• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.3
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• pp.356-363
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• 2013

Mechanical molding press which is used for transformation process during semiconductor manufacturing process has structural deformations by pressure. If these deformations have over limit range, life of the press itself can be reduced and it will be exerted on a bad effect for quality of the semiconductor. In this research, the main plates and links of a press are analyzed in relation to the structural deformations caused by pressure excluding thermal deformations. After modifying the modeling, the analysis is performed again to determine optimal design of the press, and this design is introduced to ensure that most of the stresses on the main plates are within safe allowable limits. As a result, an optimal design method for the structure is investigated to produce the desired pressure even when the size of the main structure is minimized.

• Design & Manufacturing
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• v.1 no.1
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• pp.33-37
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• 2007

In recent, the demand of high-productivity injection mold increases because of the growth of international packaging market. The increase of productivity leads to the large-sized injection molding machine and peripheral devices. For solving this problem, the stack mold which is based on the existing machine and device is studied in advanced countries actively. In this study, as the preliminary research of stack mold development, the stack mold which has 2 Level ${\times}4$ Cavity is designed and manufactured. Besides, the motion and structural analysis are executed to verify the stability of developed stack mold.

• Journal of the Korean Society of Industry Convergence
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• v.16 no.4
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• pp.133-140
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• 2013

This paper presents an overview of the concepts of optimal feeder design in relation to the loading of bulk solids for Automatic filling system that should be control the amount of goods and packaging to seal. Feeder modular device, important parts of the package, so in order to perform a conceptual design optimization techniques are applied in two steps. First of all derive the problems through structural analysis for the conceptual model of vibrating feeder. Secondly derive reasonable design model based on the results of the structural analysis of modified boundary shape and then verify it. The proposed system has the following goal that is satisfies the dynamic stability with minimum weight and optimization of the shape. As a result, the weight reduction of feeder is 2.1% and 7% increase in the natural frequency.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.4
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• pp.17-22
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• 2009

Two different organic-inorganic hybrid thin film transistors (OITFTs) with the structures of glass/ITO/ZnO/PMMA/Al (staggered structure) and glass/ITO/PMMA/ZnO/Al (inverted staggered structure), were fabricated and their electrical and structural properties were compared. The ZnO thin films used as active channel layers were deposited by the atomic layer deposition (ALD) method at a temperature of $100^{\circ}C$. To investigate the effect of the substrates on their properties, the ZnO films were deposited on bare glass, PMMA/glass and ITO/glass substrates and their crystal properties and surface morphologies were analyzed. The structural properties of the ZnO films varied with the substrate conditions. The ZnO film deposited on the ITO/glass substrate showed better crystallinity and morphologies, such as a higher preferred c-axis orientation, lower FWHM value and larger particle size compared with the one deposited on the PMMA/glass substrate. The field effect mobility ($\mu$), threshold voltage ($V_T$) and $I_{on/off}$ switching ratio for the OITFT with the staggered structure were about $0.61\;cm^2/V{\cdot}s$, 5.5 V and $10^2$, whereas those of the OITFT with the inverted staggered structure were found to be $0.31\;cm^2/V{\cdot}s$, 6.8 V and 10, respectively. The improved electrical properties for the staggered OITFTs may originate from the improved crystal properties and larger particle size of the ZnO active layer.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.2
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• pp.55-59
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• 2003

In this study, $Al_xTa_{1-x}$(x=0.0∼1.0) alloy thin films were grown by RF-Magnetron sputtering system, and the structural, mechanical and electrical properties of samples were examined by 4-point probe, XRD, AFM and micro-Vickers hardness profiler. The electrical resistivity was maximum and the crystal quality was optimum for the samples with Al content x=0.245 (Al 24.5 at.%). Regarding the surface hillock formation, the hillock density decreased with an increase of Al content for the low Al content range, and the hillock was eliminated for the sample with Al=24.5 at.%. The hillock density increased with the further increase of Al content. The high values of micro-Vickers hardness were obtained for the samples with x=0.2∼0.45. The results obtained demonstrate that the crystal quality, electrical resistivity, surface morphology and micro-hardness are closely inter-related, and that the optimum physical properties are obtained for the sample with x=0.245.

