Macromolecular Research

The Polymer Society of Korea (한국고분자학회)
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Dual-Curable Acrylic Pressure-Sensitive Adhesives Based on UV and Thermal Processes

  • Kim, Yang-Bae (Institute of Photonics & Surface Treatment, Q-SYS CO. Ltd.) ;
  • Park, Su-Cheol (Department of Polymer Science & Engineering, Chosun University) ;
  • Kim, Hyun-Kyoung (Department of Polymer Science & Engineering, Chosun University) ;
  • Hong, Jin-Who (Department of Polymer Science & Engineering, Chosun University)
  • Published : 2008.02.29
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Abstract

Several dual-curable acrylic pressure-sensitive adhesives (PSA) were synthesized by the radical polymerization of acrylic monomers containing benzophenone, hydroxyl, and alkyl groups. The optimum extent of UV-induced cure was determined by varying the content of the benzophenone groups (the photoinitiator) from 0.5 to 1.5 wt%. The weight average molecular weight of the polymers obtained ranged from 300,000 to 700,000 amu. The coated pressure-sensitive adhesives were cured either by short UV exposure to induce the grafting of acrylic polymers, or by heating for 6 hat $60^{\circ}C$ to promote the reactions between the polyisocyanates and hydroxyl groups. The dual-curing behavior was determined by monitoring both processes quantitatively by infrared spectroscopy. The developed dual-curable acrylic pressure-sensitive adhesives were found to compensate for the limitations in UV-induced curing of thick coatings.

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References

  1. J. K. Kim, J. W. Kim, M. I. Kim, and M. S. Song, Macromol. Res., 14, 517 (2006) https://doi.org/10.1007/BF03218718
  2. D. Satas, in Handbook of Pressure Sensitive Adhesive Technology, D. Satas, Ed., Van Nostrand Reinhold, New York, 1999, pp 1-21
  3. I. Benedek, and L. J. Heymans, in Pressure Sensitive Adhesive Technology, Marcel Dekker, New York, 1997, pp 1-3
  4. D. V. Varanese, Adhesives Age, 4, 2 (2000)
  5. R. Malik, RadTech Report, May/June, 25 (2001)
  6. Y. B. Kim, H. K. Kim, and J. W. Hong, J. Appl. Polym. Sci., 102, 5566 (2006)
  7. J. D. Cho and J. W. Hong, Macromol. Res., 13, 362 (2005)
  8. A. Dobman, in New Development and Applications in UV Curable Hotmelt Pressure Sensitive Adhesives, Afera Seminar, Netherlands, September (2002)
  9. K. Studer, C. Decker, E. Beck, and R. Schwalm, Eur. Polym. J., 41, 157 (2004)
  10. C. Decker, F. Masson, and R. Schwalm, Macromol. Mater. Eng., 288, 17 (2003) https://doi.org/10.1002/mame.200290040
  11. Z. Czech, Eur. Polym. J., 40, 2221 (2004)
  12. Z. Czech, J. Appl. Polym. Sci., 87,1354 (2003) https://doi.org/10.1002/app.11656
  13. K. H Schumacher, H. Lim, and T. Tsukamoto, Proceedings of RadTech Asia, 512 (2003)
  14. T. Scherzer, A. Tauber, and R. Mehnert, Vibrational Spectroscopy, 29, 125 (2002)
  15. N. S. Allen, M. S. Johnson, P. K. T. Oldering, and S. Salim, in Chemistry & Technology of UV & EB Formulation for Coatings, Inks & Paints, P. K. T. Oldring, Ed., SITA Technology, 1991, Vol. 2, pp 153-156
  16. A. Zoel, J. Adhesion, 34, 201 (1991)