• Korean Journal of Materials Research
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• v.15 no.3
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• pp.202-208
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• 2005

The surface states of gate dielectrics affect device performance severely in Pentacene OTFTs. We have fabricated organic thin-film transistors (OTFTs) using pentacene as an active layer with chemically modified $SiO_2$ gate dielectrics. The effects of the surface treatment of $SiO_2$ on the electric characteristics of OTFTS were investigated. The surface of $SiO_2$ gate dielectric was treated by normal wet cleaning process, $O_2-plasma$ treatment, hexamethyldisilazane (HMDS), and octadecyltrichlorosilane (OTS) treatment. After the surface treatments, the contact angles and surface free energies were measured in order to analyze the surface state changes. In the electrical measurements, typical I-V characteristics of TFTs were observed. The field effect mobility, $\mu$, was calculated to be $0.29\;cm^2V^{-1}s^{-1}$ for OTS treated sample while those for the HMDS, $O_2$ plasma treated, and wet-cleaned samples were 0.16, 0.1, and $0.04\;cm^2V^{-1}s^{-1}$, respectively.

• Journal of the Korean Electrochemical Society
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• v.16 no.1
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• pp.1-8
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• 2013

This review article summarizes metal-assisted chemical etching (MAC etch or MACE), an anisotropic etching method for Si, and describes principles, main factors, and recent achievements in literature. In 1990, it was discovered that, with metal catalyst on surface and $H_2O_2$/HF as etchant, Si substrate can be etched anisotropically, in even in solution. In contrast to high-cost vacuum-based dry etching methods, MAC etch enables to fabricate a variety of high aspect ratio nanostructures through wet etching process.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.319.1-319.1
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• 2016

Recently, the Al-doped ZnO (ZnO:Al) films are intensively used in thin film a-Si solar cell applications due to their high transmittance and good conductivity. The textured ZnO:Al films are used to enhance the light trapping in thin film solar cells. The wet etch process is used to texture ZnO:Al films by dipping in diluted acidic solutions like HCl or HF. During that process the glass substrate could be damaged by the acidic solution and it may be difficult to apply it for the inline mass production process since it has to be done outside the chamber. In this paper we report a new technique to control the surface morphology of RF-sputtered ZnO:Al films. The ZnO:Al films are textured with vaporized HF formed by the mixture of HF and H2SiO3 solution. Even though the surface of textured ZnO:Al films by vapor etching process showed smaller and sharper surface structures compared to that of the films textured by wet etching, the haze value was dramatically improved. We achieved the high haze value of 78% at the wavelength of 540 nm by increasing etching time and HF concentration. The haze value of about 58% was achieved at the wavelength of 800 nm when vapor texturing was used. The ZnO:Al film texture by HCl had haze ratio of about 9.5 % at 800 nm and less than 40 % at 540 nm. In addition to low haze ratio, the texturing by HCl was very difficult to control etching and to keep reproducibility due to its very fast etching speed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.407-410
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• 2002

Thermal oxidations of 3C-SiC thin-films grown on Si(100) by APCVD(atmospheric pressure chemical vapor deposition) were carried out. The oxidations of 3C-SiC were performed at $1100^{\circ}C$ for 1~6 hr in wet and dry $O_2$ ambient, respectively. Ellipsometry was used to determine the thickness and index of refraction of oxide films. The oxide thickness vs. the oxidation time follows the general relationship used for the thermal oxidation of Si. The surface roughness was analyzed by using AFM(atomic force microscopy). The surface roughness of oxidized 3C-SiC was rougher than before oxidation. The thermal oxide was found to be $SiO_2$ by XPS(X-ray photoelectron spectroscopy) analysis. Auger analysis showed them to be homogeneous with near stoichiometric composition.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.5
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• pp.351-354
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• 2013

Thin-film transistors(TFTs) with silicon-zinc-tin-oxide(SiZnSnO, SZTO) channel layer are fabricated by rf sputtering method. Electrical properties were changed by different annealing treatment of dry annealing and wet annealing. This procedure improves electrical property especially, stability of oxide TFT. Improved electrical properties are ascribed to desorption of the negatively charged oxygen species from the surfaces by annealing treatment. The threshold voltage ($V_{th}$) shifted toward positive as increasing Si contents in SZTO system. Because the Si has a lower standard electrode potential (SEP) than that that of Sn, Zn, resulting in the degeneration of the oxygen vacancy ($V_O$). As a result, the Si acts as carrier suppressor and oxygen binder in the SZTO as well as a $V_{th}$ controller, resulting in the enhancement of stability of TFTs.

• Journal of Sensor Science and Technology
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• v.4 no.3
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• pp.51-59
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• 1995

Stress-balanced flat 150 nm-$Si_{3}N_{4}$/300 nm-$SiO_{2}$/150 nm-$Si_{3}N_{4}$ dielectric membrane on silicon substrate has been fabricated. Analyses of stress-deflection and stress-temperature, and visual inspection for the strain diagnostic test patterns were performed in order to characterize stress properties of the membrane. The $SiO_{2}$ layers sandwiched between two $Si_{3}N_{4}$ layers were deposited by three different techniques(PECVD, LPCVD, and APCVD) for the purpose of investigating the dependence of stress on the deposition methods. Some extent of tensile stress in the membrane was always observed regardless of the deposition methods, however it could be balanced against silicon substrate by post-wet oxidation in $1,150^{\circ}C$. Stress-temperature characteristics of the membranes showed that APCVD-LTO was better as mid-$SiO_{2}$ layer than PECVD - or LPCVD - $SiO_{2}$ when there was no oxidation process.

