Journal of the Korean Society of Manufacturing Technology Engineers (한국생산제조학회지)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
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Prediction of the Impact Lifetime for Board-Leveled Flip Chips by Changing the Design Parameters of the Solder Balls

플립칩의 설계변수 변화에 따른 보드레벨 플립칩에서의 낙하충격 수명예측

  • Lee, Soo Jin (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology) ;
  • Kim, Seong Keol (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology)
  • Received : 2014.12.30
  • Accepted : 2015.01.22
  • Published : 2015.02.15
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Abstract

The need for drop simulations for board-leveled flip chips in micro-system packaging has been increasing. There have been many studies on flip chips with various solder ball compositions. However, studies on flip chips with Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu have rarely been attempted because of the unknown material properties. According to recent studies, drop simulations with these solder ball compositions have proven feasible. In this study, predictions of the impact lifetime by drop simulations are performed considering Cu and Cu/Ni UBMs using LS-DYNA to alter the design parameters of the flip chips, such as thickness of the flip chip and size of the solder ball. It was found that a smaller chip thickness, larger solder ball diameter, and using the Cu/Ni UBM can improve the drop lifetime of solder balls.

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References

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