• Journal of Ocean Engineering and Technology
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• v.24 no.1
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• pp.161-165
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• 2010

In the present study, process optimization for thermal-sprayed STS316 coating has been performed using $L_9(3^4)$ orthogonal array and analysis of variance (ANOVA). STS316 coatings were fabricated by flame spray process on steel substrate, and the hardness test and microstructure observation of the coatings were studied. The results of hardness test were analyzed by ANOVA. The ANOVA results showed that the spray distance had the greatest effect on hardness of the coating, on the other hands, the effects of oxygen gas flow and spray distance were ignorable. From these results, the optimal combination of the flame spray parameters could be derived, and confirmation experiment was carried out to verify these derived results. The calculated hardness of the coatings by ANOVA was found to approximately close to that of confirmation experimental result. Thus, it was considered that design of experiments using orthogonal array and ANOVA was effective for process optimization of thermal-sprayed STS316 coating.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.10
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• pp.4757-4761
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• 2012

LED chip on board(COB) package has been fabricated using aluminum substrate and aluminum anodization process. An alumina layer, used as a dielectric in COB substrate, is produced on aluminum substrate by selective anodization process. Also, selective anodization process makes it possible to construct a thermal via with a fully-filled via hole. Two types of the COB package are fabricated in order to analyze the effects of their substrate types on thermal resistivity and luminous efficiency. The aluminum substrate with the thermal via shows more improved measurement results compared with the alumina substrate. These results demonstrate that selective anodization process and thermal via can increase heat dissipation of COB package in this work. In addition, it is proved experimentally that these parameters also can be enhanced using efficient layout of multiple chip in the COB package.

• Resources Recycling
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• v.26 no.5
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• pp.22-28
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• 2017

In-Bi-Sn alloy sheet has been used as a thermal fusible parts of secondary battery safety system. This study offers a simple process to make In-Bi-Sn alloy fusible parts. The process consists of two procedures, melting and sheeting by tape casting. 62.5 wt%-In 20.0 wt%-Bi 17.5 wt%-Sn (M.P. $92.4^{\circ}C$) alloy sheet obtained by tape casting was used as the thermal fusible sheet of thermal fuse system for mobile telephone. The performance test of the system was carried out in oil bath, and the fusible alloy sheet was melted and cut off at $95^{\circ}C$. This results confirmed the possibility that the alloy sheet obtained by tape casting can be usable as a thermal fusible parts of battery safety system. And this process can be applied as a simple process to recycle the In-Bi-Sn alloy scrap separated from the used thermal fuse system.

• Journal of Welding and Joining
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• v.33 no.2
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• pp.23-31
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• 2015

Stainless steel is used in automobile muffler and exhaust systems. However, in comparison with other steels it has a high thermal expansion rate and low thermal conductivity, and undergoes excessive thermal deformation after welding. To address this problem, we evaluated the use of arc brazing in place of welding for the processing of an exhaust system, and investigated the parameters that affect the joint characteristics. Muffler parts STS439 and hot-dipped Al coated steel were used as test specimens, and CuAl brazing wire was used as the filler metal for the cold metal transfer (CMT) welding machine, which is a low heat input arc welder. In addition, a Box-Behnken design of experiment was used, which is a response surface methodology. The main process parameters (current, speed, and torch angle) were used to determine the appropriate welding quality and the mechanical properties of the brazing part was evaluated at the optimal welding condition. The optimal processing condition for arc brazing was 135A current, 51cm/min speed and $74^{\circ}$ torch angle. The process was applied to an actual exhaust system muffler and the prototype was validated by thermal fatigue, thermal shock, and endurance limit tests.

• Journal of the Optical Society of Korea
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• v.20 no.2
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• pp.314-320
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• 2016

The glass thermal forming process provides a high volume, low cost approach to producing aspherical reflectors for x-ray optics. Thin glass sheets are shaped into mirror segments by replicating the mold shape at high temperature. Heating parameters in the glass thermal slumping process are crucial to improve surface quality of the formed glass. In this research, the heating process of a thermal slumping glass sheet on a concave parabolic mold was simulated with the finite-element method (FEM) to investigate the effects of heating rate and soaking temperature. Based on the optimized heating conditions, glass samples 0.5 mm thick were formed in a furnace with a steel concave parabolic mold. The figure errors of the formed glass were measured and discussed in detail. It was found that the formed glass was not fully slumped at the edges, and should be trimmed to achieve better surface deviation. The root-mean-square (RMS) deviation and peak-valley (PV) deviation between formed glass and mold along the axial direction were 2.3 μm and 4.7 μm respectively.

