• Macromolecular Research
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• v.16 no.2
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• pp.128-133
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• 2008

Several dual-curable acrylic pressure-sensitive adhesives (PSA) were synthesized by the radical polymerization of acrylic monomers containing benzophenone, hydroxyl, and alkyl groups. The optimum extent of UV-induced cure was determined by varying the content of the benzophenone groups (the photoinitiator) from 0.5 to 1.5 wt%. The weight average molecular weight of the polymers obtained ranged from 300,000 to 700,000 amu. The coated pressure-sensitive adhesives were cured either by short UV exposure to induce the grafting of acrylic polymers, or by heating for 6 hat $60^{\circ}C$ to promote the reactions between the polyisocyanates and hydroxyl groups. The dual-curing behavior was determined by monitoring both processes quantitatively by infrared spectroscopy. The developed dual-curable acrylic pressure-sensitive adhesives were found to compensate for the limitations in UV-induced curing of thick coatings.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.10
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• pp.873-879
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• 2014

UV curable adhesives with different acrylic functionalities were synthesized for temporary bonding and debonding process in 3D multi-chip packaging process. The aim is to study various factors which have an influence on UV curing. The properties and curing behaviors were investigated by gel fraction, peel strength, probe tack, and shear adhesion failure temperature. The results show that the properties and curing behaviors are dependent on not only acrylic functionalities of binders but also UV doses and coating thickness.

• Journal of the Korean Graphic Arts Communication Society
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• v.19 no.2
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• pp.68-78
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• 2001

UV-curable resin has the properties of quick-drying, thigh productivity at low temperature, energy savint, space saving, solventless, non-polluting and low-stinking, and thus, UV-curing system has been widely used in the fields of printing inks, adhesives, paints and coating agents. This study has been executed to micro-patterning used UV-curable resin, The micro-patterning properties of this photoresist were investigated under irradiation of UV light low pressure mercury lamp. When the exposed photoresist film was developed by pure water developer, the resolution of this photoresist was about 50$\mu\textrm{m}$.

• Journal of Adhesion and Interface
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• v.5 no.4
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• pp.1-8
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• 2004

UV-curable pressure sensitive adhesives were prepared by blending acrylic copolymer, copolymerized with butyl acrylate, acrylic acid and methyl methacrylate by solution polymerization, and trimethylolpropane triacrylate. The PSAs were evaluated by adhesion strength with varying UV dose, and also glass transition temperature ($T_g$) of PSAs were measured. When exposed on UV irradiation, the PSAs showed the decreased adhesion strength and increased $T_g$. And following UV irradiation, the PSAs did not leave any residue on wafer after peel off PSA.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.485-486
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• 2012

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.127-128
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• 2005

UV-curable pressure sensitive adhesives were prepared by blending acrylic copolymer, copolymerized with butyl acrylate (BA), acrylic acid (AA) and vinyl acetate (VAc) by solution polymerization, triethyl amine (TEA) and trimethylolpropane triacrylate (TMPTA). The PSAs were evaluated by peel strength with varying contents of TMPTA and UV dose, and also glass transition temperature($T_g$) of PSAs were measured. When exposed on UV irradiation, the PSAs showed the decreased peel strength and increased $T_g$. And following UV irradiation, the PSAs did not leave any residue on wafer after peel off PSA.

• Applied Chemistry for Engineering
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• v.24 no.2
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• pp.148-154
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• 2013

UV curable acryl resin, pressure-sensitive adhesives (PSAs), are used in many different parts in the world. In particular, PSAs has been used in the wafer manufacturing process of semiconductor industry. As wafers become much thinner, UV curable PSAs require more proper adhesion performance. In this study, acrylic PSAs containing hydroxyl groups were synthesized using monomers of 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, styrene monomer and 2-hydroxyethyl acrylate. Isocyanate modified UV curable PSAs were then prepared by the adduct reaction that facilitates the UV curing property via controlling the amount of methacryloyloxyehtyl isocyanate. The proper adhesion performance and UV curing behavior of UV curable PSAs with various hydroxyl values were studied, and experimental conditions were then optimized to raise the efficiency of wafer manufacturing process. It was found that in case of using the equivalent ratio of 1 : 1 isocyanate hardener used in the UV curable PSAs, the peel strength before the UV curing process decreased as the amount of hydroxyl groups increased in the PSAs. The peeling adhesive strength was also decreased with increasing UV dose due to high curing characteristics.

• Applied Chemistry for Engineering
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• v.34 no.5
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• pp.522-528
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• 2023

In this work, adhesive tapes were prepared for the dicing process in semiconductor manufacturing. Compounds with different numbers of photoreactive groups (f = 1 to 3) were synthesized and incorporated into acrylic copolymers to formulate UV-curable acrylic adhesives. Structural confirmation of the synthesized photoreactive compounds (f = 2 or 3) was performed using nuclear magnetic resonance (NMR) spectroscopy. The introduction of the photoreactive compounds into the acrylic adhesive was accomplished by urethane reactions, and the successful synthesis of the UV-curable acrylic adhesive was verified by Fourier transform infrared (FT-IR) measurements. To evaluate the performance of the adhesive, the peel strength was evaluated before and after UV irradiation using a silicon wafer as a substrate. The adhesive exhibited high peel strength (~2000 gf/25 mm) before UV exposure, which was significantly reduced (~5 gf/25 mm) after UV exposure. Interestingly, the adhesive containing multifunctional photoreactive compounds showed the most significant reduction in peel strength. In addition, surface residue measurements by field emission scanning electron microscopy (FE-SEM) showed minimal surface residue (~0.2%) after UV exposure. Overall, these results contribute to the understanding of the behavior of UV-curable acrylic adhesives and pave the way for potential applications in semiconductor manufacturing processes.

• Macromolecular Research
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• v.14 no.5
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• pp.517-523
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• 2006

The effects of particle content, size and shape on the thermal conductivity (k) and adhesion properties of thermally conductive, pressure-sensitive adhesives (PSAs) were investigated. The matrix resins were thermally crosslinkable, 2-ethylhexyl acrylic polyol and ultraviolet (UV)-curable, random copolymer consisting of acrylic oligomer and various acrylates. We found that k increased with increasing diameter and particle aspect ratio, and was further enhanced due to the reduction of the interfacial thermal barrier when the coupling agent, which increases the adhesion between particles and the matrix resin, was used. On the other hand, adhesion properties such as peel strength and tack of the thermally crosslinkable resin decreased sharply with increasing particle content. However, for UV curable resin, increased particle addition inhibited the decrease in adhesion properties.

• Journal of Adhesion and Interface
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• v.6 no.3
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• pp.19-25
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• 2005

Synthetic rubber based pressure-sensitive adhesives (PSAs) usually containing SIS or SBS block copolymer, tackifier, plasticizer, and other additives are now widely used on various applications. As these PSAs are physically crosslinked and can be applied without the use of solvent, they are thermally processable and environmentally friendly. However these PSAs cannot be used in high temperature applications and in applications where solvent and chemical resistance properties are required. We developed the PSA adding UV curable system, such as thiol-ene system, to increase adhesion properties at elevated temperature. The adhesion properties such as probe tack, peel strength, shear adhesion failure temperature (SAFT) were evaluated. The probe tack test was conducted with varying probe materials and coating thickness of PSAs. Using the contact angle, the surface property of the cured PSAs was also observed.