al(3s)-As(4s, or 4p). And the Al film on As-terminated surface, Al/AsGa(001), is more energetically favorable one than that on Ga-terminated (001) surface. Consequently, the band-gap of CH-AlxGa1-xAs system increases exponentially with increasing Al concentration. The change of lattice parameter is shown two different configurations with increasing Al concentration. The calculated lattice parameters for CH-AlxGa1-xAs system are compared to the experimental ones of zinc-blend GaAs and AlAs.

항암성물질의 개발을 위한 cis-Diamminedichloroplatinum (cis-DDP) 류와 DNA base인 1-Methylcytosine의 Interaction에 관한 분자궤도함수론적 연구 (The MO Study about Interaction of cis-Diamminedichloroplatinum (cis-DDP) Complexes with DNA base, 1-Methylcytosine, for Development of Anti-Tumor Drugs)

  • 김의락;김상해
    • 대한화학회지
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    • 제34권4호
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    • pp.331-339
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    • 1990
  • cis-diamminedichloroplatinum (II)에서 아민리간드가 변화할 때, 항암성과 백금원자의 전자구조 사이의 관계를 연구하였고, 또 이러한 착물과 DNA base인 1-methylcytosine의 상호작용에 대한 메카니즘을 알기 위해서 백금(II)착물들을 분자궤도함수론적으로 연구하였다. 그 결과, 백금착물에서 중심금속의 atomic charge가 항암성에 영향을 미치고 있음을 알았다. 또한 백금착물과 1-methylcytosine의 결합은 리간드에서 금속원자로 전하이동을 하였고, 이 때 Pt(II)의 6p-orbital이 중요한 하고 있음을 발견한다. Pt-N3결합성은 $\alpha$$\pi$ 성분을 포함하고 있으며, 실험한 값과 비교할 때 비교할 때 항암성이 큰 백금착물일수록 Pt-N3 결합이 강하게 형성하고 있었다.

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수중 불분리성 그라우트 개발 기술 동향 (Anti-washout Grouts for Underwater Sealing of Karst Cavities and Construction Research Tendencies)

  • ;김정규;김종관;유지윤;양형식
    • 화약ㆍ발파
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    • 제38권4호
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    • pp.46-52
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    • 2020
  • 수중 불분리성 그라우트는 수중 현장에 광범위하게 사용된다. 그러나 접합강도, 펌프 능력 및 강도 손실과 같은 주요 문제점이 여전히 존재한다. 본 연구에서는 자기충전, 비파괴 방지 그라우트 연구에 기초하여 이 분야의 현황을 파악하기 위해 수중 시공 및 카르스트 공동 실링에 관한 연구 동향에 대해 검토하였다. 그라우트를 수중에 사용할 경우, 공기 중에서 시공하는 것에 비해 강도와 접합강도가 손실될 것이다. 이를 방지하기 위해 고점도의 그라우트를 통해 카르스트 공동을 실링하고 있지만, 대심도에서는 그라우트의 펌핑 능력에 심각한 문제를 발생시키므로 기존의 수중 불분리성 그라우트와 콘크리트는 대심도 환경에 적합하지 않음을 의미한다.

플립칩 접합용 초음파 혼의 목표 주파수와 모드를 고려한 2차원 및 3차원 위상최적화 설계 (2D and 3D Topology Optimization with Target Frequency and Modes of Ultrasonic Horn for Flip-chip Bonding)

  • 하창용;이수일
    • 한국소음진동공학회논문집
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    • 제23권1호
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    • pp.84-91
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    • 2013
  • Ultrasonic flip-chip bonding needs a precise bonding tool which delivers ultrasonic energy into chip bumps effectively to use the selected resonance mode and frequency of the horn structure. The bonding tool is excited at the resonance frequency and the input and output ports should locate at the anti-nodal points of the resonance mode. In this study, we propose new design method with topology optimization for ultrasonic bonding tools. The SIMP(solid isotropic material with penalization) method is used to formulate topology optimization and OC(optimal criteria) algorithm is adopted for the update scheme. MAC(modal assurance criterion) tracking is used for the target frequency and mode. We fabricate two prototypes of ultrasonic tools which are based on 3D optimization models after reviewing 2D and 3D topology optimization results. The prototypes are satisfied with the ultrasonic frequency and vibration amplitude as the ultrasonic bonding tools.

도재 소부용 비귀금속 합금과 티타늄에 적용한 Gold Bonding Agent의 전자현미경적 평가 (SEM/EDS Evaluation of Gold Bonding Agent Applied on Non-precious Alloys and Cast CP-Ti)

  • 이정환;안재석
    • 치위생과학회지
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    • 제9권2호
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    • pp.153-160
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    • 2009
  • 본 연구는 금속-도재 수복물 제작에 사용되는 Ni-Cr alloy와 Co-Cr alloy, 그리고 티타늄에 gold bonding agent를 도포하여 Au coating 층을 형성하였다. 각 시편의 절단면을 전자현미경으로 Au coating 층과 porcelain bonder, 그리고 불투명 도재간의 결합을 관찰하였고, 각 계면의 상태를 SEM/EDS 방법으로 조사하였다. 실험에서 사용된 재료와 방법의 범위 내에서 다음과 같은 결론을 얻었다. 1. Gold bonding agent를 사용하여 형성한 Au coating 층은 미세다공성을 가진 구조로 판단되었다. 2. Au coating 층과 porcelain bonder 그리고 불투명 도재간의 결합은 잘 일어나 보였다. 3. Au coating 층은 도재 소성과정에서 발생하는 산화층의 확산을 제한하는 것으로 관찰되었다.

