• Title/Summary/Keyword: UBM

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The urban biotope mapping and a building of biotope information system as a specialized tool of urban ecological landscape planning (도시지역 생태복원계획의 핵심토대로서 도시소생물권 도면화작업과 정보시스템 구축방법론 개발에 관한 연구 -대구시를 사례지로-)

  • 나정화;박인환
    • Journal of the Korean Institute of Landscape Architecture
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    • v.26 no.2
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    • pp.118-132
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    • 1998
  • There are numerous plant and animal species which are adapted to the conditioins of the urban environment. The objectie of landscape and nature conservation in cities can be considered as the perservation of these organisms as the basis for a direct contact between urban dwellers and the landscape elements. However, after 1980 in Korea, green and biotope oases started to develop in the center of the urban area, from which the surrounding population benefited, at least indirectly. Thus urban biotope mapping and biotope informatioin system as a specialized tool of urban ecological landscape planning will make clear the orientation for the preservation of species and renaturalizing measures. The results are as follows : 1) Biotope types in the study area were separated to 21 biotope. 2) The written description of the biotopes took place on the computerized forms. The basis for the uniform inclusion and description of all biotopes surveyed was a codeplan. Additional details were included on the urban biotope mapping. 3) The evaluation of the mapped biotopes was completed to the following aspect, namely " species diversity and biotope conservation value" and "nature experience value". 4) UBM and BIS represent an important basis for decision aid for the city administration within the context of the ecological urban and landscape planning process. 5) The methodology of UBM and BIS in this study area could be extended to whole urban area.to whole urban area.

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Shear Strength and Aging Characteristics in Solder Bumps for High Reliability Optical Module (고신뢰성 광모듈을 위한 솔더 범프의 전단강도와 시효 특성)

  • 유정희
    • Journal of Welding and Joining
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    • v.21 no.2
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    • pp.97-101
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    • 2003
  • The change of microstructures in the base metal during transient liquid phase bonding process of directionally Ni base superalloy, GID-111 was investigated. Bonds were fabricated using a series of holding times(0~7.2ks) at three different temperatures. The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of samples was evaluated. A TiW/Cu/electroplated Cu UBM structure was selected and the samples were aging treated to analyze the effect of intermetallic compounds with the time variations. An FIB technique was applied to the preparation of samples for TEM observations. An FIB technique is very useful to prepare TEM thin foil specimens from the solder joint interface. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the solder and the UBM was observed by using SEM, TEM and EDS. As a result, the shear strength was decreased of about 21% in the 100${\mu}{\textrm}{m}$ sample at 17$0^{\circ}C$ aging compared with the maximum shear strength of the sample with the same pad size. In the case of the 12$0^{\circ}C$ aging treatment, 18% of decrease in shear strength was measured at the 100${\mu}{\textrm}{m}$ pad size sample. An intermetallic compound of Cu6Sn5 and Cu3Sn were also observed through the TEM measurement by using.

Evaluation of Frequency Warping Based Features and Spectro-Temporal Features for Speaker Recognition (화자인식을 위한 주파수 워핑 기반 특징 및 주파수-시간 특징 평가)

  • Choi, Young Ho;Ban, Sung Min;Kim, Kyung-Wha;Kim, Hyung Soon
    • Phonetics and Speech Sciences
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    • v.7 no.1
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    • pp.3-10
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    • 2015
  • In this paper, different frequency scales in cepstral feature extraction are evaluated for the text-independent speaker recognition. To this end, mel-frequency cepstral coefficients (MFCCs), linear frequency cepstral coefficients (LFCCs), and bilinear warped frequency cepstral coefficients (BWFCCs) are applied to the speaker recognition experiment. In addition, the spectro-temporal features extracted by the cepstral-time matrix (CTM) are examined as an alternative to the delta and delta-delta features. Experiments on the NIST speaker recognition evaluation (SRE) 2004 task are carried out using the Gaussian mixture model-universal background model (GMM-UBM) method and the joint factor analysis (JFA) method, both based on the ALIZE 3.0 toolkit. Experimental results using both the methods show that BWFCC with appropriate warping factor yields better performance than MFCC and LFCC. It is also shown that the feature set including the spectro-temporal information based on the CTM outperforms the conventional feature set including the delta and delta-delta features.

