• 한국초전도ㆍ저온공학회논문지
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• 제17권4호
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• pp.1-7
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• 2015

This paper addresses technical problems of thermal contact conductance or resistance which inevitably occurs in most cryogenic engineering systems. The main focus of this paper is to examine what kind of physical factors primarily influences the thermal contact resistance and to suggest how it can be minimized. It is a good practical rule that the contact surface must have sub-micron roughness level with no oxide layer and be thinly covered by indium, gold, or Apiezon-N grease for securing sufficient direct contact area. The higher contact pressure, the lower the thermal contact resistance. The general description of this technique has been widely perceived and reasonable engineering results have been achieved in most applications. However, the detailed view of employing these techniques and their relative efficacies to reduce thermal contact resistances need to be thoroughly reviewed. We should consider specific thermal contact conditions, examine the engineering requirements, and execute each method with precautions to fulfil their maximum potentials.

• 대한기계학회논문집A
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• 제30권7호
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• pp.833-840
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• 2006

The paper presents a numerical solution to the problem of a hot rigid indenter sliding over a thermoelastic Winkler foundation with a thermal contact resistance at constant speed. It is shown analytically that no steady-state solution can exist for sufficiently high temperature or sufficiently small normal load or speed, regardless of the thermal contact resistance. However the steady state solution may exist in the same situation if the thermal contact resistance is considered. This means that the effect of the large values of temperature difference and small value of force or velocity which occur at no steady state can be lessened due to the thermal contact resistance. When there is no steady state, the predicted transient behavior involves regions of transient stationary contact interspersed with regions of separation regardless of the thermal contact resistance. Initially, the system typically exhibits a small number of relatively large contact and separation regions, but after the initial transient, the trailing edge of the contact area is only established and the leading edge loses contact, reducing the total extent of contact considerably. As time progresses, larger and larger numbers of small contact areas are established, unlit eventually the accuracy of the algorithm is limited by the discretization used.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2005년도 춘계학술대회논문집
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• pp.330-333
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• 2005

The paper presents a numerical solution to the problem of a hot rigid indenter siding over a thermoelastic Winkler foundation with a thermal contact resistance at constant speed. It is shown analytically that no steady-state solution can exist for sufficiently high temperature or sufficiently small normal load or speed regardless of the thermal contact resistance. However, the steady state solution may exist in the same situation if the thermal contact resistance is considered. This means that the effect of the large values of temperature difference and small value of force or velocity which occur at no steady state can be lessened due to the thermal contact resistance. When there is no steady-state the predicted transient behavior involves regions of transient stationary contact interspersed with regions of separation regardless of the thermal contact resistance. Initially, the system typically exhibits a small number of relatively large contact and separation regions, but after the initial transient the trailing edge of the contact area is only established and the leading edge loses contact, reducing the total extent of contact considerably. As time progresses, larger and larger number of small contact areas are established, until eventually the accuracy of the algorithm is limited by the discretization used.

• 한국융합학회논문지
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• 제9권1호
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• pp.283-289
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• 2018

자동차 디스크 브레이크시스템에서는 열유속 및 열변형 등과 같은 이유로 마찰열이 균일하게 분산되지 않는다. 마찰열에 의한 열탄성 변형이 접촉압력 분포에 영향을 미치게 되고, 접촉하중이 디스크 브레이크 표면상의 작은 영역에 집중되어 열탄성 불안정성을 초래 할 수 있다. 본 연구에서는 실험적 계산식과 Kao 제안한 디스크와 패드의 접촉압력에 대한 해석방법을 참고로 하여 3차원 축대칭 모델을 통하여 실제로 제동 시 발생되는 디스크와 패드의 접촉을 고려한 온도해석 및 열변형 해석을 하였다. ANSYS를 사용하여 디스크와 패드의 접촉면에서 발생하는 열탄성 불안전성 문제를 열하중과 기계적 하중으로 동시에 고려하여 해석하였다. 디스크와 패드가 직접 접촉하는 3차원 축대칭 모델을 구성하여 디스크의 마찰면 온도, 열변형, 접촉 열응력을 관찰함으로써 디스크에서 일어나는 열적 거동을 보다 정확하게 관찰하였다.

• 한국정밀공학회지
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• 제30권9호
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• pp.943-950
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• 2013

This paper describes the thermal contact resistance and its effect on the performance of thermal interface material. An ASTM D 5470 based apparatus is used to measure the thermal interface resistance. Bulk thermal conductivity of different interface material is measured and compared with manufacturers' data. Also, the effect of grease void in the contact surface is investigated using the same apparatus. The flat type thermal interface tester is proposed and compared with conventional one to consider the effect of lateral heat flow. The results show that bulk thermal conductivity alone is not the basis to select the interface material because high bulk thermal conductivity interface material can have high thermal contact resistance, and that the center voiding affects the thermal interface resistance seriously. On the aspect of heat flow direction, thermal impedance of the lateral heat flow shows higher than that of the longitudinal heat flow by sixteen percent.

