• 한국군사과학기술학회지
• /
• 제16권6호
• /
• pp.745-751
• /
• 2013

In naval gun firing, firing accuracy comes from the combination of each component's accuracy in CFCS (Command and Fire Control System) like tracking sensors and gun. Generally, battery alignment is done to correct the error between gun and tracking sensor by using boresight telescope on harbor and sea. But normally, the battery alignment can compensate only the static alignment error and ignore dynamic alignment error which is caused by own ship movement. There was no research on this dynamic alignment error until now. We propose a new way to analyze dynamic arrangement error by using image of boresight telescope. In case of the dynamic alignment error was due to time delay of own ship attitude information, we propose the way to compensate it.

• 한국정밀공학회지
• /
• 제20권6호
• /
• pp.88-95
• /
• 2003

This paper presents the measurement and correction method of PCB alignment errors for PCB screen printer. Electronic equipment is getting smaller and yet must satisfy high performance standard. Therefore, there is a great demand for PCB with high density. However conventional PCB screen printer doesn't have enough accuracy to accommodate the demand fur high-resolution circuit pattern and high-density mounting capacity of electronic chips. It is because the alignment errors of PCB occur when it is loaded to the screen printer. Therefore, this study focuses on the development of the system which is able to measure and correct alignment errors with high-accuracy. An automatic optical inspection part measures the PCB alignment errors using machine vision, and the high-accuracy 3-axis stage makes correction for these errors. This system used two CCD cameras to get images of two fiducial marks of PCB. The geometrical relationship between PCB, cameras, and xy$\theta$ stage is derived, and analytical equations for alignment errors are also obtained. The unknown parameters including camera declining angles and etc. can be obtained by initialization process. Finally, the proposed algorithm is verified by experiments by using test bench.

• 한국정보통신학회논문지
• /
• 제9권6호
• /
• pp.1282-1287
• /
• 2005

수 마이크로 단위로 계측되는 반도체 COG의 불량 검사에 있어서 칩 얼라인은 검사의 정확성을 높이는데 매우 중요한 역할을 한다. 본 논문에서는 칩 얼라인의 정확성을 높이기 위해서 영역분할 패턴매칭 방법을 제안한다. 영역분할 패턴매칭 방법은 세분화 된 영역 내의 특징치들과 영역들 간의 상관관계를 비교하여 매칭된다. 그리고 불량 패턴으로 인한 매칭오류를 최소화 하기 위해서 패턴 주위의 3영역을 학습시킨다. 제안된 방법은 분할 된 영역에서 특징치를 찾기 때문에 매칭 시간을 단축시키는 효과와 정확성을 높일 수 있는 이점을 가지고 있다.

• 한국정밀공학회지
• /
• 제20권6호
• /
• pp.96-104
• /
• 2003

This paper presents the measurement and correction method of PCB alignment errors for PCB screen printer. Electronic equipment is getting smaller and yet must satisfy high performance standard. Therefore, there is a great demand for PCB with high density. However conventional PCB screen printer doesn't have enough accuracy to accommodate the demand for high-resolution circuit pattern and high-density mounting capacity of electronic chips. It is because the alignment errors of PCB occur when it is loaded to the screen printer. Therefore, this study focuses on the development of the system which is able to measure and correct alignment errors with high-accuracy. An automatic optical inspection part measures the PCB alignment errors using machine vision, and the high-accuracy 3-axis stage makes correction for these errors. This system used two CCD cameras to get images of two fiducial marks of PCB. The centers of fiducial marks are obtained by using moment, gradient method. The first method is calculating the centroid by using first moment of blob, and the latter method is calculating the center of the circle whose equation is obtained by curve-fitting the boundaries of fiducial mark. The operating system used to implement the whole set-up is carried in Window 98 (or NT) environment. Finally we implemented this system to PCB screen printer.

