• 한국표면공학회지
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• 제24권1호
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• pp.34-34
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• 1991

Corrosion behavior of TiN coated steel was studied in terms of thickness of interlayer Ti and TiN coating TiN was are ion plated to a thickness of 1$\mu\textrm{m}$ and 2$\mu\textrm{m}$ respectively with interlayer coating of Ti of 1$\mu\textrm{m}$, 2$\mu\textrm{m}$ and 3$\mu\textrm{m}$. Corrosion resistance of TiN coated steel was evaluated by anodic palarization test in 1N H2SO4 as well as salt spray test. Porosity of each coating was also tested by using SO2 test method. Corrosion current density decreased with increasing TiN coating thickness and Ti interlayer coating markedly enhanced the corrosion resistance. Ti interlayer coating of 2$\mu\textrm{m}$ and 3$\mu\textrm{m}$ prior to 2$\mu\textrm{m}$ TiN coating decreased the corrosion current density of active range by an order of 4 and that of passive range by an order of 2. This improvement was associated with the retardation of corrosive agent penetration with increasing coating thickness and inherent corrosion resistance of Ti interlayer. Ti interlayer coating was also very effective in improvement of corrosion resistance under salt atmosphere.

• 한국표면공학회지
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• 제25권1호
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• pp.34-39
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• 1992

Corrosion behavior of TiN coated steel was studied in terms of thickness of interlayer Ti and TiN coating. TiN was arc ion plated to a thickness of 1$\mu\textrm{m}$ and 2$\mu\textrm{m}$ respectively with interlayer coating of Ti of 1$\mu\textrm{m}$, $2\mu\textrm{m}$ and $3\mu\textrm{m}$. Corrosion resistance of TiN coated steel was evaluated by anodic palarization test in 1N $H_2$SO$_4$ as well as salt spray test. Porosity of each coating was also tested by using $SO_2$ test method. Corrosion current density decreased with increasing TiN coating thickness and Ti interlayer coating markedly enhanced the corrosion resistance. Ti interlayer coating of $2\mu\textrm{m}$ and $3\mu\textrm{m}$ prior to $2\mu\textrm{m}$ TiN coating decreased the corrosion current density of active range by an order of 4 and that of passive range by an order of 2. This improvement was associated with the retardation of corrosive agent penetration with increasing coating thickness and inherent corrosion resistance of Ti interlayer. Ti interlayer coating was also very effective in improvement of corrosion resistance under salt atmosphere.

• 열처리공학회지
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• 제5권1호
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• pp.1-12
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• 1992

In order to improve adhesive force of TiN film, we sputtered titanium as interlayer before TiN deposition by Plasma Enhanced Chemical Vapour Deposition. We observed changes of hardness and adhesion at a various thickness of titanium interlayer and also examined analysis. At the critical thickness of the titanium interlayer(about $0.2{\mu}$), adhesive force of TiN films were promoted mostly. But over the critical thickness, a marked reduction of adhesive force was showed, because of the internal stress of titanium interlayer. From AES analysis, the adhesion improvement of TiN films was mainly caused by nitrogen diffusion into titanium interlayer during TiN deposition process which relieved stress concentration at TiN coating-substrate interface.

• 한국진공학회지
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• 제16권6호
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• pp.446-452
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• 2007

R.F. magnetron-sputtering 방법에 의해 $(Pb_{1.1},La_{0.08})(Zr_{0.65}.Ti_{0.35})O_3$ 박막을 $Pt/Ti/SiO_2/Si$, $TiO_2(interlayer)/Pt/Ti/SiO_2/Si$ 기판에 증착하고, $TiO_2$ interlayer에 의한 PLZT 박막의 특성을 고찰 하였다. $TiO_2$ interlayer의 증착조건을 변화시켜가며 단일상의 anatase 상과 rutile 상을 증착하였고, 그 위에 증착시킨 PLZT 박막의결정성을 x-ray diffraction(XRD)을 통해 분석하였다. 또한 $TiO_2$ interlayer에 의한 $PLZT-TiO_2$, $TiO_2-Pt$ 박막의 계면상태를 고찰하기 위해 glow discharge spectrometer(GDS) 분석을 행하였고, PLZT의 강유전 특성을 고찰하기 위해 전기적 측정을 행하였다. $TiO_2$ anatase 단일 상에 증착한 PLZT의 경우 (110) 방향으로 우선 배향됨을 알 수 있었고, 12.6 ${\mu}C/cm^2$의 잔류분극 값을 나타내었다.

