• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.11-18
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• 2016

Today, wearable technology products are used in a wide range of consumer, healthcare, bio-medical, and industrial applications. The market for wearable technology products is expected to increase dramatically over the next several years. In addition, concerns for safety, performance and reliability of wearable products keep increasing and will be essential for widespread acceptance in the marketplace. Wearable smart devices, which are generally in contact with the human body and skin, are exposed to the risk of the electric shock, burn, and explosion. Therefore, the standardization of wearable devices in terms of human safety and reliability should be very important. Furthermore, the development of test method and test certification of the wearable products will be one of the key technology for mass production. Such standardization and certification will help consumers to choose the safest and best quality wearable devices and allow manufacturers to prove the safety and quality of their products, thereby helping them to gain a competitive technology. This paper discusses the current status of the wearable smart devices as well as the standardization and test certification applicable to wearable technology products.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.125-131
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• 2014

In order to develop stretchable substrates for wearable packaging applications, the variation behavior of elastic modulus was evaluated for transparent PDMS Sylgard 184 and black PDMS Sylgard 170 as a function of the base/curing agent mixing ratio. Both for Sylgard 184 and Sylgard 170, the true elastic modulus evaluated on a true stress-true strain curve was higher more than two times compared to the engineering elastic modulus obtained from an engineering stres-sengineering strain curve, and their difference became larger with increasing the stiffness of the PDMS. Sylgard 184 exhibited a maximum engineering elastic modulus of 1.74 MPa and a maximum true elastic modulus of 3.57 MPa at the base/curing agent mixing ratio of 10. A maximum engineering elastic modulus of 1.51 MPa and a maximum true elastic modulus of 3.64 MPa were obtained for Sylgard 170 at the base/curing agent mixing ratio of 2.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.23-36
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• 2019

Stretchable electronic systems have recently been gaining more and more attention because of their potential applications in various implements such as electronic skins and wearable/shape-deformable electronics. An essential factor of the stable stretchable device implementation is that all the elements constituting the system must have sufficient elasticity and exhibit stable performances even under repetitive stretching conditions. In this paper, we review the latest research results to secure the stable stretchability of electrodes among the various components of the system.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.9-17
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• 2017

In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.1
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• pp.1-10
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• 2016

Nowadays, the importance of role of the international standardization keeps increasing substantially. We have already known that international standards have a huge impact on many companies, industries and nations. So far, it has been thought that standardizations are needed after the new products come into the market and are mass-produced in order to encourage the use of the products, systems and services. Standardization will make the products more safe, efficient, and environmentally friendly for the users. However, in these days, a paradigm of the standardization has been changed. International standard becomes a tool for dominating global market and is the most important ingredients of the competitiveness and economic progress of the nation and enterprises. Many countries like Japan, Germany and U.S. use the standardization as an effective method to dominate the market and monopolized the new technologies. Therefore, worldwide competition for the standardization of the new technology become fierce. Korea is leading the technology in semiconductor field. However, activities of international standardization are not sufficient. In order to boost the standardization activities in Korea from industry, academia, and research institute, this paper briefly introduce the international standard organization and some critical issues for next-generation semiconductor memory such as flexible semiconductor, automobile semiconductor and wearable devices.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.15-20
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• 2012

In electronics industry, the coming electronic devices will be expected to be high integration and convergence electronics. And also, it will be expected that the coming electronics will be flexible, bendable and wearable electronics. Therefore, the demands and interests of bonding technology between flexible substrate and chip for mobile electronics, e-paper etc. have been increased because of weight and flexibility of flexible substrate. Considering fine pitch for high density and thermal damage of flexible substrate during bonding process, the micro solder bump technology for high density and low temperature bonding process for reducing thermal damage will be required. In this study, we researched on bonding technology of chip and flexible substrate by using 25um Cu pillar bumps and Sn-Bi solder bumps were formed by electroplating. From the our study, we suggest technology on Cu pillar bump formation, Sn-Bi solder bump formation, and bonding process of chip and flexible substrate for the coming electronics.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.21-29
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• 2021

Recently, semiconductor chips and electronic components are increasingly being used in IT devices such as wearable watches, autonomous vehicles, and smart phones. As a result, there is a growing concern about device malfunctions that may occur due to electromagnetic interference being entangled with each other. In particular, electromagnetic wave emissions from wearable or flexible smart devices have detrimental effects on human health. Therefore, flexible and transparent electromagnetic interference (EMI) shielding materials and films with high optical transmittance and outstanding shielding effectiveness have been gaining more attention. The EMI shielding films for flexible and transparent electronic devices must exhibit high shielding effectiveness, high optical transmittance, high flexibility, ultrathin and excellent durability. Meanwhile, in order to prepare this EMI shielding films, many materials have been developed, and results regarding excellent EMI shielding performance of a new materials such as carbon nano tube (CNT), graphene, Ag nano wire and MXene have recently been reported. Thus, in this paper, we review the latest research results to EMI shielding films for flexible and transparent device using the new materials.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.55-60
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• 2021

In order to produce wearable displays with high adhesion while maintaining flexible characteristics, the adhesive method using electro plating method was carried out. Laser lift-off (LLO) transcription was also used to remove sapphire substrates from LEDs bonded to fibers. Afterwards, the SEM and EDS data of the sample, which conducted the adhesion method using electro plating, confirmed that copper actually grows through the lattice of the fiber fabric to secure the light source and fiber. The adhesion characteristics of copper were checked using Universal testing machine (UTM). After plating adhesion, the characteristics of the LLO transcription process completed and the LED without the transcription process were compared using probe station. The electroluminescence (EL) according to the enhanced current was measured to check the characteristics of the light source after the process. As the current increases, the temperature rises and the bandgap decreases, so it was confirmed that the spectrum shifted. In addition, the change in the electrical characteristics of the samples according to the radius change is confirmed using probe station. The radius strain also had mechanical strength that copper could withstand bending stress, so the Vf variation was measured below 6%. Based on these results, it is expected that it will be applied to batteries, catalysts, and solar cells that require flexibility as well as wearable displays, contributing to the development of wearable devices.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.19-28
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• 2016

This paper presents an overview of selected advanced measurement technologies for the mechanical properties of polymers used for flexible and stretchable electronic packaging. Over the years, a variety of flexible and stretchable electronics have been developed due to their potential applications for next generation IT industry. To achieve more flexible and wearable devices for practical applications, the usage of polymeric components has been increased significantly. Therefore, accurate measurement of mechanical properties of the polymers is necessary in order to design mechanically reliable devices. However, the measurement has been challenging due to the soft nature and thin applications of polymers. Here, we describe novel measurement technologies of mechanical properties of polymers for flexible and stretchable electronics.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.15-22
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• 2019

Metallic nanowires (MNWs) have recently been considered as one of the most promising candidates for flexible electrodes of advanced electronics including wearable devices, electronic skins, and soft robotics, since they have high aspect ratio in physical shape, low percolation threshold, high ductility and optical transparency. Herein, we review the latest findings related to the MNWs and discuss the properties and potentials of this material that can be used in implementation of various advanced electronic devices.