• Current Photovoltaic Research
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• 제9권4호
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• pp.128-132
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• 2021

Advances in screen printing technology have been led to development of high efficiency silicon solar cells. As a post PERx structure, an n-type wafer-based rear side TOPCon structure has been actively researched for further open-circuit voltage (Voc) improvement. In the case of the metal contact of the TOPCon structure, the poly-Si thickness is very important because the passivation of the substrate will be degraded when the metal paste penetrates until substrate. However, the thin poly-Si layer has advantages in terms of current density due to reduction of parasitic absorption. Therefore, poly-Si thickness and firing temperature must be considered to optimize the metal contact of the TOPCon structure. In this paper, we varied poly-Si thickness and firing peak temperature to evaluate metal induced recombination (Jom) and contact resistivity. Jom was evaluated by using PL imaging technique which does not require both side metal contact. As a results, we realized that the SiN_x deposition conditions can affect the metal contact of the TOPCon structure.

• 센서학회지
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• 제30권4호
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• pp.250-254
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• 2021

A highly sensitive and selective non-dispersive infrared (NDIR) carbon dioxide gas sensor requires achieving high transmittance and narrow full width at half maximum (FWHM), which depends on the interface of the optical filter for precise measurement of carbon dioxide concentration. This paper presents the design, simulation, and fabrication of a Fabry-Perot filter based on a distributed Bragg reflector (DBR) for a low-cost NDIR carbon dioxide sensor. The Fabry-Perot filter consists of upper and lower DBR pairs, which comprise multilayered stacks of alternating high- and low-index thin films, and a cavity layer for the resonance of incident light. As the number of DBR pairs inside the reflector increases, the FWHM of the transmitted light becomes narrower, but the transmittance of light decreases substantially. Therefore, it is essential to analyze the relationship between the FWHM and transmittance according to the number of DBR pairs. The DBR is made of silicon and silicon dioxide by RF magnetron sputtering on a glass wafer. After the optimal conditions based on simulation results were realized, the DBR exhibited a light transmittance of 38.5% at 4.26 ㎛ and an FWHM of 158 nm. The improved results substantiate the advantages of the low-cost and minimized process compared to expensive commercial filters.

• Tribology and Lubricants
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• 제38권6호
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• pp.235-240
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• 2022

Atomically-thin 2D nanomaterials can be easily deformed and have surface corrugations which can influence the frictional characteristics of the 2D nanomaterials. Chemical vapor deposition (CVD) graphene can be grown in a wafer scale, which is suitable as a large-area surface coating film. The CVD growth involves cooling process to room temperature, and the thermal expansion coefficients mismatch between graphene and the metallic substrate induces a compressive strain in graphene, resulting in the surface corrugations such as wrinkles and atomic ripples. Such corrugations can induce the friction anisotropy of graphene, and therefore, accurate imaging of the surface corrugation is significant for better understanding about the friction anisotropy of CVD graphene. In this work, the combinatorial analysis using friction force microscopy (FFM) and transverse shear microscopy (TSM) was implemented to unveil the friction anisotropy of CVD bi-layer graphene. The periodic friction anisotropy of the wrinkles was measured following a sinusoidal curve depending on the angles between the wrinkles and the scanning tip, and the two domains were observed to have the different friction signals due to the different directions of the atomic ripples, which was confirmed by the high-resolution FFM and TSM imaging. In addition, we revealed that the atomic ripples can be easily suppressed by ironing the surface during AFM scans with an appropriate normal force. This work demonstrates that the friction anisotropy of CVD bilayer graphene is well-correlated with the corrugated structures and the local friction anisotropy induced by the atomic ripples can be controllably removed by simple AFM scans.

• 한국전기전자재료학회논문지
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• 제36권3호
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• pp.233-240
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• 2023

p-type Tunnel Oxide Passivating Contacts (TOPCon) solar cell is fabricated with a poly-Si/SiO_x structure. It simultaneously achieves surface passivation and enhances the carriers' selective collection, which is a promising technology for conventional solar cells. The quality of passivation is depended on the quality of the tunnel oxide layer at the interface with the c-Si wafer, which is affected by the bond of SiO formed during the subsequent annealing process. The highest cell efficiency reported to date for the laboratory scale has increased to 26.1%, fabricated by the Institute for Solar Energy Research. The cells used a p-type float zone silicon with an interdigitated back contact (IBC) structure that fabricates poly-Si and SiO_x layer achieves the highest implied open-circuit voltage (iV_oc) is 750 mV, and the highest level of edge passivation is 40%. This review presents an overview of p-type TOPCon technologies, including the ultra-thin silicon oxide layer (SiO_x) and poly-silicon layer (poly-Si), as well as the advancement of the SiO_x and poly-Si layers. Subsequently, the limitations of improving efficiency are discussed in detail. Consequently, it is expected to provide a basis for the simplification of industrial mass production.

