Browse > Article
http://dx.doi.org/10.7736/KSPE.2013.30.9.943

Characterization of Thermal Contact Resistance Doped with Thermal Interface Material  

Bajracharya, Iswor (Department of Mechanical and Industrial Engineering of Vienna University of Technology)
Ito, Yoshimi (Tokyo Institute of Technology)
Nakayama, Wataru (Thermtech International)
Moon, Byeong-Jun (School of Mechatronics, Gwangju Institute of Science & Technology)
Lee, Sun-Kyu (School of Mechatronics, Gwangju Institute of Science & Technology)
Publication Information
Journal of the Korean Society for Precision Engineering / v.30, no.9, 2013 , pp. 943-950 More about this Journal
Abstract
This paper describes the thermal contact resistance and its effect on the performance of thermal interface material. An ASTM D 5470 based apparatus is used to measure the thermal interface resistance. Bulk thermal conductivity of different interface material is measured and compared with manufacturers' data. Also, the effect of grease void in the contact surface is investigated using the same apparatus. The flat type thermal interface tester is proposed and compared with conventional one to consider the effect of lateral heat flow. The results show that bulk thermal conductivity alone is not the basis to select the interface material because high bulk thermal conductivity interface material can have high thermal contact resistance, and that the center voiding affects the thermal interface resistance seriously. On the aspect of heat flow direction, thermal impedance of the lateral heat flow shows higher than that of the longitudinal heat flow by sixteen percent.
Keywords
Thermal Interface Material; Thermal Contact Resistance; Thermal Impedance; Bulk Thermal Conductivity; Apparent Thermal Conductivity;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 Kim, J. K., Nam, S.-K., Nakayama, W., and Lee, S. -K., "Compact Thermal Network Model of the Thermal Interface Material Measurement Apparatus With Multi-Dimensional Heat Flow," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 1, No. 8, pp. 1186- 1194, 2011.   DOI   ScienceOn
2 Kearns, D., "Improving Accuracy and Flexibility of ASTM D 5470 for High Performance Thermal Interface Materials," 19th IEEE Semiconductor Thermal Measurement and Management Symposium, pp. 129-133, 2003.
3 ASTM D5470-01, "Standard Test Method for Thermal Transmission Properties of Thin Thermally Conductive Solid Electrical Insulation Materials," 2001.
4 Kim, J. K., Nakayama, W., and Lee, S. K., "Characterization of a thermal interface material with heat spreader," J. Korean Soc. Precis. Eng., Vol. 26, No. 1, pp. 91-98, 2010.   과학기술학회마을
5 Gwinn, J. P. and Webb, R. L., "Performance and testing of thermal interface materials," Microelectronics Journal, Vol. 34, No. 3, pp. 215-222, 2003.   DOI   ScienceOn
6 Grujicic, M., Zhao, C. L., and Dusel, E. C., "The effect of thermal contact resistance on heat management in the electronic packaging," Applied Surface Science, Vol. 246, pp. 290-302, 2005.   DOI   ScienceOn
7 Mahajan, R., "Thermal Interface Materials: A Brief Review of Design Characteristics and Materials," Electronics Cooling, Vol. 2, No. 1, 2004.
8 Madhusudana, C. V., "Accuracy in thermal contact conductance experiments -The effects of heat loss to the surroundings," International Communications in Heat and Mass Transfer, Vol. 27, No. 6, pp. 877-891, 2000.   DOI   ScienceOn
9 Bahrami, M., Yovanovich, M. M., and Culham, J. R., "Thermal Joint Resistance of Conforming Rough Surfaces with Gas-filled Gaps," Journal of Thermophysics and Heat Transfer, Vol. 18, No. 3, pp. 318-325, 2004.   DOI   ScienceOn
10 Sarvar, F., Whalley, D. C., and Conway, P. P., "Thermal Interface Materials - A Review of the State of the Art," 1st Electronics Systemintegration Technology Conference, Vol. 2, pp. 1292-1302, 2006.
11 Bahram, M., Yavanovich, M. M., and Culham, J. R., "Thermal contact resistance at low contact pressure: Effect of elastic deformation," International Journal of Heat and Mass Transfer, Vol. 48, No. 16, pp. 3284- 3293, 2005.   DOI   ScienceOn
12 Savija, I., Culham, J. R., and Yovanovich, M. M., "Effective thermophysical properties of thermal interface materials: Part 1 definitions and models," proc. of International Electronic Packaging Technical Conference and Exhibition, Documet ID: IPACK2003-35088, 2003.
13 Hanson, K., "ASTM D 5470 TIM Material Testing," IEEE 22nd Annual Semiconductor Thermal Measurement and Management Symposium, pp. 50- 53, 2006.
14 Gwinn, J. P., Saini, M., and Webb, R. L., "Apparatus for Accurate Measurement of Interface Resistance of High Performance Thermal Interface Materials," The 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 644-650, 2002.