• Journal of the Korean institute of surface engineering
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• v.37 no.6
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• pp.313-318
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• 2004

Vertically-aligned and uniformly-distributed CuO nanowires were formed on copper-coated Si substrates by wet chemical process, immersing them in a hot alkaline solution. The effects of hydrogen plasma treatment on the field emission characteristics of CuO nanowires were investigated. It was found that hydrogen plasma treatment enhanced the field emission properties of CuO nanowires by showing a decrease in turn-on voltage, and an increase in emission current density, and stability of current-voltage curves. However, the excessive hydrogen plasma treatment made the I-V curves unstable. It was confirmed by XPS (X-ray Photoelectron Spectroscopy) analysis that hydrogen plasma treatment deoxidized CuO nanowires, thereby the work function of the nanowires decreased from 4.35 eV (CuO) to 4.1 eV (Cu). It is thought that the decrease in the work function enhanced the field emission characteristics. It is well-known that the lower the work function, the better the field emission characteristics. The results suggest that the hydrogen plasma treatment is very effective in achieving enhanced field emission properties of the CuO nanowires, and there may exist an optimal hydrogen plasma treatment condition.

• Computers and Concrete
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• v.19 no.2
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• pp.153-159
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• 2017

In this study, the strength properties of alkali-activated silica fume (SF) mortars were investigated. The crushed limestone sand with maximum size of 0-5 mm and the sodium meta silicate ($Na_2SiO_3$) used to activate the binders were kept constant in the mortar mixtures. The mortar specimens using the replacement ratios of 0, 25, 50, 75 and 100% SF by weight of cement together with $Na_2SiO_3$ at a constant rate were produced in addition to the control mortar produced by only cement. Moreover, the mortar specimens using the replacement ratio of 4% titanium dioxide ($TiO_2$) by weight of cement in the same mixture proportions were produced. The prismatic specimens produced from eleven different mixtures were de-moulded after a day, and the wet or dry cure was applied on the produced specimens at laboratory condition until the specimens were used for flexural strength ($f_{fs}$) and compressive strength ($f_c$) measurement at the ages of 7, 28 and 56 days. The $f_{fs}$ and $f_c$ values of mortars applied the wet or dry cure were compared with the results of control mortar. The findings revealed that the $f_c$ results of the alkali activated 50% SF mortars were higher than that of mortar produced with Portland cement only. It was found that the $f_{fs}$ and $f_c$ of alkali-activated SF mortars cured in dry condition was averagely 4% lower than that of alkali-activated SF mortars cured in wet condition.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.6
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• pp.668-675
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• 2013

We investigate the effect of the ageing time and etching time on the etching rate of SiGe mixed etching solution, namely 1 vp HF (6%), 2 vp $H_2O_2$ (30%) and 3 vp $CH_3COOH$ (99.8%). For this etching solution, we found that the etch rate of SiGe layer is saturated after the ageing time of 72 hours, and the selectivity of $Si_{0.8}Ge_{0.2}$ layer and Si layer is 20:1 at ageing time of 72 hours. The collapse was appeared at the etching time of 9min with etching solution of after saturation ageing time.

• Journal of Powder Materials
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• v.5 no.3
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• pp.184-191
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• 1998

The fabrication process and properties of SiC particulate preforms with high volume fraction above 50% were investigated. The SiC particulate preforms were fabricated by vacuum-assisted extraction method after wet mixing of SiC particulates of 48 ${\mu}m$ in diameter, $SiO_2$ as inorganic binder, cationic starch as organic binder and polyacrylamide as dispersant in distilled water. The SiC particulate preforms were consolidated by vacuum-assisted extraction, and were followed by drying and calcination. The drying processes were consisted with natural drying at $25^{\circ}C$ for 36 hrs and forced drying at 10$0^{\circ}C$ for 12 hrs in order to prevent the micro-cracking of SiC particulates preform. The compressive strengths of SiC particulate preforms were dependent on the inorganic binder content, calcination temperature and calcination time. The compressive strength of SiC preform increased from 0.47 MPa to 1.79 MPa with increasing the inorganic binder content from 1% to 4% due to the increase of $SiO_2$ flocculant between the interfaces of SiC particulates. The compressive strength of SiC preform increased from 0.90 MPa to 3.21 MPa with increasing the calcination temperatures from 800 to 120$0^{\circ}C$ under identical calcination time of 4hrs. The compressive strength of SiC preform increased from 0.92 to 1.95 MPa with increasing the calcination time from 2 hrs to f hrs at calcination temperature of 110$0^{\circ}C$. The increase of compressive strength of SiC preform with increasing the calcination temperature and time is due to the formation of crystobalite $SiO_2$ phase at the interfaces of SiC particulates.