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http://dx.doi.org/10.7736/KSPE.2012.29.12.1285

A Study on Characteristics of ELID Lapping for Sapphire Wafer Material  

Kwak, Tae-Soo (Department of Mechanical Engineering, Gyeongnam National University of Science and Technology)
Han, Tae-Sung (Department of Mechanical Engineering, Gyeongnam National University of Science and Technology)
Jung, Myung-Won (Department of Mechanical Engineering, Gyeongnam National University of Science and Technology)
Kim, Yunji (Materials Fabrication Laboratory, RIKEN)
Uehara, Yosihiro (Materials Fabrication Laboratory, RIKEN)
Ohmori, Hitoshi (Materials Fabrication Laboratory, RIKEN)
Publication Information
Journal of the Korean Society for Precision Engineering / v.29, no.12, 2012 , pp. 1285-1289 More about this Journal
Abstract
This study has been focused on application of ELID lapping process for mirror-surface machining of sapphire wafer. Sapphire wafer is a superior material with optic properties of high performance as light transmission, thermal conductivity, hardness and so on. High effective surface machining technology is necessary to use sapphire as various usages. The interval ELID lapping process has been set up for lapping of the sapphire material. According to the ELID lapping experimental results, it shows that 12.5 kg of load for lapping is most pertinent to ELID lapping. the surface of sapphire can be eliminated by metal bonded wheel with micron abrasives and the surface roughness of 60 nmRa can be gotten using grinding wheel of 2,000 mesh in 4.5 um, depth of cut. In this study, the chemical experiments after ELID grinding also has been conducted to check chemical reaction between workpiece and grinding wheel on ELID grinding process. It shows that the chemical reaction has not happened as the results of the chemical experiments.
Keywords
Sapphire Wafer; ELID Grinding; Material Removal Rate; Interval ELID Lapping; Surface Roughness;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
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