• 제목/요약/키워드: Thermal Process

검색결과 5,611건 처리시간 0.031초

THERMAL PLASMA DECOMPOSITION OF FLUORINATED GREENHOUSE GASES

  • Choi, Soo-Seok;Park, Dong-Wha;Watanabe, Takyuki
    • Nuclear Engineering and Technology
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    • 제44권1호
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    • pp.21-32
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    • 2012
  • Fluorinated compounds mainly used in the semiconductor industry are potent greenhouse gases. Recently, thermal plasma gas scrubbers have been gradually replacing conventional burn-wet type gas scrubbers which are based on the combustion of fossil fuels because high conversion efficiency and control of byproduct generation are achievable in chemically reactive high temperature thermal plasma. Chemical equilibrium composition at high temperature and numerical analysis on a complex thermal flow in the thermal plasma decomposition system are used to predict the process of thermal decomposition of fluorinated gas. In order to increase economic feasibility of the thermal plasma decomposition process, increase of thermal efficiency of the plasma torch and enhancement of gas mixing between the thermal plasma jet and waste gas are discussed. In addition, noble thermal plasma systems to be applied in the thermal plasma gas treatment are introduced in the present paper.

Characterizations of Interface-state Density between Top Silicon and Buried Oxide on Nano-SOI Substrate by using Pseudo-MOSFETs

  • Cho, Won-Ju
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제5권2호
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    • pp.83-88
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    • 2005
  • The interface-states between the top silicon layer and buried oxide layer of nano-SOI substrate were developed. Also, the effects of thermal treatment processes on the interface-state distributions were investigated for the first time by using pseudo-MOSFETs. We found that the interface-state distributions were strongly influenced by the thermal treatment processes. The interface-states were generated by the rapid thermal annealing (RTA) process. Increasing the RTA temperature over $800^{\circ}C$, the interface-state density considerably increased. Especially, a peak of interface-states distribution that contributes a hump phenomenon of subthreshold curve in the inversion mode operation of pseudo-MOSFETs was observed at the conduction band side of the energy gap, hut it was not observed in the accumulation mode operation. On the other hand, the increased interface-state density by the RTA process was effectively reduced by the relatively low temperature annealing process in a conventional thermal annealing (CTA) process.

Comprehensive evaluation of cleaner production in thermal power plants based on an improved least squares support vector machine model

  • Ye, Minquan;Sun, Jingyi;Huang, Shenhai
    • Environmental Engineering Research
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    • 제24권4호
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    • pp.559-565
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    • 2019
  • In order to alleviate the environmental pressure caused by production process of thermal power plants, the application of cleaner production is imperative. To estimate the implementation effects of cleaner production in thermal plants and optimize the strategy duly, it is of great significance to take a comprehensive evaluation for sustainable development. In this paper, a hybrid model that integrated the analytic hierarchy process (AHP) with least squares support vector machine (LSSVM) algorithm optimized by grid search (GS) algorithm is proposed. Based on the establishment of the evaluation index system, AHP is employed to pre-process the data and GS is introduced to optimize the parameters in LSSVM, which can avoid the randomness and inaccuracy of parameters' setting. The results demonstrate that the combined model is able to be employed in the comprehensive evaluation of the cleaner production in the thermal power plants.

열플라즈마를 이용한 재료의 표면개질 (Surface modification of materials by thermal plasma)

  • 강성표;이한준;김태희
    • 한국표면공학회지
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    • 제55권6호
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    • pp.308-318
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    • 2022
  • The surface modification and treatment using thermal plasma were reviewed in academic fields. In general, thermal plasma is generated by direct current (DC) and radiofrequency (RF) power sources. Thermal spray coating, a typical commercial process using thermal plasma, is performed by DC thermal plasma, whereas other promising surface modifications have been reported and developed using RF thermal plasma. Beyond the thermal spray coating, physical and chemical surface modifications were attempted widely. Superhydrophobic surface treatment has a very high industrial demand particularly. Besides, RF thermal plasma system for large-area film surface treatment is being developed. Thermal plasma is especially suitable for the surface modification of low-dimensional nanomaterial (e.g., nanotubes) by utilizing high temperature and rapid quenching. It is able to synthesize and modify nanomaterials simultaneously in a one-pot process.

