Browse > Article
http://dx.doi.org/10.7736/KSPE.2014.31.10.873

Properties and Curing Behaviors of UV Curable Adhesives with Different Coating Thickness in Temporary Bonding and Debonding Process  

Lee, Seung-Woo (Lab. of Adhesion and Bi-composites, Program in Environmental Materials Science, Research Institute for Agriculture and Life Sciences, Seoul National University)
Lee, Tae-Hyung (Lab. of Adhesion and Bi-composites, Program in Environmental Materials Science, Research Institute for Agriculture and Life Sciences, Seoul National University)
Park, Ji-Won (Lab. of Adhesion and Bi-composites, Program in Environmental Materials Science, Research Institute for Agriculture and Life Sciences, Seoul National University)
Park, Cho-Hee (Lab. of Adhesion and Bi-composites, Program in Environmental Materials Science, Research Institute for Agriculture and Life Sciences, Seoul National University)
Kim, Hyun-Joong (Lab. of Adhesion and Bi-composites, Program in Environmental Materials Science, Research Institute for Agriculture and Life Sciences, Seoul National University)
Publication Information
Journal of the Korean Society for Precision Engineering / v.31, no.10, 2014 , pp. 873-879 More about this Journal
Abstract
UV curable adhesives with different acrylic functionalities were synthesized for temporary bonding and debonding process in 3D multi-chip packaging process. The aim is to study various factors which have an influence on UV curing. The properties and curing behaviors were investigated by gel fraction, peel strength, probe tack, and shear adhesion failure temperature. The results show that the properties and curing behaviors are dependent on not only acrylic functionalities of binders but also UV doses and coating thickness.
Keywords
UV curable adhesives; Curing behaviors; Temporary bonding and debonding process;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
1 Lee, S.-W., Park, J.-W., Kim, H.-J., Kim, K.-M., Kim, H.-I., and Ryu, J.-M., "Adhesion Performance and Microscope Morphology of UV-Curable Semiinterpenetrated Dicing Acrylic PSAs in Si-wafer Manufacture Process for MCP," J. Adhesion Sci. Technol., Vol. 26, No. 1-3, pp. 317-329, 2012.
2 Ryu, C.-M., Pang, B.-L., Kim, H.-I., Kim, K.-M., Lee, S.-W., et al., "Effect of Side Chain on Wettability and Adhesion Performance of Acrylic Pressure-sensitive Adhesives on Thin Silicon Wafer," J. Adhesion Sci. Technol., Vol. 27, No. 10, pp. 1136-1145, 2013.   DOI
3 Park, Y.-J., Lim, D.-H., Kim, H.-J., Park, D.-S., and Sung, I.-K., "UV-and Thermal-curing Behaviors of Dual-curable Adhesives Based on Epoxy Acrylate Oligomers," Int. J. Adhes. Adhes., Vol. 29, No. 7, pp. 710-717, 2009.   DOI   ScienceOn
4 Lee, S.-W., Park, J.-W., Park, C.-H., Lim, D.-H., Kim, H.-J., et al., "UV-curing and Thermal Stability of Dual Curable Urethane Epoxy Adhesives for Temporary Bonding in 3D Multi-chip Package Process," Int. J. Adhes. Adhes., Vol. 44, pp. 138-143, 2013.   DOI
5 Zosel, A., "Adhesion and Tack of Polymers: Influence of Mechanical Properties and Surface Tension," Colloid Polym. Sci., Vol. 263, No. 7, pp. 541-543, 1985.   DOI
6 Zosel, A., "Effect of Cross-linking on Tack and Peel Strength of Polymers," J. Adhesion, Vol. 34, No. 1-4, pp. 201-209, 1991.   DOI
7 Garrou, P., Bower, C., and Ramm, P., "Handbook of 3D Integration: Technology and Application s of 3D Integrated Circuits," Wiley-VCH VerlagGmbH, Weinheim, pp. 27-28, 2008.
8 Czech, Z., "Synthesis and Cross-linking of Acrylic PSA System," J. Adhesion Sci. Technol., Vol. 21, No. 7, pp. 625-635, 2007.   DOI
9 Czech, Z. and Wojciechowicz, M., "The Crosslinking Reaction of Acrylic PSA Using Chelate Metal Acetylacetonates," Eur. Polym. J., Vol. 42, No. 9, pp. 2153-2160, 2006.   DOI   ScienceOn
10 Lee, S.-W., Park, J.-W., Lee, S.-H., Lee, Y.-J., Bae, K.-R., et al., "Adhesion Performance of UV-curable Debonding Acrylic PSAs with Different Thickness in Thin Si-wafer Manufacture Process," J. Adhesion and Interface, Vol. 11, No. 3, pp. 120-125, 2010.
11 Bilenberg, B., Niesen, T., Clausen, B., and Kristensen, A., "PMMA to SU-8 Bonding for Polymer Based Lab-on-a-chip Systems with Integrated Optics," J. Micromech. Microeng., Vol. 14, No. 6, pp. 814-817, 2004.   DOI
12 Lee, S.-W., Park, J.-W., Park, C.-H., Kwon, Y.-E., Kim, H.-J., et al., "Optical Properties and UV-curing Behaviors of Optically Clear PSA-$TiO_2$ Nanocomposites," ,Int. J. Adhes. Adhes, Vol. 44, pp. 200-208 2013.   DOI
13 Puligadda, R., Pillalamarri, S., Hong, W., Brubaker, C., Wimplinger, M., and Pargfrieder, S., "High-Performance Temporary Adhesives for Wafer Bonding Applications," MRS Proceedings, Vol. 970, pp. 239-252, 2007.
14 Moore, J., Smith, A., Nguyen, D., and Kulkarni, S., "High Temperature Resistant Adhesive for Wafer Thinning and Backside Processing," CS MANTECH, Vol. 8, pp. 810-812, 2004.
15 Chattopadhyay, D. K., Panda, S. S., and Raju, K. V. S. N., "Thermal and Mechanical Properties of Epoxy Acrylate/methacrylates UV Cured Coatings," Prog. Org. Coat., Vol. 54, No. 1, pp. 10-19, 2005.   DOI
16 Do, H.-S., Park, Y.-J., and Kim, H.-J., "Preparation and Adhesion Performance of UV-crosslinkable Acrylic Pressure Sensitive Adhesives," J. Adhesion Sci. Technol., Vol. 20, No. 13, pp. 1529-1545, 2006.   DOI   ScienceOn
17 Kajtna, J., Likozar, B., Golob, J., and Krajnc, M., "The Influence of the Polymerization on Properties of an Ethylacrylate/2-ethyl hexylacrylate Pressuresensitive Adhesive Suspension," Int. J. Adhes. Adhes., Vol. 28, No. 7, pp. 382-390, 2008.   DOI   ScienceOn
18 Kajtna, J., Golob, J., and Krajnc, M., "The Effect of Polymer Molecular Weight and Crosslinking Reactions on the Adhesion Properties of Microsphere Water-based Acrylic Pressure-sensitive Adhesives," Int. J. Adhes. Adhes., Vol. 29, No. 2, pp. 186-194, 2008.
19 Lee, S.-W., Park, C.-H., Park, J.-W., Lim, D.-H., Kim, H.-J., et al., "Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging," Polym. Sci. Technol., Vol. 24, No. 3, pp. 277-284, 2013.   과학기술학회마을