• Title/Summary/Keyword: Welding Fabrication

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The Application and Fabrication Process of Cold Cathode Lamp Using a FEA (FEA를 이용한 Cold Cathode Lamp의 제작 공정 연구와 그 응용성)

  • Park, Suhg-Hyun;Hong, Kun-Jo;Jun, Seok-Hwan;Kwon, Sang-Jik;Lee, Neung-Hun;Park, Jae-Bum
    • Proceedings of the KIEE Conference
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    • 2000.07c
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    • pp.1800-1802
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    • 2000
  • 본 연구에서는 냉음극 발광 소자인 FEA를 이용하여 Cold Cathode Lamp 제작과 그 구조에 대해서 연구하였다. Anode plate에는 ZnO:Zn 형광체를 전기영동법으로 증착한 후 tube slabs와 anode plate를 frit glass를 이용하여 접합하였다. FEA와 substrate의 bonding, addressing을 위한 wire bonding, substrate와 집속전극, setter를 stem base의 외부전극에 연결하기 위한 spot welding, tube와 stem base를 glass melting method로 접합 공정을 하였다. 진공배기 시스템에 배기판을 연결하여 ${\sim}10^{-7}$torr까지 배기한 후 heater를 이용하여 배기관을 tip-off하였다. 최종적으로 진공을 유지하기 위해 getter를 RF 고주파로 활성화하였다. 결론적으로 lamp외 특성을 비교분석한 후 휘도 및 발광효율을 향상시키기 위한 구조절 개선과 방안을 고찰하였다.

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A Study On Optimum Reliability of Rigid Connection in Steel Structures (최적신뢰성에 의한 강구조물의 강접합부 연구)

  • Jung, Chul-Won;Yu, Han-Shin
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.5 no.4
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    • pp.177-184
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    • 2001
  • In this study, three most distinct types of general rigid connections are included in the modelling, with is implemented into a computer code. The cost, functions of connections are constructed by using the estimated unit cost of bolting, welding and connection-steel elements incorporating all the effect of materials, labor, and fabrication work. Bused on the recent developments of the reliability-based structural analysis and design as well as the extending knowledge on the probabilistic characteristics of load and resistances, the probability based design criteria have been successfully developed for many standards. Since the probabilistic characteristics depend highly on the local load and resistances, it is recognized to develop the design criterion compatible with domestic requirements. The existing optimum design methods, which are generally based on the structural theory and certain engineering experience, do not realistically consider the uncertainties of load and resistances and the basic reliability concepts.

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Magnetic Permeability Measurement of Stainless Steels in Vacuum Chamber Fabrication (스테인리스강 진공용기 제작 공정중 투자율 변화 측정)

  • Hong, M.S.;Park, C.D.
    • Journal of the Korean Vacuum Society
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    • v.19 no.6
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    • pp.460-466
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    • 2010
  • We measured the magnetic properties of stainless steels type 304 and 316L to see if those materials can be used for the applications where non-magnetic materials are required. The results show that the relative permeability of samples was greatly increased during manufacturing processes. After full solution annealing, however the permeability could be reduced to less than 1.02. Thus, the materials may be employed in the low-permeability applications.

Tensile Testing of Groove Welded Joints Joining Thick-HSA800 Plates (HSA800 후판재의 맞댐용접부 인장강도 실험)

  • Lee, Cheol Ho;Kim, Dae Kyung;Han, Kyu Hong;Park, Chang Hee;Kim, Jin Ho;Lee, Seung Eun;Kim, Do Hwan
    • Journal of Korean Society of Steel Construction
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    • v.25 no.4
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    • pp.431-440
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    • 2013
  • In this study, a standard tensile welded-joint test was conducted to select a welding electrode suitable for recently developed HSA800 steel. Two welding electrodes were available at the time of this study; one was GMAW-based and the other FCAW-based. The tensile test specimens were fabricated by joining 60mm-thick HSA800 plates according to the AWS-prequalified groove welded joint details. Specimens which violate the standard root opening distance (ROD) were also included to see if poor construction tolerance could be accommodated. During fabrication, serious concerns about the welding efficiency of the GMAW-based product were raised by a certified welder. Both welding electrodes showed satisfactory and similar performance from welded joint strength perspective. But groove welded joints made by using the FCAW-based rod consistently showed more ductile and stable behavior. The AISC provisions for PJP joint strength were shown to be very conservative under direct tensile loading. Violating the AWS prequalified ROD by 100% apparently passed the strength criteria, but unusual crater-like fracture surface was observed.

