• Journal of Welding and Joining
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• 제21권5호
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• pp.534-539
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• 2003

An efficient soldering process using the longitudinal ultrasonic vibration is introduced in this work for electronic packaging. The effects of the process parameters such as the ultrasonic frequency, amplitude, dimension of the metal bump and solder are analyzed through a viscoelastic lumped model. The viscoelastic properties of the eutectic solder were measured for calculation and evaluation of heat generation capability of the solder. Experiments were conducted to verify the possibility of the proposed ultrasonic soldering method by inserting the Cu and Au bumps into the solder block. Localized heating due to ultrasonic vibration melts the solder near the metal bump, which demonstrates the applicability of the ultrasonic soldering method to the high-density electronic packaging.

• 한국공작기계학회논문집
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• 제13권2호
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• pp.104-111
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• 2004

Ultrasonic machining is a non-thermal, non-chemical, md non-electorial material removal process, and thus results in minimum modifications in mechanical properties of the brittle material during the process. Also, ultrasonic machining is a non-contact process that utilize ultrasonic vibration to impact a brittle material. In this research characteristics of micro-hole machining for brittle materials by ultrasonic machining(USM) process have been investigated. And the effect of ultrasonic vibration on the machining conditions is analyzed when machining fir non-conductive brittle materials using tungsten carbide tools with a view to improve form and machining accuracy.

• Journal of Advanced Marine Engineering and Technology
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• 제27권5호
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• pp.590-599
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• 2003

In this study. object transport method based on ultrasonic flexural vibration is presented. Ultrasonic vibration generates ultrasonic traveling waves on the surface of elastic medium. Objects are transported through the interaction with traveling waves propagating in medium. Two types of transport methods are studied： frictional drive and acoustic levitation. With frictional drive, objects are transported in contact with the beam in the opposite direction of wave propagation whereas with acoustic levitation, objects are acoustically levitated above the beam surface and transported in the wave propagation direction. Transport characteristics are experimentally investigated using objects of different shapes and sizes. The transition from acoustic levitation mode to frictional drive mode is also examined. and it is found to occur when the ratio of mass to area of an object exceeds the threshold ratio of mass to area. It is envisaged that this feasibility study will serve as a stepping-stone for ultrasonic vibration to become an effective industrial material handling device in the future.

• 소성∙가공
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• 제23권7호
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• pp.413-418
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• 2014

The current study presents experimental and numerical results on the effect of ultrasonic vibrations on a cylindrical cup drawing of a cold rolled steel sheet(SPCC). An experimental apparatus, which can superimpose high frequency oscillations during deep drawing, was constructed by installing on the tooling ultrasonic vibration generators consisting of a piezoelectric transducer and a resonator. Conventional and vibration-assisted cylindrical deep drawing tests were conducted for various drawing ratios, and the limiting drawing ratios(LDR) for both methods were compared. To evaluate quantitatively the contribution from the ultrasonic vibrations to the reduction of friction between tools and material finite element analyses were conducted. Through a series of parametric analyses, the friction coefficients, which minimized the differences of punch load data between the experiments and simulations, were determined. The results show that the application of ultrasonic vibration effectively improves the LDR by reducing the friction between the tools and the material.

• International Journal of Precision Engineering and Manufacturing-Green Technology
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• 제5권5호
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• pp.571-581
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• 2018

In the present study, monitoring of elliptical vibration cutting process by utilizing internal data in the ultrasonic elliptical vibration device without external sensors such as a dynamometer and displacement sensor is investigated. The internal data utilized here is the change of excitation frequency, i.e. resonant frequency of the device, voltages applied to the piezoelectric actuators composing the device, and electric currents flowing through the actuators. These internal data change automatically in the elliptical vibration control system in order to keep a constant elliptical vibration against the change of the cutting process. Correlativity between the process and the internal data is described by using a vibration model of ultrasonic elliptical vibration cutting and verified by several experiments, i.e. planing and mirror surface finishing of hardened die steel carried out with single crystalline diamond tools. As a result, it is proved that it is possible to estimate the elements of elliptical vibration cutting process, e.g. tool wear and machining load, which are important for stable cutting in such precision machining.

