A Disparate Low Loss DC to 90 GHz Wideband Series Switch |
Gogna, Rahul
(Discipline of Electronics & Electrical Engineering, Lovely Professional University)
Jha, Mayuri (Discipline of Electronics & Electrical Engineering, Lovely Professional University) Gaba, Gurjot Singh (Discipline of Electronics & Electrical Engineering, Lovely Professional University) Singh, Paramdeep (Discipline of Electronics & Electrical Engineering, Lovely Professional University) |
1 | N. E. McGruer, P. M. Zavracky, R. Morrison, S. Majumder, D. Potter, and M. Schirmer, Sensor Expo, (Cleveland, U.S.A., 1999). |
2 | C. Bozler, R. Drangmeister, S. Duffy,M. Gouker, J. Knecht, L. Kushner, R. Parr, S. Rabe, and L. Travis, IEEE MTT-S Int. Microwave Symp., 153 (2000). |
3 | M. Kim, J. B. Hacker, R. E. Mihailovich, and J. F. DeNatale, IEEE Microwave Wireless Compon. Lett., 11, 56 (2001). [DOI: http://dx.doi.org/10.1109/7260.914301] DOI |
4 | C. L. Goldsmith, J. Randall, S. Eshelman, T. H. Lin, D. Denniston, S. Chen, and B. Norvell, IEEE MTT-S Int. Microwave Symp. Dig., 1141 (1996). [DOI: http://dx.doi.org/10.1109/mwsym.1996.511231] DOI |
5 | C. L. Goldsmith, Z. Yao, S. Eshelman, and D. Denniston, IEEE Microwave Guided Wave Lett., 269 (1998). [DOI: http://dx.doi.org/10.1109/75.704410] DOI |
6 | S. Pacheco, C. T. Nguyen, and L. P. B. Katehi, IEEE MTT-S Int. Microwave Symp. Dig., 1569 (1998). [DOI: http://dx.doi.org/10.1109/mwsym.1998.700675] DOI |
7 | J. B. Muldavin and G. M. Rebeiz, IEEE Microwave Wireless Compon. Lett., 11, 373 (2001). [DOI: http://dx.doi.org/10.1109/7260.950765] DOI |
8 | S. C. Shen, D. Caruth, and M. Feng, Proc. IEEE GaAs IC Symp., 161 (2000). |
9 | G. M. Rebeiz, RF MEMS Theory, Design and Technology (JohnWiley & Sons, USA, 2003). |
10 | Navjot Khaira and Tejinder Singh, Proceedings of International Conference on Computing Sciences (2013). |
11 | Jorge M. Cabral, Andrew S. Holmes, Proceedings of IEEE MELECON (Malaga, Spain, 2006). [DOI: http://dx.doi.org/10.1109/melcon.2006.1653095] DOI |
12 | M. M. Shalaby, M. A. Abdelmoneum, and K. Saitou, IEEE Transactions on Industrial Electronics, 56, 1022 (2009). [DOI: http://dx.doi.org/10.1109/TIE.2009.2014671] DOI |
13 | R. Robin, S. Touati, K. Segueni, O. Millet, and L. Buchaillot, Proceedings of Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (Nice, France, 2008) p. 56. [DOI: http://dx.doi.org/10.1109/dtip.2008.4752952] DOI |
14 | C. Goldsmith, J. Randall, S. Eshelman, T. H. Lin, D. Dennistor, S. Chen, and B. Norvell, IEEE MTT-S International Microwave Symposium Digest, (San Francisco, CA, 1996) p. 1141. [DOI: http://dx.doi.org/10.1109/mwsym.1996.511231] DOI |
15 | C. L. Goldsmith, Z. Yao, S. Eshelman, and D. Denniston, IEEE Microwave Guided Wave Lett., 8, 269 (1998). [DOI: http://dx.doi.org/10.1109/75.704410] DOI |
16 | Z. J. Yao, S. Chen, S. Eshelman, D. Denniston, and C. L. Goldsmith, IEEE J. Microelectromech. Systems, 8, 129 (1999). [DOI: http://dx.doi.org/10.1109/84.767108] DOI |
17 | D. Bansal, A. Kumar, A. Sharma, P. Kumar and K. J. Rangra, Microsyst Technol, 20, 337 (2013). [DOI: http://dx.doi.org/10.1007/s00542-013-1812-1] |