Effects of Zn Surface Finish on the Solder Joint Microstructure and the Impact Reliability (Sn-3.5Ag 솔더와 Zn 표면층의 반응을 통한 솔더 계면현상과 충격 신뢰성에 관한 연구)

  • Jee, Young-Kun;Yu, Jin
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.4
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    • pp.87-92
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    • 2008
  • The interface microstructure of Sn-3.5Ag/Cu joint was modified by electroplating varying amount of Zn on Cu UBM. As the amount of Zn dissolved in Sn-3.5Ag solder increased with the electroplating Zn thickness, Cu-Sn IMCs such as $Cu_6Sn_5$ and $Cu_3Sn$ were replaced by Zn-containing IMCs such as $Cu_5Zn_8$ and $Ag_5Zn_8$, which increased the drop reliability of solder joints significantly. When the amount of Zn dissolved in solder was about 3.8wt%, drop resistance was best due to the effective suppression of Cu-Sn IMC and voids at the interface.

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Effects of Oxygen Surface Treatment on the Properties of TiO2 Thin Film for Self-cleaning Application (자기세정을 위한 스퍼터링 TiO2 박막의 산소 표면처리에 따른 특성)

  • Kim, Nam-Hoon;Park, Yong Seob
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.5
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    • pp.294-297
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    • 2016
  • Titanium oxide ($TiO_2$) thin films were fabricated by unbalanced magnetron (UBM) sputtering. The fabricated $TiO_2$ films were treated by oxygen plasma under various RF powers. We investigated the characteristics of oxygen plasma treatment on the surface, structural, and physical properties of $TiO_2$ films prepared at various plasma treatment RF powers. UBM sputtered $TiO_2$ films exhibited higher contact angle value, smooth surface, and amorphous structure. However, the rms surface roughness $TiO_2$ films were rough, and the contact angle value was decreased with the increase of the plasma treatment RF power Also, the hardness value of $TiO_2$ film as physical properties was slightly increased with the increase of the plasma treatment RF power. In the results, the performance of $TiO_2$ films for self cleaning critically depended on the with the plasma treatment RF power.

Characteristics of Sputtering Mo Doped Carbon Films and the Application as the Gate Electrode in Organic Thin Film Transistor (스퍼터링 Mo 도핑 탄소박막의 특성과 유기박막트랜지스터의 게이트 전극으로 응용)

  • Kim, Young Gon;Park, Yong Seob
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.30 no.1
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    • pp.23-26
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    • 2017
  • Mo doped carbon (C:Mo) thin films were fabricated with various Mo target power densities by unbalanced magnetron sputtering (UBM). The effects of target power density on the surface, structural, and electrical properties of C:Mo films were investigated. UBM sputtered C:Mo thin films exhibited smooth and uniform surfaces. However, the rms surface roughness of C:Mo films were increased with the increase of target power density. Also, the resistivity value of C:Mo film as electrical properties was decreased with the increase of target power density. From the performance of organic thin filml transistor using conductive C:Mo gate electrode, the carrier mobility, threshold voltage, and on/off ratio of drain current (Ion/Ioff) showed $0.16cm^2/V{\cdot}s$, -6.0 V, and $7.7{\times}10^4$, respectively.

Prediction of the Impact Lifetime for Board-Leveled Flip Chips by Changing the Design Parameters of the Solder Balls (플립칩의 설계변수 변화에 따른 보드레벨 플립칩에서의 낙하충격 수명예측)

  • Lee, Soo Jin;Kim, Seong Keol
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.24 no.1
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    • pp.117-123
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    • 2015
  • The need for drop simulations for board-leveled flip chips in micro-system packaging has been increasing. There have been many studies on flip chips with various solder ball compositions. However, studies on flip chips with Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu have rarely been attempted because of the unknown material properties. According to recent studies, drop simulations with these solder ball compositions have proven feasible. In this study, predictions of the impact lifetime by drop simulations are performed considering Cu and Cu/Ni UBMs using LS-DYNA to alter the design parameters of the flip chips, such as thickness of the flip chip and size of the solder ball. It was found that a smaller chip thickness, larger solder ball diameter, and using the Cu/Ni UBM can improve the drop lifetime of solder balls.

