Browse > Article

Modeling of Soldering Process using Longitudinal Ultrasonic  

김정호 (한국과학기술원 기계공학과)
이지혜 (한국과학기술원 기계공학과)
유중돈 (한국과학기술원 기계공학과)
최두선 (한국기계연구원 정밀기계연구부)
Publication Information
Journal of Welding and Joining / v.21, no.5, 2003 , pp. 534-539 More about this Journal
Abstract
An efficient soldering process using the longitudinal ultrasonic vibration is introduced in this work for electronic packaging. The effects of the process parameters such as the ultrasonic frequency, amplitude, dimension of the metal bump and solder are analyzed through a viscoelastic lumped model. The viscoelastic properties of the eutectic solder were measured for calculation and evaluation of heat generation capability of the solder. Experiments were conducted to verify the possibility of the proposed ultrasonic soldering method by inserting the Cu and Au bumps into the solder block. Localized heating due to ultrasonic vibration melts the solder near the metal bump, which demonstrates the applicability of the ultrasonic soldering method to the high-density electronic packaging.
Keywords
Ultrasonic soldering process; Longitudinal vibration; Viscoelastic lumped model; Localized heating; Electronic packaging;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 /
[ R.M.Christensen ] / Theory of Viscoelasticity
2 Ultrasonic welding of thermoplastics in the near-field /
[ A.Benatar;V.E.Raman;K.N.Satiner ] / Polymer Engineering and Science   DOI
3 Fluxless thermosonic bonding of Sn-3.5Ag solder bump filp chip /
[ S.M.Hong;C.S.Kang;J.P.Jung ] / J. of Korea Inst. Met. & Mater.   과학기술학회마을
4 Thermosonic flip-chip bonding using longitudinal ultrasonic vibration /
[ Q,Tan ] / IEEE Trans. on Components, Packaging and Manufacuring Tech.   DOI   ScienceOn
5 Ultrasonic welding /
[ J.B.Jones;J.J.Powers ] / Welding Journal
6 Polymer adhesion by ultrasonic welding /
[ E.Sancaktar ] / Journal of Adhesion Science and Technology   DOI   ScienceOn
7 /
[ R.S.Lakes ] / Visoelastic Solids