1 |
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[
Y.B.Sun;K.S.Kim;H.J.Chang
] /
Study on the UBM Design and Flip-chip Bonding Technology for Optoelectronic Communicationmodule
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2 |
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[
R.F.Pinizzotto;E.G.Jacobs
] /
The Dependence of the Activation Energies of Intermetallic Formation on the Composition of Composite Sn/Pb Solders
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3 |
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[
J.H.Lee;Y.S.Eom
] /
Reaction Characteristics between In-15Pb-5Ag Solder and Au/Ni Surface Finish and Reliability Evaluation of Solder Joint IMAPS-Korea
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4 |
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[
Atsuko Iida;Yukio Kizaki
] /
The Development of Repairable Au-Al Solid Phase Diffusion Flip-Chip Bonding
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5 |
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[
A.R.Mickelson;N.R.Basavanhally;Y.C.Lee
] /
Optoelectronic Packaging
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6 |
Aging Characteristic of Shear Strength of Micro Solder Bump
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[
K.S.Kim;Y.B.Sun;E.G.Chang
] /
Journal of KWS
과학기술학회마을
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7 |
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[
Xingjia Huang;S.W.Rickly Lee
] /
Experimental Investigation on the Progressive Failure Mechanism of Solder Balls During Ball Shear Test
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8 |
TEM Observation of Interfaces in a Solder Joint in a Semiconductor Device
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[
Hirohisa Matsuki;Hiroshi Ibuka
] /
Advances Materials
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