Flexural Tensile Strength of CJP Groove Welded Joints Connecting Thick HSA800 Plates (HSA800 후판재의 완전용입 맞댐용접부 휨-인장강도 실험)

  • Lee, Cheol Ho;Kim, Dae Kyung;Han, Kyu Hong;Park, Chang Hee;Kim, Jin Ho;Lee, Seung Eun;Kim, Do Hwan
    • Journal of Korean Society of Steel Construction
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    • v.26 no.5
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    • pp.407-418
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    • 2014
  • As a continuing work of previously conducted standard tension tests, full-scale flexural tests were conducted in this study to assess the structural performance the CJP groove welded joints connecting thick HSA800 plates. Two welding electrodes were available at the time of this experimental research; one was GMAW-based electrode A and the other FCAW-based electrode B. Three full-scale box-type beam specimens with single bevel- and V-groove CJP welded joints were fabricated from 60mm and 25mm thick HSA800 plates according to the AWS-prequalified groove welded joint details. In designing the specimens, all possible limit states like local and lateral torsional buckling were carefully controlled in order to induce flexural plastic yielding or eventual joint fracture. All the CJP joints made by both welding electrodes showed satisfactory performance and were able to transfer the tensile flange forces higher than that corresponding to the measured tensile strength of HSA800 flange plates. However, it should be noted that, during fabrication, serious concerns about the welding efficiency and workability of the GMAW-based electrode were raised by a certified welder. The fracture occurred at the unbeveled (or vertical) interface between the weldment and the base metal when the GMAW-based electrode was used in the single-bevel joint, implying the possibility of insufficient melting. Thus, the FCAW-based electrode B is again recommended as the choice of welding electrode for HSA800 plates. The limited test data of this study implies that the V-groove CJP joint should be used in favor of the single bevel CJP joint, if possible.

Effects and Application Cases of Injection Molds by using DED type Additive Manufacturing Process (DED방식의 적층가공을 통한 금형으로의 응용사례 및 효과)

  • Kim, Woosung;Hong, Myungpyo;Kim, Yanggon;Suh, Chang Hee;Lee, Jongwon;Lee, Sunghee;Sung, Ji Hyun
    • Journal of Welding and Joining
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    • v.32 no.4
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    • pp.10-14
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    • 2014
  • Laser aided Direct Metal Tooling(DMT) process is a kind of Additive Manufacturing processes (or 3D-Printing processes), which is developed for using various commercial steel powders such as P20, P21, SUS420, H13, D2 and other non-ferrous metal powders, aluminum alloys, titanium alloys, copper alloys and so on. The DMT process is a versatile process which can be applied to various fields like the mold industry, the medical industry, and the defense industry. Among of them, the application of DMT process to the mold industry is one of the most attractive and practical applications since the conformal cooling channel core of injection molds can be fabricated at the slightly expensive cost by using the hybrid fabrication method of DMT technology compared to the part fabricated with the machining technology. The main objectives of this study are to provide various characteristics of the parts made by DMT process compared to the same parts machined from bulk materials and prove the performance of the injection mold equipped with the conformal cooling channel core which is fabricated by the hybrid method of DMT process.

Fabrication of semiconductor optical switch module using laser welding technique (반도체 광스위치 모듈의 제작 및 특성연구)

  • 강승구
    • Korean Journal of Optics and Photonics
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    • v.10 no.1
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    • pp.73-79
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    • 1999
  • Semiconductor optical switch modules of 1$\times$2, 1$\times$4, and 4$\times$4 types for 1550 nm optical communication systems were fabricated by using laser welding technique, embodying in 30-pin butterfly package. For better coupling efficiency between switch chip and optical fiber, tapered fibers of 10~15mm lens radii were used, which provided up to 60% optical coupling efficiency. With the help of new laser hammering process, we could recover the lost optical power almost completely up to average 82% of initially obtained power. The fabricated optical switch modules showed good thermal stability of less than 5% degradation even after 200 times thermal cycling test. The 2.5 Gbps optical transmission characteristics of the 4$\times$4 switch module showed low sensitivities of less than -30dB for all possible switching paths. The transmission penalties of 1$\times$2 switch module at $10^{-10}$ BER were 0.6dB and 0.7dB for 50Xm and 90 Km optical fibers, respectively.

