Transactions of the Korean Society of Machine Tool Engineers (한국공작기계학회논문집)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
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Micro Hole Machining for Ceramics ($Al_2O_3$) Using Ultrasonic Vibration

초음파 진동을 이용한 세라믹 소재의 마이크로 홀 가공

  • 박성준 (연세대학교 나노과학기술연구단) ;
  • 이봉구 (연세대학교 대학원 기계공학) ;
  • 최헌종 (한국생산기술연구원)
  • Published : 2004.04.01
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Abstract

Ultrasonic machining is a non-thermal, non-chemical, md non-electorial material removal process, and thus results in minimum modifications in mechanical properties of the brittle material during the process. Also, ultrasonic machining is a non-contact process that utilize ultrasonic vibration to impact a brittle material. In this research characteristics of micro-hole machining for brittle materials by ultrasonic machining(USM) process have been investigated. And the effect of ultrasonic vibration on the machining conditions is analyzed when machining fir non-conductive brittle materials using tungsten carbide tools with a view to improve form and machining accuracy.

Keywords

References

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