• 한국신뢰성학회지:신뢰성응용연구
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• 제16권1호
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• pp.26-31
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• 2016

Purpose: The purpose of this study was to investigate the effect of grinding process and thickness on the fracture strength of silicon die used for semiconductor substrate. Method: Silicon wafers with different thickness from $200{\mu}m$ to $50{\mu}m$ were prepared by chemical mechanical polishing (CMP) and dicing before grinding (DBG) process, respectively. Fracture load was measured by point load test for 50 silicon dies per each wafer. Results: Fracture strength at the center area was lower than that at the edge area of the wafer fabricated by DBG process, while random distribution of the fracture strength was observed for the CMPed wafer. Average fracture strength of DBGed specimens was higher than that of the CMPed ones for the same thickness of wafer. Conclusion: DBG process can be more helpful for lowering fracture probability during the semiconductor fabrication process than CMP process.

• 한국정밀공학회지
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• 제13권6호
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• pp.45-51
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• 1996

Silicon wafers are required to be finished under the roughness of nanometer order for the subsequent chip fabrication processes. Recently, the finish grinding techniques have been researched for the improvement of accuracy and surface roughness simultaneously. Among them, the grinding technique using fine abrasive has been known as an easily accessible method. However, the manufacture of the fine grit grinding wheel has been very difficult because of the coherence of the grits. In this paper, the development of the ultrafine grit silica($SiO_2$) grinding wheel by the combination of the binder coating and the vacuum forming techniques is reported. And, the mechanochemical removal effects of the grinding conditions are discussed. Finally, a successful result of Ra O.4nm. Rmax 4nm in the ground surface roughness of a 6 inch silicon wafer was achieved.

• 반도체디스플레이기술학회지
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• 제16권3호
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• pp.47-52
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• 2017

Solar cell industry requires high technologies to stabilize apparatuses for the wafer manufacturing. Vibrations of squaring & grinding machines are one of the most critical factors for causing residual stresses of ingots, which are the main reasons of the breakage in the following processes such as wire sawing, cleaning, and modularity. In this study, the structure of a squaring & grinding machine has been analyzed through experiments and computer simulations to figure out the ways to suppress the vibrations effectively, and further to minimize the breakage of wafers. The result shows that simple design changes of applying a few ribs can improve the stability of the machine.

• 한국정밀공학회지
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• 제29권12호
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• pp.1285-1289
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• 2012

This study has been focused on application of ELID lapping process for mirror-surface machining of sapphire wafer. Sapphire wafer is a superior material with optic properties of high performance as light transmission, thermal conductivity, hardness and so on. High effective surface machining technology is necessary to use sapphire as various usages. The interval ELID lapping process has been set up for lapping of the sapphire material. According to the ELID lapping experimental results, it shows that 12.5 kg of load for lapping is most pertinent to ELID lapping. the surface of sapphire can be eliminated by metal bonded wheel with micron abrasives and the surface roughness of 60 nmRa can be gotten using grinding wheel of 2,000 mesh in 4.5 um, depth of cut. In this study, the chemical experiments after ELID grinding also has been conducted to check chemical reaction between workpiece and grinding wheel on ELID grinding process. It shows that the chemical reaction has not happened as the results of the chemical experiments.

• 한국기계가공학회지
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• 제12권4호
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• pp.75-80
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• 2013

Single crystal sapphire being used in high technology industry is a brittle material with a high hardness and excellent physical properties. ELID(Electrolytic In-Process Dressing) grinding technology was applied to material removal machining process of single crystal sapphire wafer. Ultrasonic vibration which added to material using ultrasonic table was adopted to efficient ELID grinding of sapphire materials. The evaluation of the ground surface of single crystal sapphire wafer was carried out by means of surface measuring by using AFM(Atomic Force Microscope), surface roughness tester and optical microscope device. As the results of experiment, it was shown that more efficient grinding was conducted when using ultrasonic table. In case of using #170 grinding wheel, surface roughness of ELID ground specimen in using ultrasonic table was superior to ELID ground specimen without ultrasonic table. However, In case of using #2000 grinding wheel, surface roughness of ELID ground specimen in using ultrasonic table was inferior to ELID ground specimen without ultrasonic table.

