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The Safety Assessment of Fire needling (화침의 안전성 평가에 관한 고찰)

  • Yeon, Sun-Hee;Lee, Sae-Bhom;Kwon, O-Sang;Cho, Seong-Jin;Choi, Kwang-Ho;Lee, Sang-Hun;Choi, Sun-Mi;Ryu, Yeon-Hee
    • Korean Journal of Oriental Medicine
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    • v.18 no.3
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    • pp.103-110
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    • 2012
  • Objectives : Fire needling has been applied as the treatment for various diseases and been getting much attention from Oriental medicine due to its excellent effectiveness as the results of clinical studies have reported. However, the research findings on the safety of treatment method, materials for the Fire needling needle materials and the possibility of burn injury during the procedure are still insufficient. Methods : A thermo imaging camera was used to confirm the temperature distribution on acupuncture needle and the treatment area during the fire needling therapy. Then the degree of thermal injury was observed by H&E stain and TUNEL assay. In addition, in order to assess the safety of acupuncture materials, we conducted MTT assay using a L6 cell line. Results : The average temperature of the skin surface was observed at $47{\sim}51^{\circ}C$ after classic fire needling and $30^{\circ}C$ after warming fire needling. Warming fire needling therapy does not induce a burn on the tissue and a third degree burn was observed locally in the muscle and skin layers after classic fire needling treatment. This confirms that hwa-acupuncture therapies do not cause major burns. According to the safety assessment test result, no cytotoxicity was detected in the warming fire needling materials. This confirms the safety of the acupuncture materials Conclusions : Various research results on the biological safety of fire needling. Since fire needling therapy induces a burn locally without leaving any scar, and as other results indicate, it is considered a safe treatment method.

Fabrication and Properties of Conductive Carbon Fiber/Polyethylene Composite Films Fabricated under High Intensity Electric Fields : Effect of Polymer Sublayer (고전기장을 이용한 도전성 탄소섬유/폴리에틸렌 복합필름의 제조 및 특성 연구 : 고분자 점착하층의 영향)

  • Park, Min;Kim, Jun-Kyung;Lim, Soon-Ho;Ko, Moon-Bae;Choe, Chul-Rim;Mironov, V.S.;Bang, Hyo-Jae;Lee, Kwang-Hee
    • Polymer(Korea)
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    • v.24 no.2
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    • pp.268-275
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    • 2000
  • We investigated the effect of polymer sublayer on volumetric resistivity and tensile strength of carbon fiber (CF)/polyethylene composite films fabricated under high intensity electric fields. The dependence of volumetric resistivity and tensile strength of the films on the polymer sublayer thickness or mass part exhibited complex behavior according to CF content and CF layer density in the films. As the thickness of polymer sublayer increases, two groups of processes at thermo-mechanical forming stage would take effects in the properties of the films. The first group comprises the increase of polymer layer thickness having reduced CF content compared with central or upper part of the film and insufficient wetting of CF resulting in the loosened structure near upper film side. The second group, on the other hand, is the improvement of mobility of molten sublayer leading to better distribution of CF throughout the film thickness and the formation of more compact structure. The different degree of contribution of these two competing processes at varied CF content and CF layer density could explain complex dependence of the film properties on the polymer sublayer. These results are important to optimize the electrical and mechanical properties of highly conductive polymer films, which can be used as electromagnetic interference shielding materials.

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Preparation and Characterization of L-Arginine Containing Poloxamer Hydrogels for Solubilization and Sustained Release of Amphotericin B (Amphotericin B의 가용화 및 방출지속화를 위한 아르기닌 함유 폴록사머 하이드로젤의 제조 및 특성분석)

  • Shin, Baek-Ki;Baek, Eun-Jung;Kim, Ye-Tae;Jeong, Ji-Woong;Nho, Young-Chang;Lim, Youn-Mook;Park, Jong-Seok;Huh, Kang-Moo;Park, Jeong-Sook
    • Polymer(Korea)
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    • v.34 no.5
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    • pp.459-463
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    • 2010
  • Amphotericin B (AmB) is anti-fungal agent for the treatment of systemic fungal infections, but its poor solubility has limited clinical applications. In this study, a new gel formulation made up of L-arginine as solubilizer, thermosensitive Poloxamer 407 (P 407), and adhesive carbopol was designed for effective solubilization and delivery of AmB. The aqueous solubility of AmB was enhanced up to 2.6 mg/mL by addition of L-arginine. Aqueous P 407 solutions of more than 20% w/v showed thermo-induced sol-gel-sol phase transition. The phase transition behavior was affected by the presence of AmB and L-arginine, and the phase transition range was broadened by addition of carbopol. In vitro drug release was improved by the solubilizing effect of L-arginine, and the presence of mucoadhesive carbopol prolonged the release rate as a function of concentration.