• 한국표면공학회지
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• 제26권2호
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• pp.55-62
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• 1993

The effect of interlayer coating thickness of Ni and Ti on corrosion behavior was studied for TiN ion plat-ed steel plate. Interlayer coating was carried out in a single and bi-layer to a various thickness combination prior to final TiN coating. Corrosion behavior was evaluated by anodic polarization test in 1N H2SO4 as well as salt spray test. Ni interlayer coating was effectived in reducing corrosion current density of active region and Ti interlayer coating over Ni coating reduced the anodic corrosion current density by an order of 4 with increasing the thickness of Ti up to$ 3\mu\textrm{m}$. The improvement of corrosion resistance by Ni/Ti interlayer coating was attributed to the effective prevention of penetration of active corrosion agent resulting from the inherent corrosion resistance of Ni and Ti. Putting corrosion behavior was observed from salt spray test result for all specimens and corrosion resistance at salt atmosphere was enhanced with increasing Ni and Ti thickness, Cor-lay TiN coating was spalled out by the generation of corrosion products.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2001년도 춘계학술발표회 초록집
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• pp.66-67
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• 2001

• 한국표면공학회지
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• 제25권2호
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• pp.82-89
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• 1992

The effect of interlayer coating of Ni and Ti on corrosion behavior was studied in TiN ion plated steel plate. Interlayer coating was carried out in a single and bi-layer to a various thickness combination prior to final TiN coating of $2\mu\textrm{m}$. Corrosion behavior was evaluated by anodic polarization test in 1N H2SO4 as well as salt spray test. Porosity of each coating was also tested by using SO2 test. Corrosion resistance was improved with increasing the thickness of Ni interlayer coating and Ni-Ti interlayer coating markedly enhanced the corrosion resistance. Ni/Ti interlayer coating of $2\mu\textrm{m}$/2$\mu\textrm{m}$ prior to $2\mu\textrm{m}$ TiN coating decreased the corrosion current density of active range by an order of 4 and that of passive range by an order of 1. This improvement was associated with the retardation of corrosive agent penetration with increasing coating thickness and inherent corrosion resistance of Ni and Ti interlayers, Ni/Ti interlayers coating were also very effective in improvement of corrosion resistance under salt atmosphere.

• 대한전자공학회논문지SD
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• 제40권12호
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• pp.1-9
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• 2003

본 논문에서는 cobalt interlayer와 TiN capping을 적용한 Ni-Silicide 구조를 제안하여 100 ㎜ CMOS 소자에 적용하고 소자 특성 연구를 하였다. Ni-Silicide의 취약한 열 안정성을 개선하기 위해 열 안정성이 우수한 Cobalt interlayer이용하여 silicide의 열화됨을 개선하였고 또한 silicide 계면의 uniformity를 향상하기 위해 TiN capping을 동시에 적용하였다. 100 ㎚ CMOS 소자에 제안한 Co/Ni/TiN 구조를 적용하여 700℃, 30분에서의 열처리 시에도 silicide의 낮은 면저항과 낮은 접합 누설 전류가 유지되었으며 100 ㎚이하 소자의 특성 변화도 거의 없음을 확인하였다. 따라서 제안한 Co/Ni/TiN 구조가 NiSi의 열 안정성을 개선시킴으로써 100 ㎚ 이하의 Nano CNOS 소자에 매우 적합한 Ni-Silicide 특성을 확보하였다.

• 열처리공학회지
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• 제28권2호
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• pp.63-67
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• 2015

$TiO_2/Ag/TiO_2$ trilayer films were deposited with radio frequency (RF) and direct current (DC) magnetron sputtering onto the glass substrate to consider the influence of Ag interlayer on the optical properties of the films. The thickness of $TiO_2$ films was kept at 24 nm, while the thickness of Ag interlayer was varied as 5, 10, 15, and 20 nm. As-deposited $TiO_2$ single layer films show the optical transmittance of 66.7% in the visible wave-length region and the optical reflectance of 16.5%, while the $TiO_2$ films with a 15 nm thick Ag interlayer show the enhanced optical transmittance of 80.2% and optical reflectance of 77.8%. The carrier concentration was also influenced by Ag interlayer. The highest carrier concentration of $1.01{\times}10^{23}cm^{-3}$ was observed for a 15 nm thick Ag interlayer in $TiO_2/Ag/TiO_2$ films. The observed result means that an optimized Ag interlayer in $TiO_2/Ag/TiO_2$ films enhanced the structural and optical properties of the films.

• 한국재료학회지
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• 제13권2호
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• pp.88-93
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• 2003

Co/Ti bilayer structure in Co salicide process helps to the improvement of device speed by lowering contact resistance due to the epitaxial growth of $CoSi_2$layers. We investigated the epitaxial growth and interfacial mass transport of $CoSi_2$layers formed from $150 \AA$-Co/Ti structure with two step rapid thermal annealing (RTA). The thicknesses of Ti layers were varied from 20 $\AA$ to 100 $\AA$. After we confirmed the appropriate deposition of Ti film even below $100\AA$-thick, we investigated the cross sectional microstructure, surface roughness, eptiaxial growth, and mass transportation of$ CoSi_2$films formed from various Ti thickness with a cross sectional transmission electron microscopy XTEM), scanning probe microscopy (SPM), X-ray diffractometery (XRD), and Auger electron depth profiling, respectively. We found that all Ti interlayer led to$ CoSi_2$epitaxial growth, while $20 \AA$-thick Ti caused imperfect epitaxy. Ti interlayer also caused Co-Ti-Si compounds on top of $CoSi_2$, which were very hard to remove selectively. Our result implied that we need to employ appropriate Ti thickness to enhance the epitaxial growth as well as to lessen Co-Ti-Si compound formation.