• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.2
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• pp.127-138
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• 2013

The impact of Empty Space layer in the channel region of a Double Gate (i.e. ESDG) MOSFET has been studied, by monitoring the DC, RF as well as the digital performance of the device using ATLAS 3D device simulator. The influence of temperature variation on different devices, i.e. Double Gate incorporating Empty Space (ESDG), Empty Space in Silicon (ESS), Double Gate (DG) and Bulk MOSFET has also been studied. The electrical performance of scaled ESDG MOSFET shows high immunity against Short Channel Effects (SCEs) and temperature variations. The present work also includes the linearity performance study in terms of $VIP_2$ and $VIP_3$. The proper bias point to get the higher linearity along with the higher transconductance and device gain has also been discussed.

• Journal of IKEEE
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• v.20 no.3
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• pp.318-321
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• 2016

As IoT industry are growing fast, The importance of power management system is also being magnified. CMOS High power-supply rejection ratio(PSRR) Low-dropout(LDO) regulator is achieved by the proposed ripple Subtractor, Feed-forward capacitor and OTA in this paper. The LDO is implemented in $0.18-{\mu}m$ CMOS technology. With the proposed structures, in the maximum loading of 40mA, Simulation result achieves PSRR of -73.4dB at 500kHz and PSRR better than -40dB when frequency is below 10MHz with $6.8-{\mu}F$ output capacitor.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.5
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• pp.365-370
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• 1998

We studied a electrical properties in GaAs/AlGaAs/InGaAs pseudomorphic high electron mobility transistors(PHEMT s) recessed by electron cyclotron resonance(ECR) plasma and wet etching. Using the $NH_4OH$ solution, a nonvolatile AlF$_3$layer formed on AlGaAs surface after selective gate recess is effectively eliminated. Also, we controlled threshold voltage($V_th$) using $H_3PO_4$ etchant. We have fabricated a device with 540 mS/mm maximum transconductance and -0.2 V threshold voltage by using $NH_4OH$ and $H_3PO_4$dip after ECR gate recessing. In a 2-finger GaAs PHEMT with a gate length of 0.2$\mu m$ and width of 100 $\mu m$, a current gain of 15 dB at 10 GHz and a maximum cutoff frequency of 58.9 GHz have been obtained from the measurement of current gain as a function of frequency at 12mA $I_{dss}$ and 2 V souce-drain voltage.

• Transactions on Electrical and Electronic Materials
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• v.1 no.2
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• pp.7-11
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• 2000

a-Si:H and poly-Si TFT(thin film transistor) characteristics were investigated using an inverted staggered type TFT. The TFT an as-grown a-Si:H exhibited a low field effect mobility, transconductance, and high gate threshold voltage. The poly-Si films were achieved by using an isothermal and RTA treatment for glow discharge deposited a-Si:H films. The a-Si:H films were cystallized at the various temperature from 600$^{\circ}C$ to 1000$^{\circ}C$. As anneal temperature was elevated, the TFT exhibited increased g$\sub$m/ and reduced V$\sub$ds/. V$\sub$T/. The poly-Si grain boundary passivation with grain boundary trap types and activation energies as a function of anneal temperature. The poly-si TFT showed an improved I$\sub$nm//I$\sub$off/ ratio of 10$\^$6/, reduced gate threshold voltage, and increased field effect mobility by three orders.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.18 no.4
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• pp.602-610
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• 1993

The DDA of new active element and the DDA differential integrator are designed. The DDA can be improved matching problems of external elements in op-amp application circuits. The design of DDA is used the transconductance element, differential pair and $2{\mu}m$ design rule. In order to evaluate the performance of the CMOS DDA, we simulated the DDA voltage inverter and the DDA level shifter using the designed CMOS DDA. Furthermore, the grounded resistor and the differential integrator is designed using the CMOS DDA and we found that its characteristics are agreed to OP-AMP differential integrator's. We performed the layout of the CMOS DDA and DDA differential integrator with MOSIS $2{\mu}m$ CMOS technology.

