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Micro Ultrasonic Elliptical Vibration Cutting (II) Ultrasonic Micro V-grooving Using Elliptical Vibration Cutting  

Kim Gi Dae (대구가톨릭대학교 기계자동차공학부)
Loh Byoung-Gook (한성대학교 기계시스템공학과)
Hwang Kyung-Sig (한성대학교 기계시스템공학과 대학원)
Publication Information
Journal of the Korean Society for Precision Engineering / v.22, no.12, 2005 , pp. 198-204 More about this Journal
Abstract
For precise micro V-grooving, ultrasonic elliptical vibration cutting (UEVC) is proposed using two parallel piezoelectric actuators, which are energized by sinusoidal voltages with a phase difference of 90 degrees. Experimental setup is composed of stacked PZT actuators, a single crystal diamond cutting tool, and a precision motorized xyz stage. It is found that the chip formed in the process of UEVC is discontinuous because of the periodic contacts and non-contacts occurring between the tool and workpiece. It is experimentally observed that the cutting force in the process of UEVC significantly reduces compared to the ordinary non-vibration cutting. In addition, the creation of burr during UEVC is significantly suppressed, which is attributable to the decrease in the specific cutting energy.
Keywords
Ultrasonic elliptical vibration cutting(UEVC); Piezoelectric actuator; Single crystal diamond cutting tool; Discontinuous chip; Burr; Specific cutting energy;
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Times Cited By KSCI : 1  (Citation Analysis)
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