• 반도체디스플레이기술학회지
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• 제15권1호
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• pp.56-64
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• 2016

It is generally accepted that the surface quality of wafer edge is mostly damaged by the vibrations of the edge grinding machine. The surface quality of wafer edge is supposed to be the most dominant factor of the cracks, scratches, burrs and chips on the edge surfaces, which are the main defects of the wafers. In this study, the structure of a wafer edge grinder has been investigated through the frequency response experiment and the computer simulation to find ways to suppress the vibrations from the structure. The main reasons of the structural vibrations were analyzed. And further the design alterations were deduced from the results of the experiment and the simulation, and applied to the machine to check the effects of those alterations and to eventually improve the structural stability. The result shows that the machine can have much improved stability with relatively simple design changes.

• 한국정밀공학회지
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• 제19권6호
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• pp.145-154
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• 2002

CMP (Chemical mechanical polishing) process was used to control the fine grinding process induced mechanical damage of Cz Silicon wafer. Characterization of mechanical damage was carried out using Nomarski microscope, magic mirror and also using angle lapping and lifetime scanner evaluation after heat treatment. Magic mirror and lifetime scanner were very useful for the residual damage pattern characterization and CMP process was effective on the reduction of fine grinding induced mechanical damage.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1995년도 추계학술대회 논문집
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• pp.61-64
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• 1995

Grinding has been adapted as a finishing process,which can carry out form and surface integrity at the same time. Recently, high efficient and precise grinding technique is required bacause the needs for functional parts such as silicon wafer,ceramic,and electric materials are increasing. Accordingly, the development of grinding wheel appropriate to that purpose is very important. So, in this paper we newly developed a diamond grinding wheel by applying the superior characteristics of spheroidal graphite of the cast iron sintered product. Especially, a electric resistance sintering method was applied in which rapid heat treatment is possible. Finally, we have achieved successful results that the grinding wheel has high hardness,durability and grinding ability,and satisfies above conditions.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.46-51
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• 2002

A grinding technology is very essential to finish the surface of IT and BT industrial application parts such as wafer, optical connection part and lenses etc. However the finding machine has bead depended on imports. Especially, it is completely imported for machining high precision part relevant to domestic electric and communicational industries. The amount to import grinding machine is about $110milions. It takes about 35% of total import amount of all the machine tools. A domestic finder manufacturer is a very small-scaled bussinessman and research facilities is poor. Recently, it is increasing to demand high speed and precision grinding technology because it brings cost down and value added up. Its further study will be something related to inteligent grinding system fur value added and high precision part. It will make domestic grinding technology to its advanced country level.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.81-85
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• 2005

In this paper, the structural design optimization of a wafer grinding machine using a multi-step optimization with genetic algorithm is presented. The design problem, in this study, is to find out the optimum configuration and dimensions of structural members which minimize the static compliance, the dynamic compliance, and the weight of the machine structure simultaneously under several design constraints. The first design step is shape optimization, in which the best structural configuration is found by getting rid of structural members that have no contributions to the design objectives from the given initial design configuration. The second and third steps are sizing optimization. The second design step gives a set of good design solutions having higher fitness for lightweight and minimum static compliance. Finally the best solution, which has minimum dynamic compliance and weight, is extracted among those good solution set. The proposed design optimization method was successfully applied to the structural design optimization of a high precision wafer grinding machine. After optimization, both static and dynamic compliances are reduced more than $92\%\;and\;93\%$ compared with the initial design, which was designed empirically by experienced engineers. Moreover the weight of the optimized structure are also slightly reduced than before.