Quality evaluations of bell pepper in cold system combined with TEM (thermoelectric materials) and PCM (phase change material) (PCM을 장착한 열전소자 냉각시스템의 저장 중 피망의 품질 평가)

  • Sung, Jung-Min;Kim, So-Hee;Kim, Byeong-Sam;Kim, Jong-Hoon;Kim, Ji-Young;Kwon, Ki-Hyun
    • Food Science and Preservation
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    • v.23 no.4
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    • pp.471-478
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    • 2016
  • For the distribution of fresh produce, the thermoelectric cooling system combined with thermo electric materials (TEM) and phase change material (PCM) was studied. The PCM used this study was produced by in-situ polymerization technology which referred microencapsulation of hydrocarbon (n-tetradecane and n-hexadecane). In this study, quality characteristics of bell peppers in thermoelectric cooling system combined with TEM and PCM were analyzed and control was placed in an EPS (expanded polystyrene) box. As a result of quality characteristics analysis, weight of bell peppers decreased and moisture content of bell peppers was 90.96~94.43% during storage. Vitamin C content of bell pepper decreased during storage and reduction ratio of control was higher than that of BPT-5 treatment(bell pepper in thermoelectric cooling system with PCM which is kept the temperature at $5^{\circ}C$). The result of color value, on 21 day, ${\Delta}E$ value of BPT-5 treatment was 5.05 while that of control was 41.8. On 21 day, total bacteria count of BPT-5 treated bell pepper shown less than that of control. In conclusion, it suggested that the thermoelectric cooling system combined with PCM improved quality of fresh produce during transportation and storage.

Characterization of alkaline cellulase from Bacillus subtilis 4-1 isolated from Korean traditional soybean paste (전통 장류에서 분리된 알칼리성 Cellulase 생성 Bacillus subtilis 4-1 균주의 효소학적 특성)

  • Baek, Seong Yeol;Lee, You Jung;Yun, Hye Ju;Park, Hye Young;Yeo, Soo-Hwan
    • Food Science and Preservation
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    • v.21 no.3
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    • pp.442-450
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    • 2014
  • In this study, we isolated a cellulase-producing bacterium isolated from traditional Korean fermented soybean paste and investigated the effect of culture conditions on the production of cellulase. This bacterium, which was identified as Bacillus subtilis 4-1 through 16S rRNA gene sequence analysis, showed the highest cellulase activity when the cells were grown at $45^{\circ}C$ for 24 hours in the CMC medium supplemented with 1.0% of soluble starch and 0.1% yeast extract. The initial optimum pH of the medium was observed in the range of 5.0~9.0. The optimal pH and temperature for the production of cellulase from B. subtilis 4-1 were pH 9.0 and $60^{\circ}C$ respectively. In addition, the enzyme showed significant activity in the temperature range of $20{\sim}90^{\circ}C$, which indicates that B. subtilis 4-1 cellulase is an alkaline-resistance and thermo-stable enzyme. This enzyme showed higher activity with CMC as the substrate for endo-type cellulase than avicel or pNPG as the exo-type substrates for exo-type cellulase and ${\beta}$-glucosidase. These results suggest that the cellulase produced from B. subtilis 4-1 is a complex enzyme rather than a mono-enzyme.

Fluxless Bonding Method between Sn and In Bumps Using Ag Capping Layer (Ag층을 이용한 Sn과 In의 무 플럭스 접합)

  • Lee Seung-Hyun;Kim Young-Ho
    • Journal of the Microelectronics and Packaging Society
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    • v.11 no.2 s.31
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    • pp.23-28
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    • 2004
  • We utilized Ag capping layer for fluxless bonding. To investigate the effect of Ag capping layer, two sets of sample were used. One set was bare In and Sn solders. The other set was In and Sn solders with Ag capping layer. In ($10{\mu}m$) and Sn ($10{\mu}m$) solders were deposited on Cu/Ti/Si substrate using thermal-evaporation, and Ag ($0.1{\mu}m$) capping layers were deposited on In and Sn solders. Solder joints were made by joining two In and Sn deposited specimens at $130^{\circ}C$ for 30 s under 0.8, 1.6, 3.2 MPa using thermal compression bonder. The contact resistance was measured using four-point probe method. The shear strength of the solder joints was measured by the shear test of cross-bar sample in the direction. The microstructure of the solder joints was characterized with SEM and EDS. In and Sn solders without Ag capping layers were only bonded at $130^{\circ}C$ under high bonding pressure. Also the shear strength of the In-Sn solder joints under was lower than that of the Ag/In-Ag/Sn solder joints. The resistance of the solder joints was $2-4\;m{\Omega}$ The solder joints consisted of In-rich phase and Sn-rich phase and the intermixed compounds were found at the interface. As bonding pressure increased, the intermixed compounds formed more.