• Applied Microscopy
• /
• 제43권1호
• /
• pp.1-8
• /
• 2013

We developed an improved method for tilt series alignment with fiducial markers in electron tomography. Based on previous works regarding alignment, we adapted the Levenberg-Marquardt method to solve the nonlinear least squares problem by incorporating a new formula for the alignment model. We also suggested a new method to estimate the initial value for inversion with higher accuracy. The proposed approach was applied to geopolymers. A better alignment of the tilt series was achieved than that by IMOD S/W. The initial value estimation provided both stability and a good rate of convergence since the new method uses all marker positions, including those partly covering the tilt images.

• 소성∙가공
• /
• 제13권3호
• /
• pp.190-204
• /
• 2004

The objective of this study is to develop a highly accurate micro tool alignment system applicable to the micro machining technology. In a specific application such as micro hole punching, radial clearance between micro tools is order of a few micron. Under this micron scale tool clearance, accuracy of tool alignment is very important for ensuring hole quality. In the present study, a two-way image acquisition system was developed, which can produce overlapped image of both micro tools that face each other, and applied to the tool alignment in the micro punching. Also, to meet alignment accuracy of tools within $1\mu\textrm{m}$, the cross correlation image processing algorithm was employed. With this system, $25\mu\textrm{m}$ punching tools with $1\mu\textrm{m}$ radial clearance could be accurately aligned.

• 한국항공우주학회지
• /
• 제35권5호
• /
• pp.419-425
• /
• 2007

수직발사를 위한 스트랩다운 관성항법시스템의 급속 One-Shot정렬 기법을 제시한다. 제시된 정렬기법은 종 항법시스템(Slave INS)의 가속도계 출력 값 및 주 항법시스템(Master INS)의 자세를 이용한다. 또한 정렬 성능 및 속도를 개선시키기 위하여 등가선형변환 및 사전 필터링 기법을 제시한다. 시험결과들은 제시된 방법이 정렬 정확도 및 정렬 속도 개선에 효과적임을 보였다.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 1993년도 추계학술대회 논문집
• /
• pp.243-248
• /
• 1993

New methodology for fiducial alignment is proposed to improve the alignment accuracy in wafer steppers. The positioning error is detected by PSD(Position Sensitive Detector)when 2-dimensional vernier patterns on a reticle on a reticle are projected on the fiducial marks of wafer stage. The width and period of vernier patterns are deter mined to get the highest S/N ratio for the exposure wavelength 248.4nm of KrF excimer laser. This new method has an advantage of higher accuracy and faster alignment over the conventional one.

• 한국항공우주학회지
• /
• 제48권12호
• /
• pp.987-995
• /
• 2020

고성능 탑재체들과 자세제어 센서들 간의 정밀정렬은 인공위성의 정확한 자세지향 및 높은 지향 안정성을 위해 필수적이다. 위성 개발사들은 조립 및 시험기간 동안 위성 정렬을 위해 데오드라이트 측정 시스템을 주로 사용한다. 데오드라이트 측정 시 시선 방향 오차, 수평축의 오차, 수직방향 인덱스 오차 그리고 수직축 오차로 인해 측정오차가 발생할 수 있다. 이러한 오차들 뿐 아니라 다수의 데오드라이트를 사용한 측정 시 발생할 수 있는 오차들을 정렬큐브 측정실험을 통해 분석하였다. 정렬큐브 측정실험을 기반으로 정렬측정 정확도를 향상시킬 수 있는 방법이 제안되었고, 측정 결과 위성의 설계 요구조건도 만족시킬 수 있었다.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
• /
• pp.376-378
• /
• 2002

Within LG.Philips Displays electron gun assembly different grid alignment methods are used. Besides the commonly used mandrel alignment of grids (Inner Reference System, IRS), also a unique Outer Reference System (ORS) is used as grid alignment method in high-end gun assembly. This alignment method combines alignment accuracy with maximum electron optical design freedom and maximum flexibility in electron gun production.