다이아몬드 기판을 이용한 온도 변화에 따른 질화 붕소 박막의 증착 거동

  • Lee, Eun-Suk;Park, Jong-Geuk;Lee, Uk-Seong;Baek, Yeong-Jun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.44-44
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    • 2011
  • 현존하는 초경도 박막물질 중 입방정 질화붕소(cBN)은 철계 금속과의 반응안정성 및 낮은 온도에서의 합성가능성 등 많은 장점을 가지고 있다. 그러나 필수로 수반되는 이온충돌 효과로 인해 박막 내 높은 잔류응력으로 인한 박리 현상으로 응용이 어려운 실정에 있다. 현재까지 이를 개선하기 위해 수소를 첨가하여 박막의 잔류응력을 줄이는 연구, B4C 타겟을 이용하여 B-C-N 의 gradient layer를 설계하여 점진적으로 잔류응력을 감소시키는 연구 등 많은 연구들이 진행되고 있다. 본 연구에서는 MOCVD로 만들어진 NCD(Nano Crystalline Diamond) buffer layer 위에 RF-UBM(unbalanced magnetron) PVD를 이용하여 BN을 증착시켰다. hBN 타겟을 이용하여 2mTorr에서 400W 의 RF 파워를 사용하여 기판에 RF bias를 인가해 실험하였다. cBN 박막과 기판의 lattice mismatch 를 줄이기 위해서 본 연구소에서 제공되는 NCD 기판을 사용하였으며, 다이아몬드 기판과 cBN 박막의 1:1 에피성장을 이루기 위해 상온에서부터 800도까지 온도 변화를 주어 cBN을 증착시켰다. FTIR(Fourier transform infrared spectroscopy)로 $sp^2$구조인 hBN과 $sp^3$구조인 cBN의 성장유무를 확인하였으며, FTIR peak intensity 차이로 박막내 cBN의 함량을 계산하였고, Scratch test로 박막과 기판사이의 밀착력을 상대적으로 비교하였으며, 격자의 에픽성장을 확인하기 위해 FIB 의 작업을 거쳐 HRTEM 으로 각 위치별로 SAD pattern를 이용하여 성장거동을 확인하였다.

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Speaker Verification with the Constraint of Limited Data

  • Kumari, Thyamagondlu Renukamurthy Jayanthi;Jayanna, Haradagere Siddaramaiah
    • Journal of Information Processing Systems
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    • v.14 no.4
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    • pp.807-823
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    • 2018
  • Speaker verification system performance depends on the utterance of each speaker. To verify the speaker, important information has to be captured from the utterance. Nowadays under the constraints of limited data, speaker verification has become a challenging task. The testing and training data are in terms of few seconds in limited data. The feature vectors extracted from single frame size and rate (SFSR) analysis is not sufficient for training and testing speakers in speaker verification. This leads to poor speaker modeling during training and may not provide good decision during testing. The problem is to be resolved by increasing feature vectors of training and testing data to the same duration. For that we are using multiple frame size (MFS), multiple frame rate (MFR), and multiple frame size and rate (MFSR) analysis techniques for speaker verification under limited data condition. These analysis techniques relatively extract more feature vector during training and testing and develop improved modeling and testing for limited data. To demonstrate this we have used mel-frequency cepstral coefficients (MFCC) and linear prediction cepstral coefficients (LPCC) as feature. Gaussian mixture model (GMM) and GMM-universal background model (GMM-UBM) are used for modeling the speaker. The database used is NIST-2003. The experimental results indicate that, improved performance of MFS, MFR, and MFSR analysis radically better compared with SFSR analysis. The experimental results show that LPCC based MFSR analysis perform better compared to other analysis techniques and feature extraction techniques.

Fabrication and Characteristics of Ni Doped Carbon Thin Films Prepared by Unbalanced Magnetron Sputtering for the Application of Biomaterials (생체 적합 소재 응용을 위한 비대칭 마그네트론 스퍼터링으로 제작된 Ni 도핑된 탄소 박막의 제조 및 특성)

  • Kim, Kwang-Taek;Park, Yong Seob
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.31 no.1
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    • pp.40-43
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    • 2018
  • Various Ni-doped carbon (C : Ni) thin films were fabricated using different Ni target power densities by unbalanced magnetron sputtering (UBM). The effects of target power density on the structural, physical, surface, and electrical properties of C : Ni films were investigated. The UBM C : Ni thin films exhibited uniformly smooth surfaces. The rms surface roughness and friction coefficient values of the C : Ni films decreased with the increase in target power density. The physical properties of the films such as hardness and elastic moduli increased while their electrical properties such as resistivity decreased with the increase in the target power density. These results show that an increase of the power density leads to an increase in the proportion of Ni and nanocrystallization of the amorphous carbon film; this contributes to the changes observed in the physical and electrical characteristics.