Browse > Article
http://dx.doi.org/10.6117/kmeps.2021.28.1.055

Fabrication of Fabric-based Wearable Devices with High Adhesion Properties using Electroplating Process  

Kim, Hyung Gu (Department of Chemicals Engineering, Chonnam National University)
Rho, Ho Kyun (Energy Convergence Core Facility, Chonnam National University)
Cha, Anna (Department of Chemicals Engineering, Chonnam National University)
Lee, Min Jung (Department of Chemicals Engineering, Chonnam National University)
Park, Jun-beom (Next generation LED research Center, Korea Photonics Technology Institute)
Jeong, Tak (Next generation LED research Center, Korea Photonics Technology Institute)
Ha, Jun-Seok (Department of Chemicals Engineering, Chonnam National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.28, no.1, 2021 , pp. 55-60 More about this Journal
Abstract
In order to produce wearable displays with high adhesion while maintaining flexible characteristics, the adhesive method using electro plating method was carried out. Laser lift-off (LLO) transcription was also used to remove sapphire substrates from LEDs bonded to fibers. Afterwards, the SEM and EDS data of the sample, which conducted the adhesion method using electro plating, confirmed that copper actually grows through the lattice of the fiber fabric to secure the light source and fiber. The adhesion characteristics of copper were checked using Universal testing machine (UTM). After plating adhesion, the characteristics of the LLO transcription process completed and the LED without the transcription process were compared using probe station. The electroluminescence (EL) according to the enhanced current was measured to check the characteristics of the light source after the process. As the current increases, the temperature rises and the bandgap decreases, so it was confirmed that the spectrum shifted. In addition, the change in the electrical characteristics of the samples according to the radius change is confirmed using probe station. The radius strain also had mechanical strength that copper could withstand bending stress, so the Vf variation was measured below 6%. Based on these results, it is expected that it will be applied to batteries, catalysts, and solar cells that require flexibility as well as wearable displays, contributing to the development of wearable devices.
Keywords
LED; Fabric; Electro plating; Laser lift off; Wearable display; Plating adhesion;
Citations & Related Records
연도 인용수 순위
  • Reference
1 S. Choi, S. Kwon, H. Kim, W. Kim, J. H. Kwon, M. S. Lim & K. C. Choi, "Highly Flexible and Efficient Fabric-based Organic Light-emitting Devices for Clothing-shaped Wearable Displays", Scientific reports, 7(1), 1-8 (2017).   DOI
2 Gupta, D. "Functional Clothing-Definition and Classification," Indian J. Fibre Text. Res. 36, 321 (2011)
3 Weng, W., Chen, P., He, S., Sun, X., & Peng, H, "Smart Electronic Textiles", Angewandte Chemie International Edition, 55(21), 6140-6169. (2016).   DOI
4 Cherenack, K. & van Pieterson, L, "Smart Textiles: Challenges and Opportunities", J. Appl. Phys. 112(09), 091301 (2012)   DOI
5 S. Kwon, H. Kim, S. Choi, Jeong, E. G., Kim, D., Lee, S., Choi, K. C "Weavable And Highly Efficient Organic Lightemitting Fibers for Wearable Electronics: A Scalable, Lowtemperature Process", Nano letters, 18(1), 347-356 (2018).   DOI
6 Y. J. Kang, H. Chung, M. S. Kim & W Kim, "Enhancement of CNT/PET Film Adhesion by Nano-scale Modification for Flexible All-solid-state Supercapacitors", Applied Surface Science, 355, 160-165 (2015).   DOI
7 Zhang, Z., Guo, K., Li, Y., Li, X., Guan, G., Li, H Peng, H "A Colour-tunable, Weavable Fibre-shaped Polymer Lightemitting Electrochemical Cell", Nature Photonics, 9(4), 233-238 (2015).   DOI
8 Yin, D., Chen, Z. Y., Jiang, N. R., Liu, Y. F., Bi, Y. G., Zhang, X. L, Sun, H. B "Highly Transparent and Flexible Fabric-Based Organic Light Emitting Devices for Unnoticeable Wearable Displays", Organic Electronics, 76, 105494 (2020).   DOI
9 Han, F., Li, J., Zhao, S., Zhang, Y., Huang, W., Zhang, Wong, C. P., "A Crack-based Nickel@ Graphene-wrapped Polyurethane Sponge Ternary Hybrid Obtained by Electrodeposition for Highly Sensitive Wearable Strain Sensors", Journal of Materials Chemistry C, 5(39), 10167-10175 (2017).   DOI
10 Zhu, H. P., Zhu, Q. S., Zhang, X., Liu, C. Z., & Wang, J. J "Microvia Filling by Copper Electroplating using a Modified Safranine T as a Leveler", Journal of The Electrochemical Society, 164(9), D645 (2017).   DOI