• 한국정밀공학회지
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• 제17권2호
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• pp.43-50
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• 2000

A CBN wheel was used for the highly efficient and precision grinding of the mold material(STD11). The grinding form accuracy by a CBN wheel is very excellent due to its low wheel wear, but grinding fragments resemble fine powders rather chips. A fine powders by this fragmentation can easily get attached to the wheel surface and therefore causing a loading. In order to prevent this fragmentation phenomena, the alumina stick is use to processing. Because the dressing with alumina stick should be interrupted for a processing, the automation of the processing and high productivity was very difficult. The investigation on the effect of Ultrasonic In-Process Dressing(ULID) on the grinding characteristics focuses in this Paper. This ULID method is that ultrasonic vibration in my Position of wheel is used to remove impurities on the wheel surface. Finally, the rate of surface roughness change in grinding by the ULID method was less than grinding without ultrasonic vibration. Loading phenomena by the ULID method were more prevented than grinding without ultrasonic vibration.

• 한국정밀공학회지
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• 제13권11호
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• pp.38-45
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• 1996

In recent years, ultrasonic has been widely applied in measurement and industrial fields and its application range has been expanded as a result of continuous research and development. Wire Bonding Machine, an instrument fabricating semi-conductor, makes use of ultrasonic bonding method. Specially, the method utilizes the longitudinal vibration of ultrasonic transducer composed of piezoelectric vibrator and horn. This work investigates the design conditions affecting the dynamic characteristics through the theretical and experimental analysis. It conducts separately the system identification of piezoelectric vibrator in time domain and the modal analysis of horn in frequency domain. The integrated modeling is conducted via a combbination of dynamic identification of piezoelectric vibrator and theroretical analysis of horn. Then comparison is made for theroretical and experimental results of the dynamic characteristics of the ultrasonic transducer comprised of piezoelectric vibrator and horn. Form the results of the comparison we develop the design technique of ultrasonic transducer using dynamic characteristics analysis and propose the possibility of ultrasonic bonding considering the optimal conditions for the longitudinal vibration of ultrasonic transducer and other conditions.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2007년도 추계학술대회논문집
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• pp.1241-1246
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• 2007

In recent years, the semiconductor industry and the optical industry are developed rapidly. The recent demands have expanded for optical components such as the optical lens, the optical semiconductor and the measuring instrument. Object transport systems are driven typically by the magnetic field and the conveyer belt. Recent industry requires more faster and efficient transport system. However, conventional transport systems are not adequate for transportation of optical elements and semiconductors. The conveyor belts can damage precision optical elements by the contact force and magnetic systems can destroy the inner structure of semiconductor by the magnetic field. In this paper, the levitation transport system using ultrasonic wave is developed for transporting precision elements without damages. The steady state flexural vibration of the beam is expressed using Euler-Bernoulli beam theory. The transport direction of an object is examined according to phase difference and frequency. The theoretical results are verified by experiments.

• 한국정밀공학회지
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• 제22권12호
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• pp.198-204
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• 2005

For precise micro V-grooving, ultrasonic elliptical vibration cutting (UEVC) is proposed using two parallel piezoelectric actuators, which are energized by sinusoidal voltages with a phase difference of 90 degrees. Experimental setup is composed of stacked PZT actuators, a single crystal diamond cutting tool, and a precision motorized xyz stage. It is found that the chip formed in the process of UEVC is discontinuous because of the periodic contacts and non-contacts occurring between the tool and workpiece. It is experimentally observed that the cutting force in the process of UEVC significantly reduces compared to the ordinary non-vibration cutting. In addition, the creation of burr during UEVC is significantly suppressed, which is attributable to the decrease in the specific cutting energy.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2000년도 추계학술대회논문집
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• pp.720-725
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• 2000

A new ultrasonic pulse-echo technique was developed and described for vibration measurement of the suspension assembly in hard disk drives. The method is based upon the difference in magnitude of two consecutive reflection waves from a moving object(suspension), while the traditional ultrasonic vibrometer uses the phase shift of the reference wave and the reflection wave. A cone-shape delay line is designed to access the small structure. A simple mathematical model is presented and analyzed with experimental results to show the feasibility of the method. The advantages of this ultrasonic vibration measurement method are relatively high resolution, low cost, and ease of implementation comparing with the Laser Doppler vibrometer.