A Study on the ELID Grinding Properties of Single Crystal Sapphire Wafer using Ultrasonic Table

초음파 테이블을 이용한 단결정 사파이어 웨이퍼의 ELID 연삭가공 특성 연구

  • Hwang, JinHa (Graduate School of Pusan National University, Dept. of Nano Fusion Technology) ;
  • Kwak, Tae-Soo (Gyeongnam National Univ. of Sci. and Tech., Dept. of Mechanical Engineering) ;
  • Lee, Deug-Woo (Pusan National Univ., Dept. of Nanomechatronics Engineering) ;
  • Jung, Myung-Won (Graduate School of Gyeongnam National Univ. of Sci. and Tech., Dept. of Mechanical Engineering) ;
  • Lee, Sang-Min (Graduate School of Pusan National University, Dept. of Nano Fusion Technology)
  • Published : 2013.08.30

Abstract

Single crystal sapphire being used in high technology industry is a brittle material with a high hardness and excellent physical properties. ELID(Electrolytic In-Process Dressing) grinding technology was applied to material removal machining process of single crystal sapphire wafer. Ultrasonic vibration which added to material using ultrasonic table was adopted to efficient ELID grinding of sapphire materials. The evaluation of the ground surface of single crystal sapphire wafer was carried out by means of surface measuring by using AFM(Atomic Force Microscope), surface roughness tester and optical microscope device. As the results of experiment, it was shown that more efficient grinding was conducted when using ultrasonic table. In case of using #170 grinding wheel, surface roughness of ELID ground specimen in using ultrasonic table was superior to ELID ground specimen without ultrasonic table. However, In case of using #2000 grinding wheel, surface roughness of ELID ground specimen in using ultrasonic table was inferior to ELID ground specimen without ultrasonic table.

Keywords

References

  1. K. I. Kim, Y. K. Ahn, J. G. Seo, J. W. Park, "Comparison of flux and natural sapphire after heat-treatment", J. of the Korean Crystal Growth and Crystal Technology, Vol. 19, No. 3, pp. 152-158, 2009.
  2. J. S. Kwak, G. H. Kim, Y. C. Lee, H. Ohmori, T. S. Kwak, "properties of ELID mirror-surface grinding for single crystal sapphire optics", J. of the KSPE, Vol. 29, No. 3, pp. 247-252, 2012. https://doi.org/10.7736/KSPE.2012.29.3.247
  3. H. Ohmori, T. Nakagawa, "Mirror Surface Grinding of Silicon Wafer with Electrolytic In-process Dressing", Annals of the Int. Academy for Prod. Eng., Vol. 39, No. 1, pp. 329-332, 1990.
  4. H. Ohmori, T. Nakagawa, "Analysis of Mirror Surface Generation of Hard and Brittle Materials by ELID(Electrolytic In-Process Dressing) Grinding with Superfine Grain Metallic Bond Wheel", Annals of the Int.. Academy for Prod. Eng, Vol. 44, No. 1, pp. 287-290, 1995.
  5. H. Ohmori, K. Katahira, "Electrolytic in-process Dressing-grinding of Ceramics", J. of the Korean Ceramic Society, Vol. 9, No. 6, pp. 37-41, 2006.
  6. S. W. Lee, H. J. Choi, B. G. Lee, "A Study on Micro Ultrasonic machining for Brittle Material Using Ultrasonic vibration", 2001 KSPE autumn conference, pp. 969-972, 2001.
  7. C. S. Lee, J. Y. Kim, H. D. Jeong, Y. J. Choi, S. W. Lee, H. J. Choi, "Development of ultrasnoic grinding system based on wear theory", 2011 KSPE spring conference, pp. 697-698, 2011.
  8. G. D. Kim, B. G. Loh, J. S. Kim, "Development of Ultra-precision Ultrasonic Surface Machining Device Using Cyclic Elliptical Cutting Motion of a Couple of Piezoelectric Material", J. of the KSMPE, Vol. 5, No. 3, pp. 29-35, 2006.
  9. H. U. Kim, D. H. Hwang, J. K. Park, S. H. Cho, M. G. Lee, "Design of High frequency Vibration Mechanism with PZT actuator for Ultraprecision Laser Machining", J. of the KSMTE, Vol. 19, No. 3, pp. 419-425, 2010.
  10. S. K. Kim, Y. H. Seo, D. S. Choi, K. H. Hwang, "Fabrication and Electro-Mechanical Characteristic Analysis of Piezoelectric Micro-transformers", J. of the KSME, Vol. 32, No. 3, pp. 231-234, 2008.