• 전기전자학회논문지
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• 제12권3호
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• pp.131-137
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• 2008

실리콘 박막 코팅을 이용한 WDM용 파장가변 실리콘 파브리-페로 열광학 필터를 제안하고 실험하였다. 실리콘 파브리-페로 파장가변 필터는 일반적인 실리콘 웨이퍼를 CMP 공정을 통해 100${\mu}m{\pm}$1%의 두께로 가공하여 양면에 거울면을 갖도록 박막 코팅하고 온도를 변화시키기 위해 PTC 써미스터를 부착하여 제작하였다. 거울면의 형성은 1550nm를 중심 파장을 갖도록 양면에 굴절율이 다른 물질 $SiO_2$($n_{low}$=1.44)와 a-Si($n_{high}$=3.48)을 ${\lambda}$/4의 두께로 증착시켜 2층 박막과 3층 박막의 거울면을 제작하였다. 실험결과, 2층 박막의 경우 FSR이 3.61nm, FWHM이 0.56nm, finesse가 6.4로 나타났고, 3층 박막의 경우 FSR이 3.36nm, FWHM이 0.13nm, finesse가 25.5로 나타났다. 열광학 효과에 의한 파장 이동은 2층 박막 거울을 가진 필터의 경우 온도가 $23^{\circ}C$에서 투과 중심 파장이 1549.73nm $30^{\circ}C$에서 1550.91nm, $60^{\circ}C$에서 1553.46nm로 파장 이동을 하였고, 3층 박막 거울을 가진 필터의 경우는 온도가 $23^{\circ}C$에서 투과 중심 파장이 1549.83nm, $30^{\circ}C$에서 1550.92nm, $60^{\circ}C$에서 1553.07nm로 파장 이동을 하였다.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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• pp.58.1-58.1
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• 2010

In solar cell module manufacturing, single solar cells has to be joined electrically to strings. Copper stripes coated with tin-silver-copper alloy are joined on screen printed silver of solar cells which is called busbar. The bus bar collects the electrons generated in solar cell and it is connected to the next cell in the conventional module manufacturing by a metal stringer using conventional hot air or infrared lamp soldering systems. For thin solar cells, both soldering methods have disadvantages, which heats up the whole cell to high temperatures. Because of the different thermal expansion coefficient, mechanical stresses are induced in the solar cell. Recently, the trend of solar cell is toward thinner thickness below 180um and thus the risk of breakage of solar cells is increasing. This has led to the demand for new joining processes with high productivity and reduced error rates. In our project, we have developed a new method to solder solar cells with a laser heating source. The soldering process using diode laser with wavelength of 980nm was examined. The diode laser used has a maximum power of 60W and a scanner system is used to solder dimension of 6" solar cell and the beam travel speed is optimized. For clamping copper stripe to solar cell, zirconia(ZrO)coated iron pin-spring system is used to clamp both joining parts during a scanner system is traveled. The hot plate temperature that solar cell is positioned during lasersoldering process is optimized. Also, conventional solder joints after $180^{\circ}C$ peel tests are compared to the laser soldering methods. Microstructures in welded zone shows that the diffusion zone between solar cell and metal stripes is better formed than inIR soldering method. It is analyzed that the laser solder joints show no damages to the silicon wafer and no cracks beneath the contact. Peel strength between 4N and 5N are measured, with much shorter joining time than IR solder joints and it is shown that the use of laser soldering reduced the degree of bending of solar cell much less than IR soldering.

• 공업화학
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• 제10권5호
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• pp.644-651
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• 1999

본 연구에서는 진공 증착법을 이용하여 철프탈로시아닌(FePc) 박막을 실리콘 웨이퍼와 알루미나 기판 위에 합성하였으며, 박막의 증착 온도와 두께를 변화시켜 실험한 후 일부의 박막을 열처리하였다. 박막의 두께 변화에 따른 표면 구조 변화, 상전이와 전기 저항 감도 변화를 SEM, XRD, 그리고 전기저항의 측정으로 관찰하였다. 증착 온도가 $370^{\circ}C$에서 $350^{\circ}C$로 감소함에 따라 $\alpha$상의 (200)면, (011)면, (211)면, 그리고 (114)면이 사라지며 $\beta$상의 (100)면의 피크가 나타났다. 전구물질의 양을 달리하며 고속 증착시켜 박막 두께를 조절한 결과, 두께 증가에 따라 결정 크기가 증가하고 또한 $\alpha$상에서 $\beta$상으로의 상 전이가 일어남을 알 수 있었다. 열처리한 박막의 결정성을 측정한 결과 열처리 온도가 증가함에 따라 $150^{\circ}C$으로부터 $\alpha$상에서 $\beta$상으로의 상 전이가 일어나기 시작하여 $350^{\circ}C$에서 완전히 $\beta$상으로 전이되었다. $NO_x$에 대한 철프탈로시아닌 박막의 온도에 따른 전기저항감도를 측정한 결과 박막의 두께가 얇을수록 더 좋고 안정된 전기 저항 감도를 보여주었다. 즉 박막의 표면구조가 조밀하게 성장할수록 전기 저항 감도가 더욱 좋아짐을 확인하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.137-137
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• 2009

