Thermal Conductivity and Adhesion Properties of Thermally Conductive Pressure-Sensitive Adhesives |
Kim, Jin-Kon
(National Creative Research Initiative Center for Block Copolymer Self-Assembly and Department of Chemical Engineering, Pohang University of Science and Technology)
Kim, Jong-Won (National Creative Research Initiative Center for Block Copolymer Self-Assembly and Department of Chemical Engineering, Pohang University of Science and Technology) Kim, Myung-Im (National Creative Research Initiative Center for Block Copolymer Self-Assembly and Department of Chemical Engineering, Pohang University of Science and Technology) Song, Min-Seok (National Creative Research Initiative Center for Block Copolymer Self-Assembly and Department of Chemical Engineering, Pohang University of Science and Technology) |
1 | J. Bae, W. Kim, and S. Cho, J. Material Science, 35, 5907 (2000) DOI ScienceOn |
2 | J. W. Bae, W. Kim, S. Hwang, Y. S. Choe, and S. H. Lee, Macromol. Res., 12, 78 (2004) DOI |
3 | D. Kumlut , . H. Tavman, and M. T. Coban, Composites Sci. Technol., 63, 113 (2003) DOI ScienceOn |
4 | Japan Patent 2005-97440A (Sumitio-3M Co., Japan) |
5 | J. K. Kim, W. H. Kim, and D. H. Lee, Polymer, 43, 5005 (2002) DOI ScienceOn |
6 | C. P. Wong and R. S. Bollampally, J. Appl. Polym. Sci., 74, 3396 (1999) DOI ScienceOn |
7 | S. E. Gustafsson, Rev. Sci. Instrum., 62, 797 (1991) DOI |
8 | D. W. Kang and H. G. Yeo, Polymer(Korea), 29, 161 (2005) |
9 | Japan Patent, 2000-290615A (Tokai Rubber Co., Japan) |
10 | H. Ishida and S. Rimdusit, Thermochimica Acta, 320, 177 (1998) DOI |
11 | Y. P. Mamunya, V. V. Davydenko, P. Pissis, and E. V. Lebedev, Eur. Polym. J., 38, 1887 (2002) DOI ScienceOn |
12 | R. F. Hill and P. H. Supancic, J. Am. Ceram. Soc., 85, 851 (2002) DOI ScienceOn |
13 | C. P. Wong and R. S. Bollampally, IEEE Transac. Adv. Packg., 22, 54 (1999) DOI ScienceOn |
14 | A. Boudenne, L. Ibos, M. Fois, J. C. Majeste, and E. Gehin, Composites: Part A, 36, 1545 (2005) DOI ScienceOn |
15 | Y. Xu, D. D. L. Chung, and C. Mroz, Composites: Part A, 32, 1749 (2001) DOI ScienceOn |
16 | Y. Nagai and G. Lai, J. Ceram. Soc. of Japan, 105, 213 (1996) |
17 | P. Bujard, G.. Kuhnlein, S. Ino, and T. Shiobara, IEEE Transac. Compn. Packg. Manu. Tech: Part A, 17, 527 (1994) DOI ScienceOn |
18 | I. H. Tavman, Int. Comm. Heat Mass Transfer, 25, 723 (1998) DOI ScienceOn |
19 | C. T. Murrary, R. L. Rudman, M. B. Sabade, and A. V. Pocius, MRS Bulletin, 28, 449 (2003) DOI |