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Epigallocatechin 3-gallate Binds to Human Salivary α-Amylase with Complex Hydrogen Bonding Interactions

  • Lee, Jee-Young;Jeong, Ki-Woong;Kim, Yang-Mee
    • Bulletin of the Korean Chemical Society
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    • 제32권7호
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    • pp.2222-2226
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    • 2011
  • Amylase is a digestive enzyme that catalyses the starch into sugar. It has been reported that the green tea flavonoid (or polyphenols) (-)-epigallocatechin 3-gallate (EGCG) inhibits human salivary ${\alpha}$-amylase (HSA) and induced anti-nutritional effects. In this study, we performed docking study for seven EGCG-like flavonoids and HSA to understand the interaction mechanism of HSA and EGCG and suggest new possible flavonoid inhibitors of HSA. As a result, EGCG and (-)-epicatechin gallate (ECG) bind to HSA with complex hydrogen bonding interactions. These hydrogen bonding interactions are important for inhibitory activity of EGCG against HSA. We suggested that ECG can be a potent inhibitor of HSA. This study will be helpful to understand the mechanism of inhibition of HSA by EGCG and give insights to develop therapeutic strategies against diabetes.

저온 Cu/Ag-Ag/Cu 본딩에서의 Ag 나노막 효과 (Effect of Ag Nanolayer in Low Temperature Cu/Ag-Ag/Cu Bonding)

  • 김윤호;박승민;김사라은경
    • 마이크로전자및패키징학회지
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    • 제28권2호
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    • pp.59-64
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    • 2021
  • 차세대 반도체 기술은 이종소자 집적화(heterogeneous integration)를 이용한 시스템-인-패키징(system-inpackage, SIP) 기술로 발전하고 있고, 저온 Cu 본딩은 SIP 구조의 성능 향상과 미세 피치 배선을 위해서 매우 중요한 기술이라 하겠다. 본 연구에서는 porous한 Ag 나노막을 이용하여 Cu 표면의 산화 방지 효과와 저온 Cu 본딩의 가능성을 조사하였다. 100℃에서 200℃의 저온 영역에서 Ag가 Cu로 확산되는 것보다 Cu가 Ag로 확산되는 것이 빠르게 관찰되었고, 이는 저온에서 Ag를 이용한 Cu간의 고상 확산 본딩이 가능함을 나타내었다. 따라서 Ag 나노막을 이용한 Cu 본딩을 200℃에서 진행하였고, 본딩 계면의 전단 강도는 23.27 MPa로 측정되었다.

Excited State Dynamics of Curcumin and Solvent Hydrogen Bonding

  • Yang, Il-Seung;Jin, Seung-Min;Kang, Jun-Hee;Ramanathan, Venkatnarayan;Kim, Hyung-Min;Suh, Yung-Doug;Kim, Seong-Keun
    • Bulletin of the Korean Chemical Society
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    • 제32권spc8호
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    • pp.3090-3093
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    • 2011
  • Curcumin is a natural product with antioxidant, anti-inflammatory, antiviral and antifungal functions. As it is known that the excited state intramolecular hydrogen transfer of curcumin are related to its medicinal antioxidant mechanism, we investigated its excited state dynamics by using femtosecond transient absorption spectroscopy in an effort to understand the molecule's therapeutic effect in terms of its photophysics and photochemistry. We found that stronger intermolecular hydrogen bonding with solvents weakens the intramolecular hydrogen bonding and decelerates the dynamical process of the enolic hydrogen. Exceptions are found in methanol and ethylene glycol due to their nature as simultaneous hydrogen bonding donor-acceptor and high viscosity solvent, respectively.

Primer Bonding agent, 복합레진 내의 볼소의 법랑질에 대한 항우식 작용 (THE ANTICARIOGENIC EFFECT OF F IN PRIMER, BONDING AGENT AND COMPOSITE RESIN IN THE CAVOSURFACE ENAMEDL AREA)

  • 박성호
    • Restorative Dentistry and Endodontics
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    • 제21권2호
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    • pp.635-641
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    • 1996
  • This study was designed to evaluate the anti cariogenic effect of F in primers, bonding agents, composite resins or glass ionomer cements in enamel. Twenty-five extracted teeth were selected and a cavity was prepared on either the buccal or the lingual surface of each tooth. After pumicing and etching, the samples were divided into 5 groups. In group A, the samples were primed, bonded and filled with ART bond and Brilliant Enamel (Coltene, Switzerland). Group B composed of Optibond and Herculited XRV (Kerr, USA), group C composed of Syntac and Tetric(Vivadent, Lichtenstein), and group D composed of Scotch-bond Multipurpose and Z 100 (3M, YSA). In group E, the samples were filled with glass ionomer cement (Fuji II LC, Japan), All surfaces except the 2mm beyond the cavosurface margin of the sample were protected, and samples were then put into an acid buffer for 3 days to develop the initial caries. The samples were then sectioned through the filling body into thin wafers and then examined with a polarizing microscope under water imbibition. The fluoride in primer, bonding agent, or composite filling material did not prevent the initial caries in the enamel area adjacent to the filling body whereas the fluoride in the glass ionomer did prevent the initial stage caries.

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