• Korean Journal of Materials Research
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• v.16 no.9
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• pp.571-577
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• 2006

We fabricated thermal evaporated 10 nm-Ni/(poly)Si and 10 nm-Ni/1 nm-Ir/(poly)Si films to investigate the thermal stability of nickel monosilicide at the elevated temperatures by rapid annealing them at the temperatures of $300{\sim}1200^{\circ}C$ for 40 seconds. Silicides for salicide process was formed on top of both the single crystal silicon actives and the polycrystalline silicon gates. A four-point tester is used for sheet resistance. Scanning electron microscope and field ion beam were employed for thickness and microstructure evolution characterization. An x-ray diffractometer and an auger depth profile scope were used for phase and composition analysis, respectively. Nickel silicides with iridium on single crystal silicon actives and polycrystalline silicon gates showed low resistance up to $1200^{\circ}C$ and $800^{\circ}C$, respectively, while the conventional nickel monosilicide showed low resistance below $700^{\circ}C$. The grain boundary diffusion and agglomeration of silicides led to lower the NiSi stable temperature with polycrystalline silicon substrates. Our result implies that our newly proposed Ir added NiSi process may widen the thermal process window for nano CMOS process.

• Journal of the Korean Society for Heat Treatment
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• v.9 no.2
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• pp.147-158
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• 1996

Generally, analytical consideration on the behaviour of metallic structures during quenching process, and analysis on the thermal stress and deformation after heat treatment are very important in presumption of crack and distorsion of quenched material. In this study a set of constitute equations relevant to the analysis of thermo elasto-viscoplastic materials with strain hysteresis during quenching process way presented on the basis of contimuum thermo-dynamics mechanics. The thermal stresses were numerically calculated by finite element technique of weighted residual method and the principle of virtual work. In the calculation process, the temperature depandency of physical and mechaniclal properties of the material in consideration. On the distribution of elasto-viscoplastic thermal stresses according to radial direction, axial and tangential stress are tensile stress(50MPa, 1.5GPa and 300MPa) in surface and compressive stress(-1.2GPa, -1.14GPa and -750MPa) in the inner part on the other hand, radial stress is tensile stress(900MPa) in area of analysis. According to axial direction, tangential stress gradients are average 60MPa/mm on the whole. The reversion of stress takes place at 11.5 to 16.8mm from the center in area of analysing.

• Journal of the Korean Ceramic Society
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• v.50 no.5
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• pp.326-332
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• 2013

In this study, we prepared yttria stabilized zirconia granules for thermal barrier coatings using a spray drying process. First, we characterized the properties of granules such as flow rate and packing density for utilizing the air plasma spray process. The flow rate and packing density data showed 0.732 g/sec and 2.14 $g/cm^3$, respectively, when we used larger and denser particles, which are better than hollow granules or smaller spherical granules. Second, we chose larger, spherical granules fabricated in alcohol solvent as starting powders and sprayed it on the bondcoat/nimonic alloy by an atmospheric plasma spray process varying the process parameters, the feeding rate, gun speed and spray distance. Finally, we evaluated representative thermal and mechanical characteristics. The thermal expansion coefficients of the coatings were $11{\sim}12.7{\times}10^{-6}/^{\circ}C$ and the indentation stress measured was 2.5 GPa at 0.15 of indentation strain.

• Journal of the Korean Society of Combustion
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• v.10 no.4
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• pp.24-32
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• 2005

Various types of plasma source applied in $CH_4$ decomposition process are compared. DBD by pulse and AC power, spark by pulse and AC power, rotating arc and hollow cathode plasma are chosen to be compared. The results show that $CH_4$ conversion per given unit power is relatively high in hollow cathode plasma and rotating arc that induces rather high temperature condition and that is why both thermal dehydration and plasma induced decomposition contribute for the overall process. In case of DBD wherein high temperature electron and low temperature gas molecule coexist, the process shows low conversion rate, for in rather low temperature condition the contribution of thermal dehydration is lowered. Selectivity of $C_2H_6$ and $C_2H_2$ is shown to be a good parameter of the relative contribution of plasma chemistry in the overall process. From the results we concluded that required condition of plasma source for a cost effective and high yield $CH_4$ decomposition is to have characteristics of both thermal plasma and non thermal plasma in which temperature is high above a certain threshold state for thermal dehydration and electron induced collision is maximized in the same breath.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.12
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• pp.1419-1424
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• 2011

Nanoimprint lithography is a next generation lithography technology, which enables to fabricate nano to micron-scale patterns through simple and low cost process. Nanoimprint lithography has been applied in various industry fields such as light emitting diodes, solar cells and display. Functional patterns, including anti-reflection moth-eye pattern, photonic crystal pattern, fabricated by nanoimprint lithography are used to improve overall efficiency of devices in that fields. For these reasons, in this study, sub-micron-scaled functional patterns were directly fabricated on Si and glass substrates by thermal imprinting process using ZnO nano-particles dispersion resin. Through the thermal imprinting process, arrays of sub-micron-scaled pillar and hole patterns were successfully fabricated on the Si and glass substrates. And then, the topography, components and optical property of the imprinted ZnO nano-particles/resin patterns are characterized by Scanning Electron Microscope, Energy-dispersive X-ray spectroscopy and UV-vis spectrometer, respectively.