Characterization and observation of Cu-Cu Thermo-Compression Bonding using 4-point bending test system
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Kim, Jae-Won
(Department of Nano-Mechanics, Korea Institute of Machinery & Materials)
Kim, Kwang-Seop (Department of Nano-Mechanics, Korea Institute of Machinery & Materials) Lee, Hak-Joo (Department of Nano-Mechanics, Korea Institute of Machinery & Materials) Kim, Hee-Yeon (Sa-FPA Team, National Nanofab Center) Park, Young-Bae (School of Materials Science and Engineering, Andong National University) Hyun, Seung-Min (Department of Nano-Mechanics, Korea Institute of Machinery & Materials) |
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16 | E. J. Jang, J. W. Kim, B. Kim, T. Matthias and Y. B. Park, "Annealing Temperature Effect on the Cu-Cu Bonding Energy for 3D-IC Integration", Met. Mater. Int., 17, 105 (2011). DOI ScienceOn |
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21 | S. K. Lim, J. W. Choi, Y. H. Kim and T. S. Oh, "Contact Resistance and Thermal Cycling Reliability of the Flip-Chip Joints Processed with Cu-Sn Mushroom Bumps", J. Kor. Inst. Met. & Mater., 46, 585 (2008). |
22 | C. M. Oh, N. C. Park, C. W. Han, M. S. Bang and W. S. Hong, "The Interfacial Reactions and Reliability of SnAgCu Solder Joints under Thermal Shock Cycles", J. Kor. Inst. Met. & Mater., 47, 500 (2009). |
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