Browse > Article
http://dx.doi.org/10.5050/KSNVE.2013.23.1.084

2D and 3D Topology Optimization with Target Frequency and Modes of Ultrasonic Horn for Flip-chip Bonding  

Ha, Chang Yong (Department of Mechanical and Information Engineering, University of Seoul)
Lee, Soo Il (Department of Mechanical and Information Engineering, University of Seoul)
Publication Information
Transactions of the Korean Society for Noise and Vibration Engineering / v.23, no.1, 2013 , pp. 84-91 More about this Journal
Abstract
Ultrasonic flip-chip bonding needs a precise bonding tool which delivers ultrasonic energy into chip bumps effectively to use the selected resonance mode and frequency of the horn structure. The bonding tool is excited at the resonance frequency and the input and output ports should locate at the anti-nodal points of the resonance mode. In this study, we propose new design method with topology optimization for ultrasonic bonding tools. The SIMP(solid isotropic material with penalization) method is used to formulate topology optimization and OC(optimal criteria) algorithm is adopted for the update scheme. MAC(modal assurance criterion) tracking is used for the target frequency and mode. We fabricate two prototypes of ultrasonic tools which are based on 3D optimization models after reviewing 2D and 3D topology optimization results. The prototypes are satisfied with the ultrasonic frequency and vibration amplitude as the ultrasonic bonding tools.
Keywords
Topology Optimization; Ultrasonic Horn; Frequency Optimization;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
연도 인용수 순위
1 Gao, S., 2005, New Technologies for Lead-free Chip Assembly, Ph.D. Thesis, University of London.
2 Lee, B. G., Kim, K. L. and Kim, K. E., 2008, Design of Ultrasonic Vibration Tool Horn for Micromachining Using FEM, Transactions of the Korean Society of Machine Tool Engineers, Vol. 17, No. 6, pp. 63-70.   과학기술학회마을
3 Seo, J. S., Jang, S. M. and Beck, S. Y., 2012, One-wavelength Ultrasonic Horn Design for Ultrasonic Machining of Mobile Phone Battery Terminal Welding, Transactions of the Korean Society of Manufacturing Technology Engineers, Vol. 21, No. 1, pp. 70-75.   과학기술학회마을   DOI   ScienceOn
4 Suzuki, K. and Kikuchi, N., 1991, A Homogenization Method for Shape and Topology Optimization, Computer Methods in Applied Mechanics and Engineering, Vol. 93, No. 3, pp. 291-318.   DOI   ScienceOn
5 Bendsoe, M. P. and Kikuchi, N., 1988, Generating Optimal Topologies in Structural Design Using a Homogenization Method, Computer Methods in Applied Mechanics and Engineering, Vol. 71, No. 2, pp. 197-224.   DOI   ScienceOn
6 Rozvany, G. I. N., Zhou, M. and Biker, T., 1992, Generalized Shape Optimization without Homogenization, Structural Optimization, Vol. 4, No. 3-4, pp. 250-254.   DOI
7 Sethian, J. A. and Wiegmann, A., 2000, Structural Boundary Design via Level Set and Immersed Interface Methods, Journal of Computational Physics, Vol. 163, No. 2, pp. 489-528.   DOI   ScienceOn
8 Logan, D. L., 2007, A First Course in the Finite Element Method, CENGAGE Learning.
9 Bendsøe, M. P. and Sigmund, O., 2004, Topology Optimization: Theory, Method, and Applications, Springer-Verlag, Berlin, Germany.
10 Lee, J. W. and Kim, Y. Y., 2008, Topology Optimization-based Partition Design for Maximizing or Minimizing the Eigenfrequency of a Double Cavity, Transactions of the Korean Society for Noise and Vibration Engineering, Vol. 18, No. 11, pp. 1118-1127.   과학기술학회마을   DOI   ScienceOn
11 Ewins, E. J., 2000, Modal Testing, 2nd Ed. Research Studies Press.
12 Bendsoe, M. P., 1989, Optimal Shape Design as a Material Distribution Problem, Structural and Multidisciplinary Optimization, Vol. 1, No. 4, pp. 193- 202.   DOI
13 Seyranian, A., Lund, E. and Olhoff, N, 1994, Multiple Eigenvalues in Structural Optimization Problems, Structural and Multidisciplinary Optimization, Vol. 8, No. 4, pp. 207-227.   DOI   ScienceOn