• 설비공학논문집
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• 제3권4호
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• pp.256-262
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• 1991

The corrosion effects on thermal contact resistance were experimentally studied for a given contact interface of a couple of metals. 2 cylindrically shaped test pieces, the one was carbon steel whose surface was machined by lathe and the other was stainless steel, ground, were come into contact under pressure, and then submerged to $HNO_3$ gas environment. While the corrosion process was going on, the thermal contact resistance was measured with time. The experiment was performed for 2 cases; 1) Highly compress the test pieces and then bring them to $HNO_3$ gas environment. 2) Anteriorly corrode the interface under low contact pressure and then increase the contact pressure. The results were as follows; In 1st. case of experiment, the thermal contact resistance seemed to be very stable, and showed low values with a tendancy of small decrease with time. But in 2nd. case the resistance was unstable and jumped to a value of 200-250% more then that expected for uncontaminated interface. More over it demonstrated some increase with time.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회B
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• pp.2214-2219
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• 2008

The thermal contact resistance(TCR) of nanosized contact spots has been investigated through a multiscale analysis which considers the resolution of surface topography. A numerical simulation is performed on the finite element model of rough surfaces. Especially, as the contact size decreases below the phonon mean free path, the size dependent thermal conductivity is considered to calculate the TCR. In our earlier model which follows an elastic material, the TCR increases without limits as the number of nanosized contact spots increases in the process of scale variation. However, the elastoplastic contact induces a finite limit of TCR as the scale varies. The results are explained through the plastic behavior of the two contacting models. Furthermore, the effect of air conduction in nanoscale is also investigated.

• 한국안전학회지
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• 제24권2호
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• pp.30-36
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• 2009

This paper aims at the precursor analysis and DB development of electrical fires based on thermal and current signals for partial disconnection and poor contact on electric wires through experiments and simulations. Also, DB system required for developing the precursor DB with these data was studied and designed. Firstly, in case of partial disconnection, characteristics were derived and analyzed by experiment and electrical-thermal finite element method(Flux 3D) on the model wires which consist of VCTF and IV electric wires. Based on the characteristics, About 351 partial disconnection precursor patterns were generated by the thermal analysis for electric wire according to deterioration time under normal state and 200% overload state of rated current. Secondly, in order to develop poor contact precursor patterns, temperature value and the current signal were considered. In simulating the poor contact situation on connector area of MCCB, connection torque was changed. Through the experimental analysis, about 251 poor contact precursor patterns were generated. Finally, Using thermal precursor patterns obtained by partial disconnection and poor contact, electrical fire thermal precursor DB was developed.

• 한국생산제조학회지
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• 제21권6호
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• pp.1008-1012
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• 2012

Injection molds are fabricated by assembling a number of plates in which mold core and cavity components are inserted. The assembled structure causes a number of contact interfaces between each component where the heat transfer is affected by the thermal contact resistance. However, the mold assembly has been treated as a one body in numerical analyses of injection molding, which has a limitation in predicting the mold temperature distribution during the molding cycle. In this study, a numerical approach that considers the thermal contact effect is proposed to predict the heat transfer characteristics of an injection mold assembly. To find the thermal contact conductance between the mold core and plate, a number of finite element (FE) simulations were performed with the design of experiment (DOE) and statistical analysis. Thus, the heat transfer analyses using the obtained conductance values can provide more reliable results than conventional one-body simulations.

• 대한금속재료학회지
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• 제46권9호
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• pp.585-592
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• 2008

Flip-chip bonding using Cu-Sn mushroom bumps composed of Cu pillar and Sn cap was accomplished, and the contact resistance and the thermal cycling reliability of the Cu-Sn mushroom bump joints were compared with those of the Sn planar bump joints. With flip-chip process at a same bonding stress, both the Cu-Sn mushroom bump joints and the Sn planar bump joints exhibited an almost identical average contact resistance. With increasing a bonding stress from 32 MPa to 44MPa, the average contact resistances of the Cu-Sn mushroom bump joints and the Sn planar bump joints became reduced from $30m{\Omega}/bump$ to $25m{\Omega}/bump$ due to heavier plastic deformation of the bumps. The Cu-Sn mushroom bump joints exhibited a superior thermal cycling reliability to that of the Sn planar bump joints at a bonding stress of 32 MPa. While the contact resistance characteristics of the Cu-Sn mushroom bump joints were not deteriorated even after 1000 thermal cycles ranging between $-40^{\circ}C$ and $80^{\circ}C$, the contact resistance of the Sn planar bump joints substantially increased with thermal cycling.