Browse > Article

Dual-Curable Acrylic Pressure-Sensitive Adhesives Based on UV and Thermal Processes  

Kim, Yang-Bae (Institute of Photonics & Surface Treatment, Q-SYS CO. Ltd.)
Park, Su-Cheol (Department of Polymer Science & Engineering, Chosun University)
Kim, Hyun-Kyoung (Department of Polymer Science & Engineering, Chosun University)
Hong, Jin-Who (Department of Polymer Science & Engineering, Chosun University)
Publication Information
Macromolecular Research / v.16, no.2, 2008 , pp. 128-133 More about this Journal
Abstract
Several dual-curable acrylic pressure-sensitive adhesives (PSA) were synthesized by the radical polymerization of acrylic monomers containing benzophenone, hydroxyl, and alkyl groups. The optimum extent of UV-induced cure was determined by varying the content of the benzophenone groups (the photoinitiator) from 0.5 to 1.5 wt%. The weight average molecular weight of the polymers obtained ranged from 300,000 to 700,000 amu. The coated pressure-sensitive adhesives were cured either by short UV exposure to induce the grafting of acrylic polymers, or by heating for 6 hat $60^{\circ}C$ to promote the reactions between the polyisocyanates and hydroxyl groups. The dual-curing behavior was determined by monitoring both processes quantitatively by infrared spectroscopy. The developed dual-curable acrylic pressure-sensitive adhesives were found to compensate for the limitations in UV-induced curing of thick coatings.
Keywords
pressure-sensitive adhesives; acrylic; cure/hardening; UV; polyurethane;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
Times Cited By Web Of Science : 3  (Related Records In Web of Science)
Times Cited By SCOPUS : 6
연도 인용수 순위
1 I. Benedek, and L. J. Heymans, in Pressure Sensitive Adhesive Technology, Marcel Dekker, New York, 1997, pp 1-3
2 D. V. Varanese, Adhesives Age, 4, 2 (2000)
3 Y. B. Kim, H. K. Kim, and J. W. Hong, J. Appl. Polym. Sci., 102, 5566 (2006)
4 A. Dobman, in New Development and Applications in UV Curable Hotmelt Pressure Sensitive Adhesives, Afera Seminar, Netherlands, September (2002)
5 C. Decker, F. Masson, and R. Schwalm, Macromol. Mater. Eng., 288, 17 (2003)   DOI   ScienceOn
6 J. D. Cho and J. W. Hong, Macromol. Res., 13, 362 (2005)
7 D. Satas, in Handbook of Pressure Sensitive Adhesive Technology, D. Satas, Ed., Van Nostrand Reinhold, New York, 1999, pp 1-21
8 K. H Schumacher, H. Lim, and T. Tsukamoto, Proceedings of RadTech Asia, 512 (2003)
9 Z. Czech, J. Appl. Polym. Sci., 87,1354 (2003)   DOI   ScienceOn
10 T. Scherzer, A. Tauber, and R. Mehnert, Vibrational Spectroscopy, 29, 125 (2002)
11 A. Zoel, J. Adhesion, 34, 201 (1991)
12 R. Malik, RadTech Report, May/June, 25 (2001)
13 K. Studer, C. Decker, E. Beck, and R. Schwalm, Eur. Polym. J., 41, 157 (2004)
14 J. K. Kim, J. W. Kim, M. I. Kim, and M. S. Song, Macromol. Res., 14, 517 (2006)   과학기술학회마을   DOI
15 N. S. Allen, M. S. Johnson, P. K. T. Oldering, and S. Salim, in Chemistry & Technology of UV & EB Formulation for Coatings, Inks & Paints, P. K. T. Oldring, Ed., SITA Technology, 1991, Vol. 2, pp 153-156
16 Z. Czech, Eur. Polym. J., 40, 2221 (2004)