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Micro Hole Machining for Ceramics ($Al_2O_3$) Using Ultrasonic Vibration  

박성준 (연세대학교 나노과학기술연구단)
이봉구 (연세대학교 대학원 기계공학)
최헌종 (한국생산기술연구원)
Publication Information
Transactions of the Korean Society of Machine Tool Engineers / v.13, no.2, 2004 , pp. 104-111 More about this Journal
Abstract
Ultrasonic machining is a non-thermal, non-chemical, md non-electorial material removal process, and thus results in minimum modifications in mechanical properties of the brittle material during the process. Also, ultrasonic machining is a non-contact process that utilize ultrasonic vibration to impact a brittle material. In this research characteristics of micro-hole machining for brittle materials by ultrasonic machining(USM) process have been investigated. And the effect of ultrasonic vibration on the machining conditions is analyzed when machining fir non-conductive brittle materials using tungsten carbide tools with a view to improve form and machining accuracy.
Keywords
Ultrasonic Micro-Hole Machining; Resonant frequency; Horn; Abrasive; Amplitude; Machining Pressure; Tool Wear;
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