• Transactions on Electrical and Electronic Materials
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• v.2 no.4
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• pp.1-6
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• 2001

In this paper, a 1.5 V high-gain high-frequency CMOS complementary operational amplifier is presented. The input stage of op-amp is designed for supporting the constant transconductance on the Input stage by consisting of the parallel-connected rail-to-rail complementary differential pairs. And consisting of the class-AB rail-to-rail output stage using the concept of elementary shunt stage and the grounded-gate cascode compensation technique for improving the low PSRR which was a disadvantage in the general CMOS complementary input stage, the load dependence of open loop gain and the stability of op- amp on the output load are improved, and the high-gain high-frequency operation can be achieved. The designed op-amp operates perfectly on the complementary mode with the 180° phase conversion for a 1.5 V supply voltage, and shows the DC open loop gain of 84 dB, the phase margin of 65°, and the unity gain frequency of 20 MHz. In addition, the amplifier shows the 0.1 % settling time of .179 ㎲ for the positive step and 0.154 ㎲ for the negative step on the 100 mV small-signal step, respectively, and shows the total power dissipation of 8.93 mW.

• Proceedings of the KIEE Conference
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• 1996.11a
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• pp.235-238
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• 1996

An inverted double channel AIGaAs/lnGaAs/GaAs heterostructure grown by LP-MOCVD is demonstrated and discussed. Sheet carrier densities in excess of $4.5{\times}10^{12}cm^{-2}$ at 300K are obtained with a hall mobility of $5010cm^2/V{\cdot}s$. The proposed device with a $1.8{\times}200{\mu}m^2$ gate dimension reveals an extrinsic transconductance as high as 320 mS/mm and a saturation current density as high as 820 mA/mm at 300K. This is the highest current density ever reported for GaAs MODFET's with the same gate length. Significantly improvements on gate voltage swing (up to 3.5 V) and on reverse breakdown voltage (-10V) are demonstrated due to inverted structure.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.199-200
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• 2005

In this paper, the electrical characteristics and hot-carrier induced electrical performance degradations of high-voltage LDMOSFET fabricated by the existing CMOS technology were investigated. Different from the low voltage CMOS device, the only specific on-resistance was degraded due to hot-carrier stressing in LDMOS transistor. However, other electrical parameters such as threshold voltage, transconductance, and saturated drain current were not degraded after stressing. The amount of on-resistance degradation of LDMOS transistor that was implanted n-well with $1.0\times10^{13}/cm^2$ was approximately 1.6 times more than that of LDMOS transistor implanted n-well with $1.0\times10^{12}/cm^2$. Similar to low voltage CMOS device, the peak on-resistance degradation in LDMOS device was observed at gate voltage of 2.2V while the drain applied voltage was 50V. It means that the maximum impact ionization at the drain junction occurs at the gate voltage of 2.2V applying the drain voltage of 50V.

• Journal of Convergence for Information Technology
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• v.11 no.11
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• pp.159-165
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• 2021

A fin channel with a fin width of 20 nm and a gradually increased source/drain extension regions are fabricated on a bulk silicon wafer by using a three-dimensional selective oxidation. The detailed process steps to fabricate the proposed fin channel are explained. We are demonstrating their preliminary characteristics and properties compared with those of the conventional fin field effect transistor device (FinFET) and the bulk FinFET device via three-dimensional device simulation. Compared to control devices, the three-dimensional selective oxidation fin channel MOSFET shows a higher linear transconductance, larger drive current, and lower series resistance with nearly the same scaling-down characteristics.

• Journal of IKEEE
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• v.23 no.2
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• pp.636-641
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• 2019

A simple resistance deviation-to-time period converter is proposed for interfacing resistive half-bridge sensors. It consists of two 2nd generation current conveyors(CCIIs). The proposed converter has simpler circuit configuration than the conventional converters using operational amplifiers or operational transconductance amplifiers(OTAs). The proposed converter was simulated using CCII implemented with AD844 IC chips. The simulation results show that the converter has a conversion sensitivity of $0.01934ms/{\Omega}$ over a range of $100-500{\Omega}$ resistance deviations and a linearity error less than ${\pm}0.002%$.