• Title/Summary/Keyword: Surface micromachining

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Fabrication of Micro-optical Components and Actuators using Surface Micromachining (표면 미세가공기술을 이용한 마이크로 광학소자 및 구동기의 제작)

  • Kim, K.N.;Park, K.B.;Jung, S.W.;Lee, B.N.;Kim, I.H.;Moon, H.C.;Park, H.D.;Shin, S.M.
    • Proceedings of the KIEE Conference
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    • 1999.11d
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    • pp.1151-1153
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    • 1999
  • 3-layer polysilicon 표면미세가공공정을 이용하여 micro zone plate 렌즈와 미러 및 이를 구동하기 위한 구동기를 일체화시킨 마이크로 구동형 광학소자를 설계, 제작하였다. 650nm의 파장대역에서 초점거리가 $500{\mu}m$가 되도록 마이크로 zone plate 렌즈를 설계하였으며, 렌즈의 광학축은 실리콘 기판 상에서 $121{\mu}m$거리에 위치하도록 제작하였다. 마이크로 hinge와 스프링 latch 및 측면지지 plate를 이용하여 마이크로 렌즈와 미러가 실리콘 기판상에서 out-of-plane동작이 가능하도록 하였다. 마이크로렌즈 초점거리의 가변을 위하여 6개의 SDA(Scratch Drive Actuator)어레이를 설계, 제작하였다. 또한 빔 반사를 위한 마이크로 미러를 설계하고 $45^{\circ}$ self-assembly를 위하여 마이크로 hinge와 SDA array를 제작하였다.

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Fabrication of Microstructures for Conductive Polymer Actuators Using MEMS Process (MEMS 공정을 이용한 전도성 고분자 액추에이터용 마이크로 구조물의 제작)

  • Lee, Seung-Ki;Jung, Seng-Hwan
    • Journal of Sensor Science and Technology
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    • v.12 no.4
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    • pp.156-163
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    • 2003
  • Polypyrrole microactuators have been fabricated by the standard surface micromachining method combined with the electropolymerization of polypyrrole. The fundamental structure to verify the feasibility of the fabrication process is polypyrrole cantilever. Based on these process, polypyrrole grippers and valves for the manipulation of the cell have been fabricated. Grippers have the structure of bone and muscle which are rigid polymers and polypyrrole, respectively. Valves have the assembled structure of channels with polypyrrole cantilevers. The proposed fabrication process and structures are expected to be used for bio-related applications, for example, the cell manipulation.

Three-Dimensional Self-Assembled Micro-Array Using Magnetic Force Interaction

  • Park, Yong-Sung;Kwon, Young-Soo;Eiichi Tamiya;Park, Dae-Hee
    • KIEE International Transactions on Electrophysics and Applications
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    • v.3C no.5
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    • pp.182-188
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    • 2003
  • We have demonstrated a fluidic technique for self-assembly of microfabricated parts onto substrate using patterned shapes of magnetic force self-assembled monolayers (SAMs). The metal particles and the array were fabricated using the micromachining technique. The metal particles were in a multilayer structure (Au, Ti, and Ni). Sidewalls of patterned Ni dots on the array were covered by thick negative photoresist (SU-8), and the array was magnetized. The array and the particles were mixed in buffer solution, and were arranged by magnetic force interaction. Binding direction of the metal particle onto Ni dots was controlled by multilayer structure and direction of magnetization. A quarter of total Ni dots were covered by the particles. The binding direction of the particles was controllable, and condition of particles was almost even with the Au surface on top. The particles were successfully arranged on the array.

Properties of the Amorphous Silicon Microbolometer using PECVD (PECVD 이용한 비정질 실리콘형 마이크로 볼로미터 특성)

  • Kang, Tai Young;Kim, Kyung Hwan
    • Journal of the Semiconductor & Display Technology
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    • v.11 no.4
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    • pp.19-23
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    • 2012
  • We report microbolometer characteristic with n-type and p-type amorphous silicon thin film. The n-type and p-type amorphous silicon thin films were made by PECVD. The electrical properties of n-type and p-type a-Si:H thin films were investigated as a function of doping gas flow rate. The doping gas used $B_2H_6/Ar$ (1:9) and $PH_3/Ar$ (1:9). In general, the conductivity of doping a-Si:H thin films increased as doping gas increase but the conductivity of a-Si:H thin films decreased as the doping gas increase because doping gas concentration increase led to dilution gas (Ar) increase as the same time. We fabricated an amorphous silicon microbolometer using surface micromachining technology. The fabricated microbolometer had a negative TCR of 2.3%. The p-type microbolometer had responsivity of $5{\times}10^4V/W$ and high detectivity of $3{\times}10^8cm(Hz)^{1/2}/W$. The p-type microbolometer had more detectivity than n-type for less noise value.

