Fabrication of Through-hole Interconnect in Si Wafer for 3D Package |
Kim, Dae-Gon
(School of Advanced Materials Science and Engineering, Sungkyunkwan University)
Kim, Jong-Woong (School of Advanced Materials Science and Engineering, Sungkyunkwan University) Ha, Sang-Su (School of Advanced Materials Science and Engineering, Sungkyunkwan University) Jung, Jae-Pil (Department of Materials Science Engineering, Seoul University) Shin, Young-Eui (School of Mechancal Engineering, Chung-Ang University) Moon, Jeong-Hoon (Department of Electronic Packaging) Jung, Seung-Boo (School of Advanced Materials Science and Engineering, Sungkyunkwan University) |
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