열처리 방법에 따른 SOI 기판의 스트레스변화 (Stress Evolution with Annealing Methods in SOI Wafer Pairs)

  • 서태윤;이상현;송오성
    • 한국재료학회지
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    • 제12권10호
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    • pp.820-824
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    • 2002
  • It is of importance to know that the bonding strength and interfacial stress of SOI wafer pairs to meet with mechanical and thermal stresses during process. We fabricated Si/2000$\AA$-SiO$_2$ ∥ 2000$\AA$-SiO$_2$/Si SOI wafer pairs with electric furnace annealing, rapid thermal annealing (RTA), and fast linear annealing (FLA), respectively, by varying the annealing temperatures at a given annealing process. Bonding strength and interfacial stress were measured by a razor blade crack opening method and a laser curvature characterization method, respectively. All the annealing process induced the tensile thermal stresses. Electrical furnace annealing achieved the maximum bonding strength at $1000^{\circ}C$-2 hr anneal, while it produced constant thermal tensile stress by $1000^{\circ}C$. RTA showed very small bonding strength due to premating failure during annealing. FLA showed enough bonding strength at $500^{\circ}C$, however large thermal tensile stress were induced. We confirmed that premated wafer pairs should have appropriate compressive interfacial stress to compensate the thermal tensile stress during a given annealing process.

대기오염 물질 저감을 위한 저온 플라즈마 반응공정의 특성 (Characteristics of Non-Thermal Plasma Process for Air Pollution Control)

  • 송영훈;신동남;신완호;김관태;최연석;최영석;이원남;김석준
    • 한국대기환경학회지
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    • 제16권3호
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    • pp.247-256
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    • 2000
  • Basic characteristics of non-thermal plasma process to remove C2H4 and NO have been experimentally investigated with a packed-bed type reactor and an ac power supply. The performance of the non-thermal plasma generated by ac power supply was compared with that of a wire-plate type reactor equipped with a pulsed power supply. The result shows that the non-thermal plasma can be effectively generated with an AC power supply that can be easily fabricated with conventional techniques. In order to understand the basic reaction mechanisms of the non-thermal plasma process, parametric tests for different carrier gases(air and nitrogen) and for different reaction pathways have been performed. The test results show that O3 generated by non-thermal plasma plays an dominant role to oxidize C2H4 and NO over N and O radicals when these pollutant gases are carried by dry air under room temperature condition. Experimental observations, however, indicate that N and O radicals can significantly affect on the removal process of the pollutant gases under certain conditions.

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Thermal catalytic de-NOX 공정에서 첨가제가 촉매의 활성에 미치는 영향에 관한 연구 (Effect of Additives on Catalytic Activity in Thermal Catalytic De-NOx Process)

  • 이진구;김태원;최재순;김정호;이재수;장경욱;박해경
    • 한국대기환경학회지
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    • 제15권3호
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    • pp.249-255
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    • 1999
  • We sdudied effect of additives on catalytic activity in thermal catalytic de-NOx process which was composed of thermal reduction, catalytic reduction and catalytic oxidation stage. Pd-Pt/${\gamma}$-$Al_2O_3$ catalysts with the addition of transition metals(Co, Cu, Fe, Ni, W, Zn, Zr) and rare earth metals(Ce, Sr) were prepared by the conventional washcoating method. Those catalysts were characterized by CO pulse chemisorption, ICP, $N_2$ adsorption, SEM and XRD. The effect of catalyst additives on NOx removal for diesel emission was studied in thermal catalytic de-NOx process at reduction temperature(350~50$0^{\circ}C$), space velocity(5,000~20,000 $hr^{-1}$) and the engine load(0~120kW). The concentraton of CO, $CO_2$, NO and $NO_2$ in the exhaust gas increased with the engine load. On the other hand the concentration of $O_2$ decreased. The de-NOx activityof all prepared catalysts increased with respect to high CO and low $O_2$ level in the thermal reduction stage of the process. Insertion of Ce to Pt-Pd/${\gamma}$-$Al_2O_3$ catalyst showed the best activity of all the catalysts under these experimental conditions. De-NOx catalysts are effective to remove CO in addition to NOx in the catalytic reduction stage.

