1 |
I. Benedek, and L. J. Heymans, in Pressure Sensitive Adhesive Technology, Marcel Dekker, New York, 1997, pp 1-3
|
2 |
D. V. Varanese, Adhesives Age, 4, 2 (2000)
|
3 |
Y. B. Kim, H. K. Kim, and J. W. Hong, J. Appl. Polym. Sci., 102, 5566 (2006)
|
4 |
A. Dobman, in New Development and Applications in UV Curable Hotmelt Pressure Sensitive Adhesives, Afera Seminar, Netherlands, September (2002)
|
5 |
C. Decker, F. Masson, and R. Schwalm, Macromol. Mater. Eng., 288, 17 (2003)
DOI
ScienceOn
|
6 |
J. D. Cho and J. W. Hong, Macromol. Res., 13, 362 (2005)
|
7 |
D. Satas, in Handbook of Pressure Sensitive Adhesive Technology, D. Satas, Ed., Van Nostrand Reinhold, New York, 1999, pp 1-21
|
8 |
K. H Schumacher, H. Lim, and T. Tsukamoto, Proceedings of RadTech Asia, 512 (2003)
|
9 |
Z. Czech, J. Appl. Polym. Sci., 87,1354 (2003)
DOI
ScienceOn
|
10 |
T. Scherzer, A. Tauber, and R. Mehnert, Vibrational Spectroscopy, 29, 125 (2002)
|
11 |
A. Zoel, J. Adhesion, 34, 201 (1991)
|
12 |
R. Malik, RadTech Report, May/June, 25 (2001)
|
13 |
K. Studer, C. Decker, E. Beck, and R. Schwalm, Eur. Polym. J., 41, 157 (2004)
|
14 |
J. K. Kim, J. W. Kim, M. I. Kim, and M. S. Song, Macromol. Res., 14, 517 (2006)
과학기술학회마을
DOI
|
15 |
N. S. Allen, M. S. Johnson, P. K. T. Oldering, and S. Salim, in Chemistry & Technology of UV & EB Formulation for Coatings, Inks & Paints, P. K. T. Oldring, Ed., SITA Technology, 1991, Vol. 2, pp 153-156
|
16 |
Z. Czech, Eur. Polym. J., 40, 2221 (2004)
|