Torsional Micromechanical Switching Element Including Bumps for Reducing the Voltage Difference Between Pull-in and Release (Pull-in과 release 전압차 감소용 돌기구조를 갖는 비틀림형 초소형 기계적 스위칭 소자)

  • Ha, Jong-Min;Han, Seung-O;Park, Jeong-Ho
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.50 no.9
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    • pp.471-475
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    • 2001
  • ln this paper, a micromachined micromechanical switch is presented. The presented switch is operated in the vertical direction to the substrate by an electrostatic force between two parallel plates. The moving plate is pulled down to connect the bumps of the bias node$(V_{DD}/ or GND)$ to the bumps of the output node when a oltage difference exists between the moving plate and the input plate. The switch was designed to operate at a low switching voltage$(\risingdotseq5V)$ by including a large-area, narrow-gap, parallel plate capacitor A theoretical analysis of the designed switch was performed in order to determine its geometry fitting the desired pull-in voltage and release voltage. The designed switch was fabricated by surface micromachining combined with Ni electroplating. From the experimental results of the fabricated switch, its pull-in voltage came Out to be less than 5V and the measured maximum allowable current was 150mA. The measured average ON-state resistance was about 8$\Omega$, and the OFF-state resistance was too high to be measured with digital multimeter.

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Monolithically Integrable RF MEMS Passives

  • Park, Eun-Chul;Park, Yun-Seok;Yoon, Jun-Bo;Euisik Yoon
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.2 no.1
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    • pp.49-55
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    • 2002
  • This paper presents high performance MEMS passives using fully CMOS compatible, monolithically integrable 3-D RF MEMS processes for RF and microwave applications. The 3-D RF MEMS technology has been developed and investigated as a viable technological option, which can break the limit of the conventional IC technology. We have demonstrated the versatility of the technology by fabricating various 3-D thick-metal microstructures for RF and microwave applications, such as spiral/solenoid inductors, transformers, and transmission lines, with a vertical dimension of up to $100{\;}\mu\textrm{m}$. To the best of our knowledge, we report that we are the first to construct a fully integrated VCO with MEMS inductors, which has achieved a low phase noise of -124 dBc/Hz at 300 kHz offset from a center frequency of 1 GHz.

Comparison of Ablation Characteristics of Carbon Nanotube reinforced Hybrid Al2O3 by using Ultrashort Pulse Laser (순수 알루미나와 탄소나노튜브 강화 알루미나 복합체의 극초단 펄스레이저 가공특성 비교)

  • Lee, Jun-Young;Yoon, Ji-Wook;Kang, Myung-Chang;Cho, Sung-Hak
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.12 no.6
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    • pp.23-29
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    • 2013
  • In this paper, pure $I_{ph}$ and hybrid carbon nanotube reinforced $I_{ph}$ were sintered using the SPS(spark plasma sintering) method for high densification. A nanosecond laser (${\lambda}=1063nm$, ${\tau}P=10ns$) and a femtosecond laser (${\lambda}=1027nm$, ${\tau}P=380fs$) were installed on an optical system for the micromachining test. The ablation characteristics of the pure $I_{ph}$ and CNT/$I_{ph}$ composites, such as thermal effect and ablation depth, were investigated using FE-SEM and a confocal microscope device. Laser machining results for the two mating materials showed improved performances: CNT/$I_{ph}$ composites showed good surface morphology of hole drilling without a melting zone due to the composites' high thermal properties; also, the ablated depth of CNT/$I_{ph}$ was higher than that of pure $I_{ph}$.

