Contact Resistance and Thermal Cycling Reliability of the Flip-Chip Joints Processed with Cu-Sn Mushroom Bumps |
Lim, Su-Kyum
(Materials Science and Engineering, Hongik University)
Choi, Jin-Won (Samsung Electro-Mechanics, Corporate R&D Institute) Kim, Young-Ho (Materials Science and Engineering, Hanyang University) Oh, Tae-Sung (Materials Science and Engineering, Hongik University) |
1 | T. Braun, K. F. Becker, M. Koch, V. Bader, R. Aschenbrenner, and H. Reichl, J. Microelectron. Reliab. 46, 144 (2006) DOI ScienceOn |
2 | M. J. Rizvi, H. Lu, C. Bailey, Y. C. Chan, M. Y. Lee, and C. H. Pang, J. Microelectron. Engineer. 85, 238 (2008) DOI ScienceOn |
3 | M. Mori, Y. Kizaki, M. Saito, and A. Hongu, IEEE Trans. Comp. Hybrids, Manufact. Technol. 16, 852 (1993) DOI ScienceOn |
4 | M. J. Yim, J. S. Hwang, W. Kwon, K. W. Jang, and K. W. Paik, IEEE Trans. Electronics Packag. Manufact. 26, 150 (2003) DOI ScienceOn |
5 | Y. T. Hsieh, Proc. Inter. Symp. Electron. Mater. Packag. (2002) p.157 |
6 | JEDEC Specification, Coplanarity Test for Surface-Mount Semiconductor Devices, JESD22-B108A |
7 | K. N. Tu, Mater. Chemistry & Physics 46, 217 (1996) DOI ScienceOn |
8 | U. B. Kang and Y. H. Kim, Proc. 3rd Int. Symp. Electron. Mater. & Packag. p.12 (2001) |
9 | Y. N. Kim, J. M. Koo, S. K. Park, and S. B. Jung, J. Korean Inst. Met. Mater. 46, 33 (2008) |
10 | U. B. Kang and Y. H. Kim, IEEE Trans. Comp. Packag. Technol. 27, 253 (2004). DOI ScienceOn |
11 | Y. P. Wu, M. O. Alam, Y. C. Chan, B. Y. Wu, Microelectron. Reliab. 44, 295 (2004) DOI ScienceOn |
12 | L. K. Teh, E. Anto, C. C. Wong, S. G. Mhaisalkar, E. H. Wong, P. S. Teo, and Z. Chen, Thin Solid Films 462, 446 (2004) DOI ScienceOn |
13 | D. K. Schroder, Semiconductor Material and Device Characterization, 2nd ed., John Wiley & Sons, Inc., New York (1998) p.10 |
14 | L. K. The, C. C. Wong, S, Mhaisalkar, K. Ong, P. S. Teo, and E. H. Wong, J. Electron. Mater. 33, 271 (2004) DOI |
15 | L. Han and J. Zhong, J. Microelectron. Eng. 85, 1568 (2008) DOI ScienceOn |
16 | J. W. Wan, W. J. Zhang, and D. J. Bergstrom, J. Microelectron. Reliab. 38, 67 (2007) DOI ScienceOn |
17 | J. H. Lee, G. T. Lim, S. T. Yang, M. S. Suh, Q. H. Chung, K. Y. Byun, and Y. Bae Park, J. Korean Inst. Met. Mater. 46, 310 (2008) |
18 | H. Kristiansen and J. Liu, IEEE Trans. Comp. Packag. Manufact. Technol. A 21, 208 (1998) DOI ScienceOn |
19 | Y. W. Chiu, Y.C. Chan, S.M. Lui, Microelectron. Reliab. 42, 1945 (2002) DOI ScienceOn |
20 | J. W. Nah and K. W. Paik, Proc. Electron. Comp. Technol. Conf. (2001) p.790 |
21 | K. Y. Lee, Y. H. Lee, Y. H. Kim, and T. S. Oh, J. Korean Inst. Met. Mater. 43, 1 (2005) |
22 | C. W. Ju, K. H. Pack, H. T. Lee and Y. C. Hyun, J. Korean Phys. Soc. 42, S574 (2003) |