• 한국전기전자재료학회논문지
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• 제26권10호
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• pp.720-725
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• 2013

Power MOSFET operate voltage-driven devices, design to control the large power switching device for power supply, converter, motor control, etc. We have analyzed trench process, field limit ring process for fabrication of unified trench gate power MOSFET. And we have analyzed electrical characteristics of fabricated unified trench gate power MOSFET. The optimal trench process was based on SF6. After we carried out SEM measurement, we obtained superior trench gate and field limit ring process. And we compared electrical characteristics of planar and trench gate unified power MOSFET after completing device fabrication. As a result, the both of them was obtained 500 V breakdown voltage. However trench gate unified power MOSFET was shown improved Vth and on state voltage drop characteristics than planar gate unified power MOSFET.

• 전기전자학회논문지
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• 제16권4호
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• pp.283-289
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• 2012

이 논문에서 Trench Power MOSFET의 스위칭 성능을 향상시키기 위한 Separate Gate Technique(SGT)을 제안하였다. Trench Power MOSFET의 스위칭 성능을 개선시키기 위해서는 낮은 gate-to-drain 전하 (Miller 전하)가 요구된다. 이를 위하여 제안된 separate gate technique은 얇은(~500A)의 poly-si을 deposition하여 sidewall을 형성함으로서, 기존의 Trench MOSFET에 비해 얇은 gate를 형성하였다. 이 효과로 gate와 drain에 overlap 되는 면적을 줄일 수 있어 gate bottom에 쌓이는 Qgd를 감소시키는 효과를 얻었고, 이에 따른 전기적인 특성을 Silvaco T-CAD silmulation tool을 이용하여 일반적인 Trench MOSFET과 성능을 비교하였다. 그 결과 Ciss(input capacitance : Cgs+Cgd), Coss(output capacitance : Cgd+Cds) 및 Crss(reverse recovery capacitance : Cgd) 모두 개선되었으며, 각각 14.3%, 23%, 30%의 capacitance 감소 효과를 확인하였다. 또한 inverter circuit을 구성하여, Qgd와 capacitance 감소로 인한 24%의 reverse recovery time의 성능향상을 확인하였다. 또한 제안된 소자는 기존 소자와 비교하여 어떠한 전기적 특성저하 없이 공정이 가능하다.

• 한국전기전자재료학회논문지
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• 제30권2호
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• pp.63-66
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• 2017

This research was about shielded trench gate power MOSFET for low voltage and high speed. We used T-CAD tool and carried out process and device simulation for exracting design and process parameters. The exracted parameters was used to design shieled and conventional trench gate power MOSFET. And The electrical characteristics of shieled and conventional trench gate power MOSFET were compared and analyzed for their power device applications. As a result of analyzing electrical characteristics, the recorded breakdown voltages of both devices were around 120 V. The electric distributions of shielded and conventional trench gate power MOSFET was different. But due to the low voltage level, the breakdown voltage was almost same. And the other hand, the threshold voltage characteristics of shielded trench gate power MOSFET was superior to convention trench gate power MOSFET. In terms of on resistance characteristics, we obtained optimal oxied thickness of $3{\mu}m$.

• JSTS:Journal of Semiconductor Technology and Science
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• 제14권3호
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• pp.263-267
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• 2014

Super junction trench gate power MOSFETs have been receiving attention in terms of the trade-off between breakdown voltage and on-resistance. The vertical structure of super junction trench gate power MOSFETs allows the on-resistance to be reduced compared with conventional Trench Gate Power MOSFETs. The heat release of devices is also decreased with the reduction of on-resistance. In this paper, Lattice Temperature of two devices, Trench Gate Power MOSFET and Super junction trench gate power MOSFET, are compared in several temperature circumstance with the same Breakdown Voltage and Cell-pitch. The devices were designed by 100V Breakdown voltage and measured from 250K Lattice Temperature. We have tried to investigate how much temperature rise in the same condition. According as temperature gap between top of devices and bottom of devices, Super junction trench gate power MOSFET has a tendency to generate lower heat release than Trench Gate Power MOSFET. This means that Super junction trench gate power MOSFET is superior for wide-temperature range operation. When trench etching process is applied for making P-pillar region, trench angle factor is also important component. Depending on trench angle, characteristics of Super junction device are changed. In this paper, we focus temperature characteristic as changing trench angle factor. Consequently, Trench angle factor don't have a great effect on temperature change.

• 한국전기전자재료학회논문지
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• 제26권10호
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• pp.713-719
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• 2013

Power MOSFET operate voltage-driven devices, design to control the large power switching device for power supply, converter, motor control, etc. We have optimal designed planar and trench gate power MOSFET for high breakdown voltage and low on resistance. When we have designed $6,580{\mu}m{\times}5,680{\mu}m$ of chip size and 20 A current, on resistance of trench gate power MOSFET was low than planar gate power MOSFET. The on state voltage of trench gate power MOSFET was improved from 4.35 V to 3.7 V. At the same time, we have designed unified field limit ring for trench gate power MOFET. It is Junction Termination Edge type. As a result, we have obtained chip shrink effect and low on resistance because conventional field limit ring was convert to unify.