Thin-film transistors (TFTs) that can be prepared at low temperatures have attracted much attention due to the great potential for flexible electronics. One of the mainstreams in this field is the use of organic semiconductors such as pentacene. But device performance of the organic TFTs is still limited by low field effect mobility or rapidly degraded after exposing to air in many cases. Another approach is amorphous oxide semiconductors. Amorphous oxide semiconductors (AOSs) have exactly attracted considerable attention because AOSs were fabricated at room temperature and used lots of application such as flexible display, electronic paper, large solar cells. Among the various AOSs, a-IGZO was considerable material because it has high mobility and uniform surface and good transparent. The high mobility is attributed to the result of the overlap of spherical s-orbital of the heavy pest-transition metal cations. This study is demonstrated the effect of thickness channel layer from 30nm to 200nm. when the thickness was increased, turn on voltage and subthreshold swing were decreased. a-IGZO TFTs have used a shadow mask to deposit channel and source/drain(S/D). a-IGZO were deposited on SiO2 wafer by rf magnetron sputtering. using power is 150W, working pressure is 3m Torr, and an O2/Ar(2/28 SCCM) atmosphere at room temperature. The electrodes were formed with Electron-beam evaporated Ti(30nm) and Au(70nm) structure. Finally, Al(150nm) as a gate metal was evaporated. TFT devices were heat treated in a furnace at $250^{\circ}C$ in nitrogen atmosphere for an hour. The electrical properties of the TFTs were measured using a probe-station to measure I-V characteristic. TFT whose thickness was 150nm exhibits a good subthreshold swing(S) of 0.72 V/decade and high on-off ratio of 1E+08. Field effect mobility, saturation effect mobility, and threshold voltage were evaluated 7.2, 5.8, 8V respectively.

• Journal of Astronomy and Space Sciences
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• 제21권4호
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• pp.481-492
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• 2004

Nb/Al Superconducting Tunnel Junction(STJ) 소자를 제작하여 I-V 특성곡선을 측정하고 제작된 STJ 소자의 초전도체 특성 및 성능 파라미터 값들을 구하였다. 크기가 각각 20, 40, 60, 그리고 $80{\mu}m$인 4종류의 STJ소자를 제작하였으며 각 소자는 총 5층의 Nb/A1/AlOx/Al/Nb 다결정(polycrystalline) 박막으로 구성된 SIS(Superconductor Insulate. Superconductor) 방식의 조셉슨 접합 구조를 갖는다. 이 연구에서 제작한 STJ 소자는 $Tanner^{TM}$ L-Edit 8.3 프로그램으로 설계하였으며 한국표준과학연구원의 SQUID 제조실험실에서 제작하였다. 5층의 STJ 박막은 DC magnetron sputtering, reactive ion etching, CVD(Chemical Vapor Deposition) 장비를 이용해 생성되었다. 제작된 STJ 소자는 액체헬륨으로 냉각(4K)시킨 후 I-V 특성곡선을 측정하여 초전도 특성을 확인하였고, STJ 소자의 성능을 결정하는 파라미터인 energy gap, normal resistance, normal resistivity, dynamic resistance, dynamic resistivity, 그리고 quality factor를 계산하였다. Nb/Al STJ 소자의 FWHM 에너지 분해능 계산 결과, 순수 Nb STJ 소자보다 $11\%$ 우수한 에너지 분해능 특성을 확인하였다.

• 한국결정성장학회지
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• 제19권6호
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• pp.282-287
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• 2009

Si(100) wafer에 증착된 박막의 조성에 따른 결정상과 자기적 특성을 평가하고자 동시 스퍼터링법을 이용하여 다양한 조성의 박막을 제조하여 그의 상변화와 자기적 특성을 평가하였다. Fe 타겟의 인가되는 출력의 변화로 $Ni_xFe_{100-x}$(40 < x < 67)의 박막을 증착시 x < 55인 경우 BCC상으로 증착이 되었으며 $300{\sim}450^{\circ}C$에서 2시간 열처리를 한 결과 BCC에서 FCC로의 상전이가 일어나는 것을 관찰 할 수 있었으나, x < 50에서는 열처리 후에도 BCC와 FCC가 혼재하여 나타나는 것을 알 수 있었다. 상변화로 인해 $M_s$가 감소하였으나 $450^{\circ}C$에서 열처리시 상전이가 일어나지 않은 BCC상들의 입성장 및 결정화로 다시 $M_s$가 증가하였다.