• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2001년도 ICCAS
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• pp.127.4-127
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• 2001

Inspection and shape measurement of three-dimensional objects are widely needed in industries for quality monitoring and control. A number of visual or optical technologies have been successfully applied to measure three dimensional surfaces. Especially, the shape measurement using an interferometric principle becomes a successful methodology. However, those conventional interferometric methods to measure surface profile have an inherent shortcoming, namely 2∏ ambiguity problem. The problem inevitably happens when the object to be measured has discontinuous shape due to the repetition of interferometric signal with phase period of 2∏. Therefore, in this paper, we choose as a shape measuring method, ...

• 한국기계가공학회지
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• 제7권1호
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• pp.47-52
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• 2008

We present a 3-D profiler specially devised for the profile measurement of rough surfaces that are difficult to be measured with conventional non-contact interferometer. The profiler comprises multiple two-point-diffraction sources made of single-mode optical fibers. Test measurement proves that the proposed profiler is well suited for the warpage inspection of microelectronics components with rough surface, such as unpolished backsides of silicon wafers and plastic molds of integrated-circuit chip package.

• 한국정밀공학회지
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• 제18권2호
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• pp.90-95
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• 2001

f-$\theta$len is one of the important parts in Laser Scanning Unit because it affects on the optical performance of Laser Scanning Unit dominantly. It is necessary to find out the relationship between the surface profile error of f-$\theta$lens and the beam profile focusing on the Organic Photo Conductive drum in order to analysis the beam profile problems such as appearance of side lobe and expansion of center lobe. In this research, a simulation process which relates the surface profile characteristics to the beam profile has been developed by CODE V. The simulated beam profile also have been compared with the measurement results.

• Journal of the Optical Society of Korea
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• 제12권4호
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• pp.281-287
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• 2008

An acousto-optic tunable filter based 3-D micro surface profile measurement using an equally spaced 5 spectral phase shifting is described. The 5-bucket spectral phase shifting method is compared with a Fourier-transform method in the spectral domain. It can provide a fast measurement capability while maintaining high accuracy since it needs only 5 pieces of spectrally phase shifted imaging data and a simple calculation in comparison with the Fourier transform method that requires full wavelength scanning data and relatively complicated computation. The 3-D profile data of micro objects can be obtained in a few seconds with an accuracy of ${\sim}10nm$. The 3-D profile method also has an inherent benefit in terms of being speckle-free in measuring diffuse micro objects by employing an incoherent light source. Those simplicity and practical applicability is expected to have diverse applications in 3-D micro profilometry such as semiconductors and micro-biology.

• International Journal of Precision Engineering and Manufacturing
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• 제7권1호
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• pp.9-12
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• 2006

A spectral analysis and numerical simulation are employed to assess the effects of the stylus tip radius on measuring surface profiles. Original profiles with fractal spectral densities are generated and then are numerically traced with circular tipped stylus. Instead of their spectral densities, the accumulative power spectrums of traced profiles are analyzed. It is shown that the minimum wavelength of traced profile relates directly to the radius r of the stylus tip and the root-mean-square (rms) roughness ${\sigma}_o$ of original profile. From this accumulation spectral analysis, a formula is developed to estimate the minimum wavelength of traced profile. By using the concept of the minimum wavelength, an appropriate stylus tip radius can be chosen for the given rms roughness ${\sigma}_o$ of the profile.

• 제어로봇시스템학회논문지
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• 제19권11호
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• pp.968-973
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• 2013

In the transportation industry, especially in the shipbuilding process, 3D surface measurement of large-scale hull pieces is needed for fabrication and assembly. We suggest an efficient method for checking the shape of curved plates under the forming operation with short time by measuring 3D profiles along the multi lines of the target surface. For accurate profile reconstruction, 2D camera calibration and 3D calibration using gauge blocks were performed. The evaluation test shows that the measurement accuracy is within the boundary of tolerance required in the shipbuilding process.

• 한국광학회지
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• 제18권2호
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• pp.130-134
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• 2007

광역의 자유곡면 형상을 나노미터 정밀도로 측정하기 위한 새로운 형상 측정법으로서 곡률에 근거한 형상 측정법을 제안한다. 곡률 형상 측정기는 피측정물을 일정간격으로 스캔하는 간섭계로써 각 국부영역의 형상으로부터 곡률을 획득하여, 이로부터 전 영역의 형상을 복원한다. 제안된 곡률 형상 측정기는 비구면 형상 측정을 위해 개발된 보상 광학계(Null optics)나 국부영역의 형상을 측정하고 결합하는 subaperture-slicking 법에 비해 측정 장비로부터 발생하는 시스템 오차를 근본적으로 제거하는 특징을 가진다. $80mm\times80mm\times25mm$ 작동구간을 갖는 Stewart Platform과 상용 트와이만 그린 간섭계를 이용하여 곡률간섭계를 구성하였으며, 자유곡면의 형상측정을 위한 첫 단계로서 잘 알려진 구면형상을 측정하고, 기존 장비의 측정값과 비교한 결과 32 mm영역에서 최대 56 nm의 차를 보임을 확인하였다.

• 한국정밀공학회지
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• 제24권1호
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• pp.37-46
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• 2007

The vibration environment essentially companied by vehicle operation on the ground is determined by the shape of road surface, which is called profile. This paper focuses on development of a profile and severity measurement system for unpaved test courses. In general, the profile and severity of unpaved road is an important issue in the reliability of endurance test. In order to measure unpaved road profile and severity, it is necessary to develop a profilometer system. The developed profilometer system is composed of data processing computer, power unit, air compressor and sensors(encoder, vertical gyro and laser displacement) This paper presents the measuring system configuration, measurement principle of road profile and analysis method of road characteristics used at CPG(Changwon Proving Ground) for this purpose.

• 한국광학회지
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• 제14권5호
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• pp.504-508
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• 2003

최근 전자산업계에 새롭게 널리 생산되는 마이크로 전자부품들은 왜곡이 최소화된 정밀한 외관 형상을 갖도록 제조되고 관리되지만, 측정 대상의 표면이 가시광 영역에서 광산란되는 특징을 가짐으로 인해, 기존의 피죠나 마이켈슨 형태의 비교간섭법으로는 고정밀의 삼차원 형상측정이 용이하지 아니하였다. 본 논문에서는 광섬유를 이용한 새로운 개념의 점회절 간섭계를 제안하고, 이를 광산란 거친표면의 대표적인 제품인 칩패키지와 실리콘 웨이퍼의 삼차원 형상 측정에 적용하였다. 측정결과 66 mm 측정영역에서 측정 형상오차 PV(peak-to-valley value) 5.6 $\mu\textrm{m}$, 분산값($\sigma$) 1.5 $\mu\textrm{m}$를 획득함으로써 기존의 비교 간섭 측정법에 비해 더욱 향상된 측정 정밀도를 획득하였다.

• 한국전자파학회논문지
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• 제17권12호
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• pp.1181-1188
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• 2006

본 논문에서는 토양 표면의 레이더 후방 산란 계수와 표면 거칠기의 관계를 계산해 보고, 측정 길이에 따른 표면 거칠기 변화를 알아본 후에, 측정 길이에 따른 표면 거칠기와 레이더 후방 산란 계수의 관계를 보여준다. 이 연구 결과에 따르면, 측정 길이가 짧아져서 표면 거칠기 값의 변화가 심하다하더라도 계산된 레이더 후방 산란 계수에는 적은 영향밖에 주지 않는다는 것을 보여준다.