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A study on the applicability of newly developed stainless steel for weight reduction of carbody of intermodal tram (인터모달 트램 차체 경량화를 위한 신개발 스테인레스 강재 적용성 연구)

  • Seo, Sung-il;Kim, Jeong-guk;Jung, Hyun-seung
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.17 no.3
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    • pp.457-463
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    • 2016
  • The newly developed super ductile duplex stainless steel (SDSS) has good strength and ductility, and it can be used to reduce weight and improve the fabrication efficiency of a carbody of a rolling stock. In this study, spot weldability tests were conducted to take advantage of SDDSS in a carbody for an intermodal tram. Specimens of various thickness (0.4 to 5.0 mm) were prepared to find the proper welding conditions, and tensile load tests were conducted to evaluate the tensile-shear strength of spot welded joints. Then, nugget diameters were measured to verify the quality. The tensile-shear strength was found to be proportional to the heat parameter. It was verified that the tensile-shear strengths and nugget sizes of the joints satisfy the standard requirements. The overall weldability tests confirmed that SDDSS can be used effectively for the carbody of an intermodal tram.

A Disparate Low Loss DC to 90 GHz Wideband Series Switch

  • Gogna, Rahul;Jha, Mayuri;Gaba, Gurjot Singh;Singh, Paramdeep
    • Transactions on Electrical and Electronic Materials
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    • v.17 no.2
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    • pp.92-97
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    • 2016
  • This paper presents design and simulation of wide band RF microswitch that uses electrostatic actuation for its operation. RF MEMS devices exhibit superior high frequency performance in comparison to conventional devices. Similar techniques that are used in Very Large Scale Integration (VLSI) can be employed to design and fabricate MEMS devices and traditional batch-processing methods can be used for its manufacturing. The proposed switch presents a novel design approach to handle reliability concerns in MEMS switches like dielectric charging effect, micro welding and stiction. The shape has been optimized at actuation voltage of 14-16 V. The switch has an improved restoring force of 20.8 μN. The design of the proposed switch is very elemental and primarily composed of electrostatic actuator, a bridge membrane and coplanar waveguide which are suspended over the substrate. The simple design of the switch makes it easy for fabrication. Typical insertion and isolation of the switch at 1 GHz is -0.03 dB and -71 dB and at 85 GHz it is -0.24 dB and -29.8 dB respectively. The isolation remains more than - 20 db even after 120 GHz. To our knowledge this is the first demonstration of a metal contact switch that shows such a high and sustained isolation and performance at W-band frequencies with an excellent figure-of merit (fc=1/2.pi.Ron.Cu =1,900 GHz). This figure of merit is significantly greater than electronic switching devices. The switch would find extensive application in wideband operations and areas where reliability is a major concern.

Fabrication of Through-hole Interconnect in Si Wafer for 3D Package (3D 패키지용 관통 전극 형성에 관한 연구)

  • Kim, Dae-Gon;Kim, Jong-Woong;Ha, Sang-Su;Jung, Jae-Pil;Shin, Young-Eui;Moon, Jeong-Hoon;Jung, Seung-Boo
    • Journal of Welding and Joining
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    • v.24 no.2
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    • pp.64-70
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    • 2006
  • The 3-dimensional (3D) chip stacking technology is a leading technology to realize a high density and high performance system in package (SiP). There are several kinds of methods for chip stacking, but the stacking and interconnection through Cu filled through-hole via is considered to be one of the most advanced stacking technologies. Therefore, we studied the optimum process of through-hole via formation and Cu filling process for Si wafer stacking. Through-hole via was formed with DRIE (Deep Reactive ion Etching) and Cu filling was realized with the electroplating method. The optimized conditions for the via formation were RE coil power of 200 W, etch/passivation cycle time of 6.5 : 6 s and SF6 : C4F8 gas flow rate of 260 : 100 sccm. The reverse pulsed current of 1.5 A/dm2 was the most favorable condition for the Cu electroplating in the via. The Cu filled Si wafer was chemically and mechanically polished (CMP) for the following flip chip bumping technology.