• The Journal of the Korea Contents Association
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• v.16 no.1
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• pp.42-51
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• 2016

For changes in the distribution structure these days, consumer demand is moving rapidly from offline to online. The consumers' mentality to purchase products conveniently is reflected in this phenomenon. Also for agricultural products, safety to protect contents, brand and design which can provide credibility to consumers are recognized as most important than ever. Especially, strawberry is thin-skinned so that the quality of product may deteriorate even with weak impact and shaking, so it is significantly influenced by the structural packaging or material. Also, strawberry is frequently distributed through direct trading, it is the reality that the package design of strawberry is less competitive than that of other products due to inadequate environments of commercial farms. That is, the demand of strawberry increases everyday but the strawberry package cannot fulfill the needs of producers and consumers. In order to reinforce competitiveness in strawberry sales, it is urgent to carry out fundamental studies regarding the development of package. Therefore, the purpose of this study is to supplement and improve issues arising from the usage of current strawberry package. Through the analysis of strawberry package elements (shape, material, design) and understand the points of improvement sought by producers and consumers through IPA MAP (importance, satisfaction level) analysis.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.9-17
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• 2018

Aluminum (Al) and its alloys have been used widely in a variety of industries such as structural, electronic, aerospace, and particularly automotive industries due to their lightweight characteristic, outstanding ductility, formability, high oxidation and corrosion resistance, and high thermal and electrical conductivity. Al have different kinds of alloys according to the various additional elements system and they should be selected properly depending on their effectiveness and suitability for their particular purpose. The major elements for Al alloys are silicon (Si), magnesium (Mg), manganese (Mn), copper (Cu), and zinc (Zn). In order for Al alloys to use for each industry, it is necessary to study of Al to Al joining and/or the Al to dissimilar materials joining to combine the individual parts into one. Many studies on joining technologies about Al to Al and Al to dissimilar materials have been performed such as press joining, bolted joint, welding, soldering, riveting, adhesive bonding, and brazing. This study reviews a variety of Al alloys and their joining method including its principles and properties with recent trends.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.41-45
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• 2015

RtMLF (Routable Molded Lead Frame) based on molded substrate has been developed to maximize advantages of both leadframe product which has high thermal and electrical performance and laminate product which accommodates more I/O count and keeps fan-in/fan-out design flexibility. Due to its structural features, RtMLF provided excellent thermal and electrical performance which was confirmed with simulation. The RtMLF samples were manufactured and its reliability analysis was done to evaluate the opportunities of the production and application.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.19-24
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• 2016

Along the few nano sizing dimensions of integrated circuit (IC) devices, acceptable interlayer material for design is inevitable. The interlayer which include dielectric, interconnect, barrier etc. needs to achieve not only electrical properties, but also mechanical properties for endure post manufacture process and prolonging life time. For developing intermetallic dielectric (IMD) the mechanical issues with post manufacturing processes were need to be solved. For analyzing specific structural problem and material properties Raman spectroscopy was performed for various researches in Si semiconductor based materials. As improve of the laser and charge-coupled device (CCD) technology the total effectiveness and reliability was enhanced. For thin film as IMD developed material could be analyzed by Raman spectroscopy, and diverse researches of developing method to analyze thin layer were comprehended. Also In-situ analysis of Raman spectroscopy is introduced for material forming research.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.61-67
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• 2004

The structural, electrical properties of the electrolytic capacitors were examined. By the addition of additives to hydrochloric acid solution increased the dielectric aluminum surface layer. For etch tunnels formed in hydrochloric acid, the away and density of the tunnels was not uniform, while for those formed in hydrochloric acid with additives the distribution presented relative uniformity. When the etched surface formed in hydrochloric acid with $5\%$ ethylene glycol, the enlargement of specific surface area was more effective.