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수직응고 시스템에서 밀도차와 냉각률이 열전달 및 열응력에 미치는 영향 (Effects of Density Change and Cooling Rate on Heat Transfer and Thermal Stress During Vertical Solidification Process)

  • 황기영;이진호
    • 대한기계학회논문집
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    • 제19권4호
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    • pp.1095-1101
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    • 1995
  • Numerical analysis of vertical solidification process allowing solid-liquid density change is performed by a hybrid method between a winite volume method (FVM) and a finite element method (FEM). The investigation focuses on the influence of solid-liquid density change and cooling rates on the motion of solid-liquid interface, solidified mass fraction, temperatures and thermal stresses in the solid region. Due to the density change of pure aluminium, solid-liquid interface moves more slowly but the solidified mass fraction is larger. The cooling rate of the wall is shown to have a significant influence on the phase change heat transfer and thermal stresses, while the density change has a small influence on the motion of the interface, solidified mass fraction, temperature distributions and thermal stresses. As the cooling rate increases, the thermal stresses become higher at the early stage of a solidification process, but it has small influence on the final stresses as the steady state is reached.

저온 수처리장치 열교환기의 열전달 특성에 관한 연구 (A Study on the Performance Prediction of Low Temperature Thermal Desorption System)

  • 이춘태
    • 동력기계공학회지
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    • 제13권6호
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    • pp.76-81
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    • 2009
  • Thermal desorption systems are designed to remove organic compounds from solid matrices such as soils, sludges and filter cakes without thermally destroying them. It is a separation technology, not a destruction technology. Since it is a thermal process, there is a common belief that temperature is the only significant parameter to be monitored. While it is true that better removal efficiencies are usually achieved at higher temperatures, other factors must be considered. Since the process is governed by mass transfer, heating time and the amount of mixing are also key parameters in optimizing removal efficiency. Thermal desorption have been successfully used for just about every organic contaminant found to date. It has also been used to remove mercury. In the present study, the numerical simulation has been performed to investigate the characteristics of heat transfer of LTTD(low temperature thermal desorption). The commercial software, AMESIM was applied for analyzing the heat transfer process in the LTTD.

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Epoxidized Polybutadiene as a Thermal Stabilizer for Poly(3-hydroxybutyrate). II. Thermal Stabilization of Poly(3-hydroxybutyrate) by Epoxidized Polybutadiene

  • Choi, Ju-Yol;Lee, Jong-Keun;You, Young;Park, Won-Ho
    • Fibers and Polymers
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    • 제4권4호
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    • pp.195-198
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    • 2003
  • Epoxidized polybutadiene (EPB) was prepared by polybutadiene (PB) with m-chloroperbenzoic acid (MCPBA) in homogeneous solution. EPB was blended with poly(3-hydroxybutyrate) (PHB) up to 30 wt% by solution-precipitation procedure. The thermal decomposition of PHB/EPB blends was studied by thermogravimetric analysis (TGA), differential scanning calorimetry (DSC) and differential thermal analysis (DTA). The thermograms of PHB/EPB blends contained a two-step degradation process, while that of pure PHB sample exhibited only one-step degradation process. This degradation behavior of PHB/EPB blends, which have a higher thermal stability as measured by maximum decomposition temperature and residual weight, is probably due to crosslinking reactions of the epoxide groups in the EPB component with the carboxyl chain ends of PHB fragments during the degradation process, and the occurrence of such reactions can be assigned to the exothermic peaks in their DTA thermograms.