• Clean Technology
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• v.23 no.2
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• pp.196-204
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• 2017

CdZnS/ZnO composite was prepared through low-temperature precipitation and drying method. The property of CdZnS/ZnO as a recyclable photocatalyst for the degradation of rhodamine B (RhB) under visible light irradiation was examined. The sample was characterized by XRD, FE-SEM, XPS, UV-vis DRS and photoluminescence techniques before and after repeated reaction to investigate the change of properties during the photocatalytic reaction. During repeated reaction, the CdZnS/ZnO showed an improved photocatalytic activity and recycle stability. Among two feasible reaction pathways for photocatalytic degradation of RhB, the cleavage of conjugated chromophore was found to predominate over N-dealkylation of chromophore skeleton in the present work. The results indicate that the CdZnS/ZnO, prepared by a simple precipitation method, can be used as a visible-light driven photocatalyst with enhanced cycle stability and activity.

• Applied Chemistry for Engineering
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• v.21 no.4
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• pp.435-439
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• 2010

Pt-$MoO_3$ electrodes were fabricated on ITO-coated glass by electrodeposition method using 20 mM hydrogen hexachloroplatinate ($H_2PtCl_6$) and 10 mM Mo-peroxo electrolyte. Deposition order was varied, and catalytic activities of synthesized electrodes were compared with that of pure Pt electrode. Scanning Electron Microscopy (SEM) was utilized to examine surface morphology. The crystallinity of synthesized films was analyzed by X-ray Diffraction (XRD), and the oxidation state of both the platinum and molybdenum were determined by X-ray Photoelectron Spectroscopy (XPS) analyses. The catalytic activity and stability for methanol oxidation were measured using cyclic voltammetry (CV) and chronoamperometry (CA) in a mixture of 0.5 M $H_2SO_4$ and 0.5 M $CH_3OH$ aqueous solution. $MoO_3$ electrodeposited on the surface of Pt showed much higher catalytic acitivity and stability than pure Pt electrode due to the good contact between Pt and $MoO_3$.

• Clean Technology
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• v.27 no.3
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• pp.223-231
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• 2021

In order to address many issues associated with large volume changes of silicon, which has very low electrical conductivity but offers about 10 times higher theoretical capacity than graphite (Gr), a silicon nanoparticles/hollow carbon (SiNP/HC) composite having bimodal-mesopores was prepared using silica nanoparticles as a template. A control SiNP/C composite without a hollow structure was also prepared for comparison. The physico-chemical and electrochemical properties of SiNP/HC were analyzed by X-ray diffractometry, X-ray photoelectron spectroscopy, nitrogen adsorption/desorption measurements for surface area and pore size distribution, scanning electron microscopy, transmission electron microscopy, galvanostatic cycling, and cyclic voltammetry tests to compare them with those of the SiNP/C composite. The SiNP/HC composite showed significantly better cycle life and efficiency than the SiNP/C, with minimal increase in electrode thickness after long cycles. A hybrid composite, SiNP/HC@Gr, prepared by physical mixing of the SiNP/HC and Gr at a 50:50 weight ratio, exhibited even better cycle life and efficiency than the SiNP/HC at low capacity. Thus, silicon/carbon composites designed to have hollow spaces capable of accommodating volume expansion were found to be highly effective for long cycle life of silicon-based composites. However, further study is required to improve the low initial coulombic efficiency of SiNP/HC and SiNP/HC@Gr, which is possibly because of their high surface area causing excessive electrolyte decomposition for the formation of solid-electrolyte-interface layers.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.2
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• pp.52-59
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• 2023

The effects of dielectric curing temperature and temperature/humidity treatment conditions on the interfacial adhesion energies between Ti diffusion barrier/polybenzoxazole (PBO) dielectric layers were systematically investigated for Cu redistribution layer applications of fan-out wafer level package. The initial interfacial adhesion energies were 16.63, 25.95, 16.58 J/m² for PBO curing temperatures at 175, 200, and 225 ℃, respectively. X-ray photoelectron spectroscopy analysis showed that there exists a good correlation between the interfacial adhesion energy and the C-O peak area fractions at PBO delaminated surfaces. And the interfacial adhesion energies of samples cured at 200 ℃ decreased to 3.99 J/m² after 500 h at 85 ℃/85 % relative humidity, possibly due to the weak boundary layer formation inside PBO near Ti/PBO interface.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.49-55
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• 2016

The effects of post-annealing and temperature/humidity conditions on the interfacial adhesion energies of atomic layer deposited RuAlO diffusion barrier layer for Cu interconnects were systematically investigated. The initial interfacial adhesion energy measured by four-point bending test was $7.60J/m^2$. The interfacial adhesion energy decreased to $5.65J/m^2$ after 500 hrs at $85^{\circ}C$/85% T/H condition, while it increased to $24.05J/m^2$ after annealing at $200^{\circ}C$ for 500 hrs. The X-ray photoemission spectroscopy (XPS) analysis showed that delaminated interface was RuAlO/$SiO_2$ for as-bonded and T/H conditions, while it was Cu/RuAlO for post-annealing condition. XPS O1s peak separation results revealed that the effective generation of strong Al-O-Si bonds between $AlO_x$ and $SiO_2$ interface at optimum post-annealing conditions is responsible for enhanced interfacial adhesion energies between RuAlO/$SiO_2$ interface, which would lead to good electrical and mechanical reliabilities of atomic layer deposited RuAlO diffusion barrier for advanced Cu interconnects.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.29-37
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• 2021

