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Kim, S. K., Kim, K. L., Bae, J. G., Park, S. H., Lee, D. G., 2009, Dynamic Analysis of Flip Chips with Solder Balls with Two Different Compositions, Korea Society for Precision Engineering Conference, 207-208.
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2 |
Chaosuan K., Yukio, M., Yoshiharu, M., 2002, Low-Cycle Fatigue Behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi Lead-Free Solders, Journal of Electronic Materials, 31:5 459.
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3 |
Yoshiharu, K., Takuya, H., Shinichi, T., Masamoto, T., Masahisa, O., 2004, Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip-Chip Interconnects, Journal of Electronic Materials, 33:4 326-327.
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4 |
Yoshihiko, K., Yoshiharu, K., Yuji, O., 2012, Influence of Cyclic Strain-Hardening Exponent on Fatigue Ductility Exponent for a Sn-Ag-Cu Micro-Solder Joint, Journal of Electronic Materials, 41:3 582-586.
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5 |
Kim, S. K., Lim, E. M., 2012, Board Level Drop Simulations and Modal Analysis in the Flip Chips with Solder Balls of Sn-1.0Ag-0.5Cu Considering Underfill, The Korean Society of Manufacturing Technology Engineers, 21:2 225-231.
DOI
ScienceOn
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6 |
Kim, S. K., Lim, E. M., 2011, Dynamic Reliability of Board Level by Changing the Design Parameters of Flip Chips, The Korean Society of Manufacturing Technology Engineers, 20:5 559-563.
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7 |
Jang C. M., Kim, S. K., 2013, The Prediction of Impact Life Time in Solder Balls of the Board Leveled Flip Chips by Drop Simulations, The Korean Society of Manufacturing Technology Engineers, 23:3 237-242.
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8 |
John, H. L. P., Che. F. X., 2006, Drop Impact Analysis of Sn-Ag-Cu Solder Joints using Dynamic High-strain Rate Plastic Strain as the Impact Damage Driving Force, Electronic Components and Technology Conference, 3-4.
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9 |
Kim, J. Y., 2008, A study on Reliability of Flip-chip Solder Joints with Lead-free Sn-1.2Ag-0.7Cu and Sn-2.5 at solders, Thesis for a Master, Seoul National University of Technology, Republic of Korea.
|
10 |
Blattau, N., Hillman, C., 2005, A Comparison of the Isothermal Fatigue Behavior of Sn-Ag-Cu to Sn-Pb Solder, Proceedings of SMTA International Annual Conference, 3-16.
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11 |
Ha, S. S., Ha, S. O., Jang, J. K., Kim, J. W., Lee, J. B., Jung, S. B., 2009, Failure Behaviors of Flip Chip Solder Joints Under Various Loading Conditions of High-speed Shear Test, International Journal of Modern Physics B, 23:6 1809-1815.
DOI
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12 |
O'Keefe, M., Vlahinos, A., 2009, Impacts of Cooling Technology on Solder Fatigue for Power Modules in Electric Traction Drive Vehicles, Institute of Electrical and Electronics Engineers, Conference Publications, pp. 1182-1188.
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13 |
O'Keefe, M., Vlahinos, A., 2009, Sensitivity of Solder Joint Fatigue to Sources of Variation in Advanced Vehicular Power Electronics Cooling, ASME International Mechanical Engineering Conference and Exposition, 5:13-19 45-53.
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14 |
Siewert, T., Liu, S., Smith, D. R., Madeni, J. C., 2002, Database for Solder Properties with Emphasis on New Lead-free Solders, Report on Properities of Lead-free Solders, Release 4.0, National Institute of Standards and Technology & Colorado School of Mines, USA
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15 |
Popelar, S., Roesch, M., 2000, Flip Chip Reliability Modeling Based on Solder Fatigue as Applied to Flip Chip on Laminate Assemblies, The International Journal of Microcircuits and Electronic Packaging, 23:4 462-468.
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