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http://dx.doi.org/10.7735/ksmte.2015.24.1.117

Prediction of the Impact Lifetime for Board-Leveled Flip Chips by Changing the Design Parameters of the Solder Balls  

Lee, Soo Jin (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology)
Kim, Seong Keol (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology)
Publication Information
Journal of the Korean Society of Manufacturing Technology Engineers / v.24, no.1, 2015 , pp. 117-123 More about this Journal
Abstract
The need for drop simulations for board-leveled flip chips in micro-system packaging has been increasing. There have been many studies on flip chips with various solder ball compositions. However, studies on flip chips with Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu have rarely been attempted because of the unknown material properties. According to recent studies, drop simulations with these solder ball compositions have proven feasible. In this study, predictions of the impact lifetime by drop simulations are performed considering Cu and Cu/Ni UBMs using LS-DYNA to alter the design parameters of the flip chips, such as thickness of the flip chip and size of the solder ball. It was found that a smaller chip thickness, larger solder ball diameter, and using the Cu/Ni UBM can improve the drop lifetime of solder balls.
Keywords
Flip chips; Impact life time; Drop simulations; Solder balls; UBM; Design parameters;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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