The effect of Ar/N₂ two-step plasma treatment on the quantitative interfacial adhesion energy of low temperature Cu-Cu bonding interface were systematically investigated. X-ray photoelectron spectroscopy analysis showed that Ar/N₂ 2-step plasma treatment has less copper oxide due to the formation of an effective Cu4N passivation layer. Quantitative measurements of interfacial adhesion energy of Cu-Cu bonding interface with Ar/N₂ 2-step plasma treatment were performed using a double cantilever beam (DCB) and 4-point bending (4-PB) test, where the measured values were 1.63±0.24 J/m² and 2.33±0.67 J/m², respectively. This can be explained by the increased interfacial adhesion energy according phase angle due to the effect of the higher interface roughness of 4-PB test than that of DCB test.

• Composites Research
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• v.35 no.6
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• pp.394-401
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• 2022

Two polymer precursors, polyvinylidene chloride-resin (PVDC-resin) and polyvinylidene fluoride (PVDF), are assembled into the microporous carbon by pyrolysis. Microporous carbon is advantageous as an electrode for supercapacitors that store electric charges through ion adsorption/desorption. The pyrolysis also turns the various heteroatoms of two precursors into functional groups, contributing to the additional charge storage. The analysis of the porous structure and function group during carbonization are important to develop the carbon for energy storage. Here, we analyzed the functional groups of two polymer-derived carbons through X-ray photoelectron spectroscopy. The electrochemical properties of the functional groups were explored in various pH electrolytes. The specific capacitance of two carbons in the acidic electrolyte (1 M H₂SO₄) was improved compared to that in the neutral electrolyte (0.5 M Na₂SO₄) due to the faradaic charge/discharge reaction of the quinone functional group. In particular, the carbon electrode derived from PVDC-resin exhibits a lower capacity than the carbon from PVDF due to the small micropores. In the alkaline electrolyte (6 M KOH), the highest specific capacitance and rate capability were obtained among the three electrolytes for both electrodes based on the facile adsorption of the constituent electrolyte ions (K⁺, OH^-).

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.75-81
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• 2017

The effects of KOH pretreatment and annealing conditions on the interfacial adhesion and the reliability between epoxy resin and polyimide substrate in the flexible printed circuit board were quantitatively evaluated using $180^{\circ}$ peel test. The initial peel strength of the polyimide without the KOH treatment was 29.4 g/mm and decreased to 10.5 g/mm after 100hrs at $85^{\circ}C/85%$ R.H. temperature/humidity treatment. In case of the polyimide with annealing after KOH treatment, initial peel strength was 29.6 g/mm and then maintained around 27.5 g/mm after $85^{\circ}C/85%$ R.H. temperature/humidity treatment. Systematic X-ray photoelectron spectroscopy analysis results showed that the peel strength after optimum annealing after KOH treatment was maintained high not only due to effective recovery of the polyimide damage by the polyimide surface treatment process, but also effective removal of metallic ions and impurities during various wet process.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.7-12
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• 2018

The effects of Ru deposition temperature and post-annealing conditions on the interfacial adhesion energies of atomic layer deposited (ALD) Ru diffusion barrier layer and Cu thin films for the advanced Cu interconnects applications were systematically investigated. The initial interfacial adhesion energies were 8.55, 9.37, $8.96J/m^2$ for the sample deposited at 225, 270, and $310^{\circ}C$, respectively, which are closely related to the similar microstructures and resistivities of Ru films for ALD Ru deposition temperature variations. And the interfacial adhesion energies showed the relatively stable high values over $7.59J/m^2$ until 250h during post-annealing at $200^{\circ}C$, while dramatically decreased to $1.40J/m^2$ after 500 h. The X-ray photoelectron spectroscopy Cu 2p peak separation analysis showed that there exists good correlation between the interfacial adhesion energy and the interfacial CuO formation. Therefore, ALD Ru seems to be a promising diffusion barrier candidate with reliable interfacial reliability for advanced Cu interconnects.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.55-60
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• 2012

In order to develop electroless-plated Nickel Phosphate (Ni-P) as a contact material for high efficient low-cost silicon solar cells, we evaluated the effect of ambient thermal annealing on the degradation behavior of interfacial adhesion energy between electroless-plated Ni-P and silicon solar cell wafers by applying 4-point bending test method. Measured interfacial adhesion energies decreased from 14.83 to 10.83 J/$m^2$ after annealing at 300 and $600^{\circ}C$, respectively. The X-ray photoelectron spectroscopy analysis suggested that the bonding interface was degraded by environmental residual oxygen, in which the oxidation inhibit the stable formation of Ni silicide phase between electroless-plated Ni-P and silicon interface.