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Characterization and observation of Cu-Cu Thermo-Compression Bonding using 4-point bending test system (4-point bending test system을 이용한 Cu-Cu 열 압착 접합 특성 평가)

  • Kim, Jae-Won;Kim, Kwang-Seop;Lee, Hak-Joo;Kim, Hee-Yeon;Park, Young-Bae;Hyun, Seung-Min
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.4
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    • pp.11-18
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    • 2011
  • The quantitative interfacial adhesion energy of the Cu-Cu direct bonding layers was evaluated in terms of the bonding temperature and Ar+$H_2$ plasma treatment on Cu surface by using a 4-point bending test. The interfacial adhesion energy and bonding quality depend on increased bonding temperature and post-annealing temperature. With increasing bonding temperature from $250^{\circ}C$ to $350^{\circ}C$, the interfacial adhesion energy increase from $1.38{\pm}1.06$ $J/m^2$ to $10.36{\pm}1.01$ $J/m^2$. The Ar+$H_2$ plasma treatment on Cu surface drastically increase the interfacial adhesion energy form $1.38{\pm}1.06$ $J/m^2$ to $6.59{\pm}0.03$ $J/m^2$. The plasma pre-treatment successfully reduces processing temperature of Cu to Cu direct bonding.

A Study on the Theory of $\frac {1}{f}$ Noise in Electronic Devies (전자소자에서의 $\frac {1}{f}$잡음에 관한 연구)

  • 송명호
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.3 no.1
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    • pp.18-25
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    • 1978
  • The 1/f noise spectrum of short-circuited output drain current due to the Shockley-Read-Hal] recombination centers with a single lifetime in homogeneous nondegenerate MOS-field effcte transtors with n-type channel is calculated under the assumptions that the quasi-Fermi level for the carriers in each energy band can not be defined if we include the fluctuation for time varying quantities. and so 1/f noise is a majority carrier effect. Under these assumptions the derived 1/f noise in this paper show some essential features of the 1/f noise in MOS-field effect transistors. That is, it has no lowfrequency plateau and is proportionnal to the channel cross area A and to the driain bias voltage Vd and inversely proportional to the channel length L3 in MOS field effect transistors. This model can explain the discrepancy between the transition frequency of the noise spectrum from 1/f- response to 1/f2 and the frequency corresponding to the relaxation time related to the surface centers in p-n junction diodes. In this paper the results show that the functional form of noise spectrum is greatly influenced by the functional forms of the electron capture probability cn (E) and the relaxation time r (E) for scattering and the case of lattice scattering show to be responsible for the 4 noise in MOS fold effect transistors. So we canconclude that the source of 1/f noise is due to lattice scattering.

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Structural properties of Pd-barium zirconate dense membrane synthesized by dual sputtering method (동시 증착 스퍼터링 공정에 의해 증착된 Pd-barium zirconate membrane의 구조분석)

  • Byeon, Myeong-Seop;Kang, Eun-Tae;Cho, Woo-Seok;Kim, Jin-Ho;Hwang, Kwang-Taek
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.22 no.1
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    • pp.19-24
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    • 2012
  • Barium zirconate exhibits good thermo-chemical stability and proton conduction at high temperatures, but shows poor electron conductivity. Therefore, for high efficiency of hydrogen separation, a very thin and dense Pd-Barium zirconate membrane has to be coated on a porous substrate. A thin and dense Pd-Barium zirconate membrane was successfully synthesized on a porous substrate by means of dual sputtering method. The structural and chemical features of the $BaZr_{0.85}Y_{0.15}O_{3-{\delta}}$ membranes sputtered at $300^{\circ}C$ and $400^{\circ}C$ were investigated by X-ray diffractometry, and it was found that a well-crystallized membrane, Pm-3m space group of $BaZrO_3$, was synthesized. The surface and cross-sectional morphologies of membrane were assessed by SEM (scanning electron microscopy) and TEM(transmission electron microscopy) of the surface and of cross sections. The cross sectional observation of Pd-$BaZr_{0.85}Y_{0.15}O_{3-{\delta}}$ membrane by dual sputtering shows that the coating is quite dense with columnar structure.

3D Finite Element Simulation of Pellet-Cladding Mechanical Interaction (3차원 유한요소를 이용한 핵연료와 피복관 기계적 거동 해석)

  • Seo, Sang Kyu;Lee, Sung Uk;Lee, Eun Ho;Yang, Dong Yol;Kim, Hyo Chan;Yang, Yong Sik
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.40 no.5
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    • pp.437-447
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    • 2016
  • In a nuclear power plant, the fuel assembly, which is composed of fuel rods, burns, and the high temperature can generate power. The fuel rod consists of pellets and a cladding that covers the pellets. It is important to understand the pellet-cladding mechanical interaction with regard to nuclear safety. This paper proposes simulation of the PCMI. The gap between the pellets and the cladding, and the contact pressure are very important for conducting thermal analysis. Since the gap conductance is not known, it has to be determined by a suitable method. This paper suggests a solution. In this study, finite element (FE) contact analysis is conducted considering thermal expansion of the pellets. As the contact causes plastic deformation, this aspect is considered in the analysis. A 3D FE module is developed to analyze the PCMI using FORTRAN 90. The plastic deformation due to the contact between the pellets and the cladding is the major physical phenomenon. The simple analytical solution of a cylinder is proposed and compared with the fuel rod performance code results.