Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Technical Trends of Flexible, Transparent Electromagnetic Interference Shielding Film

유연한 투명 전자기 간섭 차폐 필름의 기술개발 동향

  • Lim, Hyun-Su (School of Advanced Materials Engineering, Jeonbuk Naional University) ;
  • Oh, Jung-Min (School of Advanced Materials Engineering, Jeonbuk Naional University) ;
  • Kim, Jong-Woong (School of Advanced Materials Engineering, Jeonbuk Naional University)
  • 임현수 (전북대학교 신소재공학부) ;
  • 오정민 (전북대학교 신소재공학부) ;
  • 김종웅 (전북대학교 신소재공학부)
  • Received : 2021.03.08
  • Accepted : 2021.03.30
  • Published : 2021.03.30
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Abstract

Recently, semiconductor chips and electronic components are increasingly being used in IT devices such as wearable watches, autonomous vehicles, and smart phones. As a result, there is a growing concern about device malfunctions that may occur due to electromagnetic interference being entangled with each other. In particular, electromagnetic wave emissions from wearable or flexible smart devices have detrimental effects on human health. Therefore, flexible and transparent electromagnetic interference (EMI) shielding materials and films with high optical transmittance and outstanding shielding effectiveness have been gaining more attention. The EMI shielding films for flexible and transparent electronic devices must exhibit high shielding effectiveness, high optical transmittance, high flexibility, ultrathin and excellent durability. Meanwhile, in order to prepare this EMI shielding films, many materials have been developed, and results regarding excellent EMI shielding performance of a new materials such as carbon nano tube (CNT), graphene, Ag nano wire and MXene have recently been reported. Thus, in this paper, we review the latest research results to EMI shielding films for flexible and transparent device using the new materials.

Keywords

References

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