11 Davis, J. R. (Ed.), "Copper and Copper Alloys", 446p, ASM international, Netherlands (2001).
12 Farm, E., Kemell, M., Santala, E., Ritala, M., & Leskela, M, "Selective-area atomic Layer Deposition using Poly (Vinyl pyrrolidone) as a Passivation Layer", Journal of the Electrochemical Society, 157(1), K10 (2009).   DOI
13 Pan, S., Yang, Z., Chen, P., Deng, J., Li, H., & Peng, H, "Wearable Solar Cells by Stacking Textile Electrodes", Angewandte Chemie, 126(24), 6224-6228 (2014).   DOI
14 J. Cho, C. Sone, Y. Park, & E. Yoon, "Measuring the Junction Temperature of III-nitride Light Emitting Diodes using Electro-luminescence Shift", Physica Status Solidi (A), 202(9), 1869-1873 (2005).   DOI
15 S. K. Hyun, Nakajima, H., Boyko, L. V., & Shapovalov, V. I, "Bending Properties of Porous Copper Fabricated by Unidirectional Solidification", Materials Letters, 58(6), 1082-1086 (2004).   DOI
16 Kim, J., Campbell, A. S., de Avila, B. E. F., & Wang, J, "Wearable Biosensors for Healthcare Monitoring", Nature biotechnology, 37(4), 389-406 (2019).   DOI
17 H. G. Kim, H. K. Rho, A. Cha, M. J. Lee, &J. S Ha, "CNTNi-Fabric Flexible Substrate with High Mechanical and Electrical Properties for Next-generation Wearable Devices", Journal of the Microelectronics and Packaging Society, 27(2), 39-44 (2020)   DOI
18 Saraswat, J., & Bhattacharya, P. P "Effect of Duty Cycle on Energy Consumption in Wireless Sensor Networks", International Journal of Computer Networks & Communications, 5(1), 125 (2013).   DOI
19 Corbishley, P., & Rodriguez-Villegas, E, "Breathing Detection: Towards a Miniaturized, Wearable, Battery-operated Monitoring System", IEEE Transactions on Biomedical Engineering, 55(1), 196-204 (2007).   DOI
20 Suh, S. E., & Roh, J. S, "A Study on Smart Fashion Product Development Trends," The Research Journal of the Costume Culture, 23(6), 1097-1115 (2015).   DOI
21 De Rossi, D., Della Santa, A., & Mazzoldi, A, "Dressware: Wearable Hardware", Materials Science and Engineering: C, 7(1), 31-35 (1999).   DOI
22 J. H. Lee, J. Y. Song, S. M. Kim, Y. J. Kim, & A. Y Park, "Development of Polymer Elastic Bump Formation Process and Bump Deformation Behavior Analysis for Flexible Semiconductor Package Assembly", Journal of the Microelectronics and Packaging Society, 26(2), 31-43 (2019).   DOI
23 Gu, J. F., Gorgutsa, S., & Skorobogatiy, M "Soft capacitor Fibers using Conductive Polymers for Electronic Textiles", Smart Materials and Structures, 19(11), 115006 (2010).   DOI
24 I. M. Koo, K. Jung, J. C. Koo, J. D. Nam, Y. K. Lee, & H. R Choi, "Development of Soft-actuator-based Wearable Tactile Display", IEEE Transactions on Robotics, 24(3), 549-558 (2008).   DOI
25 Wang, X., Liu, B., Liu, R., Wang, Q., Hou, X., Chen, Shen, G, "Fiber-based Flexible All-solid-state Asymmetric Supercapacitors for Integrated Photodetecting System", Angewandte Chemie, 126(7), 1880-1884 (2014).   DOI
26 S. J. Oh, B. S. Ma, H. J. Kim, C. Yang, & T. S Kim, "Measurement of Mechanical Properties of Thin Film Materials for Flexible Displays", Journal of the Microelectronics and Packaging Society, 27(3), 77-81 (2020)   DOI
27 Yu, X. G., Li, Y. Q., Zhu, W. B., Huang, P., Wang, T. T., Hu, N., & Fu, S. Y, "A Wearable Strain Sensor Based on a car-Bonized Nano-sponge/silicone Composite for Human Motion Detection", Nanoscale, 9(20), 6680-6685 (2017).   DOI
28 Senthilkumar, S. T., & Selvan, R. K, "Fabrication and Performance Studies of a Cable-type Flexible Asymmetric Supercapacitor", Physical Chemistry Chemical Physics, 16(29), 15692-15698 (2014).   DOI
29 Engin, M., Demirel, A., Engin, E. Z., & Fedakar, M, "Recent Developments and Trends in Biomedical Sensors", Measurement, 37(2), 173-188 (2005).   DOI