Consumable Approaches of Polysilicon MEMS CMP

  • Park, Sung-Min;Jeong, Suk-Hoon;Jeong, Moon-Ki;Park, Boum-Young;Jeong, Hae-Do;Kim, Hyoung-Jae
    • Transactions on Electrical and Electronic Materials
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    • v.7 no.4
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    • pp.157-162
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    • 2006
  • Chemical-mechanical polishing (CMP), one of the dominant technology for ULSI planarization, is used to flatten the micro electro-mechanical systems (MEMS) structures. The objective of this paper is to achieve good planarization of the deposited film and to improve deposition efficiency of subsequent layer structures by using surface-micromachining process in MEMS technology. Planarization characteristic of poly-Si film deposited on thin oxide layer with MEMS structures is evaluated with different slurries. Patterns used for this research have shapes of square, density, line, hole, pillar, and micro engine part. Advantages of CMP process for MEMS structures are observed respectively by using the test patterns with structures larger than 1 urn line width. Preliminary tests for material selectivity of poly-Si and oxide are conducted with two types of silica slurries: $ILD1300^{TM}\;and\;Nalco2371^{TM}$. And then, the experiments were conducted based on the pretest. A selectivity and pH adjustment of slurry affected largely step heights of MEMS structures. These results would be anticipated as an important bridge stone to manufacture MEMS CMP slurry.

Microgripper driven by E-T(Electro-Thermal) actuator (E-T(Electro-Thermal) 액츄에이터를 이용한 microgripper)

  • Park, Ho-Joon;Lee, Hyun-Ki;Pak, Jung-Ho
    • Proceedings of the KIEE Conference
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    • 1999.07g
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    • pp.3325-3327
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    • 1999
  • A microgripper driven by E-T (electro-thermal) actuators has been designed and fabricated by surface micromachining. This microgripper consists of two E-T actuators. Each actuator has two arms with different widths joined at the end to form a 'U' shape. The wider 'cold' arm has a narrow flexure at the end (anchor or electrode side) for easy bending, This actuator can be fabricated with only two masks - one for the sacrificial layer and the other for the poly-Si structure layer. An E-T actuator bends its arm due to unequal thermal expansion between the 'cold' arm and the 'hot' arm, This actuator tip moves laterally in an arcing motion towards the cold arm side when the structure is unevenly heated by the applied current. Therefore each microgripper is actuated inwards and can hold a micro object. The fabricated E-T actuator was operated in the range of $2{\sim}12V$ and $1{\sim}5mA$. and maximum tip displacement was $13.6{\mu}m$. This device may become useful in many applications because an E-T actuator can be designed and fabricated easily, and obtain large displacement.

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Microcantilever-based biosensor using the surface micromachining technique (표면 미세 가공기술을 이용한 마이크로 캔틸레버의 제작과 바이오션서로의 응용)

  • Yoo, Kyung-Ah;Joung, Seung-Ryong;Kang, Chi-Jung;Kim, Yong-Sang
    • Proceedings of the KIEE Conference
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    • 2005.07c
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    • pp.2407-2409
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    • 2005
  • 본 논문에서는 다양한 생물분자 감지를 위한 센서로 마이크로캔틸레버를 제안하였고 이것을 이용해 여러 생물 분자들을 광학적, 전기적으로 분석하였다. 마이로캔틸레버는 표면 미세 가공 기술로 제작되었고, 이러한 제작 방식은 공정이 간단하고 비용이 적게 들며 센서 array가 가능하다는 장점을 갖는다. 생물분자를 포함하는 용액을 주입하기 위하여 PDMS와 fused silica glass를 이용해 fluid cell system을 제작하였다. 마이크로캔틸레버 상단의 gold가 코팅된 부분에서 생물분자의 자기조립 (self assembly)현상이 일어나고 이는 마이크로캔틸레버 상, 하단의 표면 스트레스 차이를 야기 시킨다. 이로 인해 마이크로캔틸레버 자체의 휘어짐 현상이 일어나게 되고 이러한 휘어진 정도를 측정함으로써 마이크로캔틸레버의 생물분자 감지능을 확인할 수 있었다. Cystamine dihydrochloride와 glutaraldehyde 분자를 분석하였고 각기 다른 농도의 cystamine dihydrochloride 용액에서도 실험함으로써 농도별 감지능 또한 확인하였다. 이러한 생물분자 감지를 위한 마이크로캔틸레버의 센서로써의 성능은 u-TAS 와 lab-on-a-chip에서 유용히 이용될 수 있으리라 확신한다.

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