• 전기전자학회논문지
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• 제25권1호
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• pp.15-24
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• 2021

본 논문에서는 CDT(Conventional Double Trench) MOSFET보다 스위칭 시간과 손실이 적은 1700 V EPDT(Extended P+ shielding floating gate Double Trench) MOSFET 구조를 제안하였다. 제안한 EPDT MOSFET 구조는 CDT MOSFET에서 소스 Trench의 P+ shielding 영역을 늘리고 게이트를 N+와 플로팅 P- 폴리실리콘 게이트로 나누었다. Sentaurus TCAD 시뮬레이션을 통해 두 구조를 비교한 결과 온 저항은 거의 차이가 없었으나 Crss(게이트-드레인 간 커패시턴스)는 게이트에 0 V 인가 시에는 CDT MOSFET 대비 32.54 % 줄었고 7 V 인가 시에는 65.5 % 감소하였다. 결과적으로 스위칭 시간 및 손실은 각각 45 %, 32.6 % 줄어 스위칭 특성이 크게 개선되었다.

• 한국전기전자재료학회논문지
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• 제36권4호
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• pp.385-390
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• 2023

In this paper, the 1,700 V level SiC-based power MOSFET device widely used in electric vehicles and new energy industries was designed, that is, a single trench gate power MOSFET structure and a double trench gate power MOSFET structure were proposed to analyze electrical characteristics while changing the design and process parameters. As a result of comparing and analyzing the two structures, it can be seen that the double trench gate structure shows quite excellent characteristics according to the concentration of the drift layer, and the breakdown voltage characteristics according to the depth of the drift layer also show excellent characteristics of 200 V or more. Among them, the trench gate power MOSFET device can be applied not only to the 1,700 V class but also to a voltage range above it, and it is believed that it can replace all Si devices currently applied to electric vehicles and new energy industries.

• 한국진공학회지
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• 제11권4호
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• pp.212-217
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• 2002

고신뢰성 트렌치 게이트 MOSFET을 제작하기 위해 트렌치 코너를 pull-back 공정과 수소 열처리 공정을 이용하여 트렌치 코너를 둥글게 만드는 기술을 개발하였고 이를 이용하여 균일한 트렌치 게이트 산화막을 성장시킬수 있었다. 그 결과 수소 열처리 하기 전에 항복전압이 29 V인 것이 수소 열처리한 후 약 36 V로 증가하여 항복 전압에서 약 25% 향상되었다. 그리고 트렌치 게이트를 이용한 MOSFET에서 트렌치 셀이 약 45,000개 일때 게이트와 소스에 10 V를 인가했을 때, 드레인 전류는 약 45.3 A를 얻었고, 게이트 전압의 10 V, 전류를 5 A를 인가한 상태에서 On-저항은 약 55 m$\Omega$ 얻었다.

• Transactions on Electrical and Electronic Materials
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• 제17권5호
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• pp.302-305
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• 2016

In this paper, a low on-resistance and high current driving capability trench gate power metal-oxide-semiconductor field-effect transistor (MOSFET) incorporating a current sensing feature is proposed and evaluated. In order to realize higher cell density, higher current driving capability, cost-effective production, and higher reliability, self-aligned trench etching and hydrogen annealing techniques are developed. While maintaining low threshold voltage and simultaneously improving gate oxide integrity, the double-layer gate oxide technology was adapted. The trench gate power MOSFET was designed with a 0.6 μm trench width and 3.0 μm cell pitch. The evaluated on-resistance and breakdown voltage of the device were less than 24 mΩ and 105 V, respectively. The measured sensing ratio was approximately 70:1. Sensing ratio variations depending on the gate applied voltage of 4 V ~ 10 V were less than 5.6%.

• 전기전자학회논문지
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• 제20권3호
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• pp.220-225
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• 2016

본 논문은 전류 센싱 FET가 내장되어 있고 온-저항이 낮으며 고전류 구동이 가능한 트렌치 게이트 고 전력 MOSFET를 제안하고 전기적 특성을 분석하였다. 트렌치 게이트 전력 소자는 트렌치 폭 $0.6{\mu}m$, 셀 피치 $3.0{\mu}m$로 제작하였으며 내장된 전류 센싱 FET는 주 전력 MOSFET와 같은 구조이다. 트렌치 게이트 MOSFET의 집적도와 신뢰성을 향상시키기 위하여 자체 정렬 트렌치 식각 기술과 수소 어닐링 기술을 적용하였다. 또한, 문턱전압을 낮게 유지하고 게이트 산화막의 신뢰성을 증가시키기 위하여 열 산화막과 CVD 산화막을 결합한 적층 게이트 산화막 구조를 적용하였다. 실험결과 고밀도 트렌치 게이트 소자의 온-저항은 $24m{\Omega}$, 항복 전압은 100 V로 측정되었다. 측정한 전류 센싱 비율은 약 70 정도이며 게이트 전압변화에 대한 전류 센싱 변화율은 약 5.6 % 이하로 나타났다.