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Design Alterations of a Semiconductor Wafer Edge Grinder for the Improved Stability  

Park, Yu Ra (Graduate School, Kumoh National Institute of Technology)
Ro, Seung Hoon (Dept. of Mechanical System Engineering, Kumoh National Institute of Technology)
Kim, Young Jo (Graduate School, Kumoh National Institute of Technology)
Kil, Sa Geun (Graduate School, Kumoh National Institute of Technology)
Kim, Geon Hyeong (Graduate School, Kumoh National Institute of Technology)
Shin, Yun Ho (Graduate School, Kumoh National Institute of Technology)
Publication Information
Journal of the Semiconductor & Display Technology / v.15, no.1, 2016 , pp. 56-64 More about this Journal
Abstract
It is generally accepted that the surface quality of wafer edge is mostly damaged by the vibrations of the edge grinding machine. The surface quality of wafer edge is supposed to be the most dominant factor of the cracks, scratches, burrs and chips on the edge surfaces, which are the main defects of the wafers. In this study, the structure of a wafer edge grinder has been investigated through the frequency response experiment and the computer simulation to find ways to suppress the vibrations from the structure. The main reasons of the structural vibrations were analyzed. And further the design alterations were deduced from the results of the experiment and the simulation, and applied to the machine to check the effects of those alterations and to eventually improve the structural stability. The result shows that the machine can have much improved stability with relatively simple design changes.
Keywords
Edge grinding machine; Dynamic Properties; Design Alterations; Vibration Suppression; Stability improvement;
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