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http://dx.doi.org/10.6117/kmeps.2014.21.4.125

Variation of Elastic Stiffness of Polydimethylsiloxane (PDMS) Stretchable Substrates for Wearable Packaging Applications  

Choi, Jung-Yeol (Department of Materials Science and Engineering, Hongik University)
Park, Dae-Woong (Department of Materials Science and Engineering, Hongik University)
Oh, Tae Sung (Department of Materials Science and Engineering, Hongik University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.21, no.4, 2014 , pp. 125-131 More about this Journal
Abstract
In order to develop stretchable substrates for wearable packaging applications, the variation behavior of elastic modulus was evaluated for transparent PDMS Sylgard 184 and black PDMS Sylgard 170 as a function of the base/curing agent mixing ratio. Both for Sylgard 184 and Sylgard 170, the true elastic modulus evaluated on a true stress-true strain curve was higher more than two times compared to the engineering elastic modulus obtained from an engineering stres-sengineering strain curve, and their difference became larger with increasing the stiffness of the PDMS. Sylgard 184 exhibited a maximum engineering elastic modulus of 1.74 MPa and a maximum true elastic modulus of 3.57 MPa at the base/curing agent mixing ratio of 10. A maximum engineering elastic modulus of 1.51 MPa and a maximum true elastic modulus of 3.64 MPa were obtained for Sylgard 170 at the base/curing agent mixing ratio of 2.
Keywords
Wearable devices; Wearable packaging; Stretchable substrate; PDMS; Stiffness; Elastic modulus;
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Times Cited By KSCI : 3  (Citation Analysis)
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