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http://dx.doi.org/10.4313/JKEM.2018.31.1.40

Fabrication and Characteristics of Ni Doped Carbon Thin Films Prepared by Unbalanced Magnetron Sputtering for the Application of Biomaterials  

Kim, Kwang-Taek (Department of Electronic Engineering, Honam University)
Park, Yong Seob (Department of Electronics, Chosun College of Science and Technology)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.31, no.1, 2018 , pp. 40-43 More about this Journal
Abstract
Various Ni-doped carbon (C : Ni) thin films were fabricated using different Ni target power densities by unbalanced magnetron sputtering (UBM). The effects of target power density on the structural, physical, surface, and electrical properties of C : Ni films were investigated. The UBM C : Ni thin films exhibited uniformly smooth surfaces. The rms surface roughness and friction coefficient values of the C : Ni films decreased with the increase in target power density. The physical properties of the films such as hardness and elastic moduli increased while their electrical properties such as resistivity decreased with the increase in the target power density. These results show that an increase of the power density leads to an increase in the proportion of Ni and nanocrystallization of the amorphous carbon film; this contributes to the changes observed in the physical and electrical characteristics.
Keywords
Ni doped carbon film; Unbalanced magnetron sputtering; Hardness; Friction coefficient; Resistivity;
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1 M. Dequaire, B. Limoges, J. Moiroux, and J. M. Saveant, J. Am. Chem. Soc., 124, 240 (2002). [DOI: https://doi.org/10.1021/ja0170706]   DOI
2 W. Lohmann and U. Karst, Anal. Chem., 79, 6831 (2007). [DOI: https://doi.org/10.1021/ac071100r]   DOI
3 Z. Dai, F. Yan, J. Chen, and H. Ju, Anal. Chem., 75, 5429 (2003). [DOI: https://doi.org/10.1021/ac034213t]   DOI
4 L. H. Guo and N. Qu, Anal. Chem., 78, 6275 (2006). [DOI: https://doi.org/10.1021/ac060351h]   DOI
5 F. C. Walsh, Pure Appl. Chem., 73, 1819 (2001). [DOI: https://doi.org/10.1351/pac200173121819]   DOI
6 T. You, O. Niwa, Z. Chen, K. Hayashi, M. Tomita, and S. Hirono, Anal. Chem., 75, 5191 (2003). [DOI: https://doi.org/10.1021/ac034204k]   DOI
7 A. Grill, Thin Solid Films, 355-356, 189 (1999). [DOI: https://doi.org/10.1016/S0040-6090(99)00516-7]   DOI
8 C. H. Kiang, W. A. Goddard III, R. Beyers, and D. S. Bethune, Carbon, 33, 903 (1995). [DOI: https://doi.org/10.1016/0008-6223(95)00019-A]   DOI
9 V. Kulikovsky, P. Bohac, F. Franc, A. Deineka, V. Vorlicek, and L. Jastrabik, Diamond Relat. Mater., 10, 1076 (2001). [DOI: https://doi.org/10.1016/S0925-9635(00)00525-2]   DOI
10 A. Grill, Surf. Coat. Technol., 94-95, 507 (1997). [DOI: https://doi.org/10.1016/S0257-8972(97)00458-1]   DOI
11 A. Czyzniewski, Thin Solid Films, 433, 180 (2003). [DOI: https://doi.org/10.1016/S0040-6090(03)00324-9]   DOI