Applied Chemistry for Engineering (공업화학)

The Korean Society of Industrial and Engineering Chemistry (한국공업화학회)
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Synthesis and Adhesion Properties of UV Curable Acrylic PSAs for Semiconductor Manufacturing Process

반도체 제조 공정용 UV 경화형 아크릴 점착제의 합성과 점착 특성

  • Lee, Seon Ho (Graduate School of Green Energy Technology, Chungnam National University) ;
  • Lee, Sang Keon (Aekyung Chemical Co., Ltd.) ;
  • Hwang, Taek Sung (Department of Chemical Engineering, College of Engineering, Chungnam National University)
  • 이선호 (충남대학교 녹색에너지기술 전문대학원.녹색에너지기술학과) ;
  • 이상건 (애경화학(주) 기술연구소) ;
  • 황택성 (충남대학교 화학공학과)
  • Published : 2013.04.10
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Abstract

UV curable acryl resin, pressure-sensitive adhesives (PSAs), are used in many different parts in the world. In particular, PSAs has been used in the wafer manufacturing process of semiconductor industry. As wafers become much thinner, UV curable PSAs require more proper adhesion performance. In this study, acrylic PSAs containing hydroxyl groups were synthesized using monomers of 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, styrene monomer and 2-hydroxyethyl acrylate. Isocyanate modified UV curable PSAs were then prepared by the adduct reaction that facilitates the UV curing property via controlling the amount of methacryloyloxyehtyl isocyanate. The proper adhesion performance and UV curing behavior of UV curable PSAs with various hydroxyl values were studied, and experimental conditions were then optimized to raise the efficiency of wafer manufacturing process. It was found that in case of using the equivalent ratio of 1 : 1 isocyanate hardener used in the UV curable PSAs, the peel strength before the UV curing process decreased as the amount of hydroxyl groups increased in the PSAs. The peeling adhesive strength was also decreased with increasing UV dose due to high curing characteristics.

UV 경화형 아크릴 점착제는 세상에서 매우 다양한 형태로 이용되는데, 반도체 산업을 기반으로 하는 웨이퍼 제조공정에서도 이용되고 있다. 특히 반도체에 사용되는 웨이퍼가 더욱 얇아짐에 따라, UV 경화형 아크릴 점착제는 더욱 적절한 점착 성능을 요구 받고 있다. 본 연구는 2-EHA (2-ethyl hexyl acrylate), 2-EHMA (2-ethyl hexyl methacrylate), SM (styrene monomer), 2-HEA (2-hydroxy ethyl acrylate), acrylic acid 모노머를 이용하여 hydroxy기를 가진 아크릴 수지점착제를 합성한 후 MOI (methacryloyloxyethyl isocyanate)의 투입량 조절을 통한 경화 특성을 향상시킬 수 있는 부가반응을 시킨 이소시아네이트 변성 아크릴 수지 점착제를 제조하여, 적절한 접착 성능을 알아보고, 수산기 값의 정도와 UV 조사량의 차이에 따라 웨이퍼 제조의 최적화된 조건을 찾았다. 시험 결과 UV 경화형 점착제에서 수산기(Hydroxyl group, -OH)와 이소시아네이트기(isocyanate group, -NCO)의 1 : 1 당량비로 이소시아네이트 경화제를 사용할 경우 수산기값이 클수록, UV 조사 전 박리력이 감소하였다. UV 조사량이 증가할수록 높은 경화 특성 때문에 박리접착 강도는 낮아졌다.

Keywords

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